1. A semiconductor device comprising:
a first semiconductor chip comprising a plurality of memory devices including a first memory device and a second memory device, the first semiconductor chip comprising a through electrode formed in a memory cell array of the second memory device, and a redistribution line connecting a chip pad of the first memory device to the through electrode; and
a second semiconductor chip face to face stacked on the first semiconductor chip and corresponding to the first semiconductor chip via the through electrode.
2. The semiconductor device of claim 1, wherein the first semiconductor chip comprises a scribe line between two of the plurality of memory devices.
3. The semiconductor device of claim 2, the redistribution line passes over the scribe line.
4. The semiconductor device of claim 1, wherein the plurality of memory devices comprises a plurality of first memory devices.
5. The semiconductor device of claim 4, wherein the second memory device includes a defect.
6. The semiconductor device of claim 4, wherein each of the first memory devices include a first chip pad connected to a corresponding first through electrode formed in the memory cell array of the second memory device.
7. The semiconductor device of claim 6, wherein a corresponding first redistribution line connects each first chip pad of each of the corresponding first memory devices to the corresponding first through electrode of the second memory device.
8. The semiconductor device of claim 4, further comprising:
a substrate on which the first semiconductor chip is mounted; and
a third semiconductor chip that is arranged to correspond to one of the first memory devices of the first semiconductor chip and electrically connected to the substrate and the second semiconductor chip.
9. The semiconductor device of claim 8, further comprising a plurality of third semiconductor chips each arranged to correspond to a corresponding one of the first memory devices and each comprising through electrodes.
10. The semiconductor device of claim 9, wherein each third semiconductor chip is connected to a corresponding through electrode of the second memory device by a corresponding redistribution line.
11. The semiconductor device of claim 1, further comprising a substrate where the first semiconductor chip is stacked thereon.
12. The semiconductor device of claim 11, further comprising:
a plurality of first pads and a plurality of second pads,
a plurality of first redistribution lines and a plurality of second redistribution lines, and
a plurality of first, second, and third through electrodes.
13. The semiconductor device of claim 12, wherein the first pads are electrically connected to the first through electrodes via the first redistribution lines, respectively, and the first pads provide voltage signals originating outside of the semiconductor device to the first memory devices via the substrate.
14. The semiconductor device of claim 13, wherein the second pads are electrically connected to the second semiconductor chip through second redistribution lines thereby providing a connection for write and read data from the second semiconductor chip to the first semiconductor chip.
15. The semiconductor device of claim 14, wherein the second semiconductor chip is electrically connected to the substrate via the second and third through electrodes such that processor electrical signals are provided to the second semiconductor chip through the substrate.
16. The semiconductor device of claim 11, further comprising a heat sink disposed above the second semiconductor chip.
17. The semiconductor device of claim 1, wherein the second memory device includes a plurality of through electrodes regularly distributed across the second memory device.
18. The semiconductor device of claim 1, wherein the second memory device includes a plurality of through electrodes distributed in a matrix pattern in the second memory device.
19. The semiconductor device of claim 1, wherein the second memory device includes a plurality of through electrodes in each of the memory cell array arrays of the second memory device.
20. A semiconductor device comprising:
a plurality of first memory devices, each first memory device including a side surface and a chip pad;
a second memory device including a side surface and a plurality of through electrodes formed in a one or more memory cell arrays of the second memory device; and
a processor chip on the second memory device,
wherein the side surface of each of the first memory devices is directly adjacent a corresponding side surface of the second memory device with a corresponding scribe line formed therebetween.
21. The semiconductor device of claim 20, further comprising:
a plurality of redistribution lines, each redistribution line connecting a chip pad of a corresponding first memory device to a corresponding through electrode of the second memory device,
wherein each redistribution line passes over a corresponding scribe line.
22. The semiconductor device of claim 21, further comprising;
a contact terminal between the processor chip and a first through electrode of the plurality of through electrodes, and
wherein the contact terminal directly contacts with the first through electrode.
23. The semiconductor device of claim 20, wherein the second memory device is defective.
24. The semiconductor device of claim 23, wherein the second memory device includes a manufacturing defect.
25. A semiconductor device comprising:
a substrate comprising a plurality of first circuit patterns on a first surface and a plurality of second circuit patterns on a second surface;
a first semiconductor chip comprising a plurality of memory devices arranged on the substrate in an m\xd7n matrix (where m or n is an integer equal to or greater than 2), the memory devices comprising first memory devices and a second memory device and wherein the first memory devices substantially surround at least a portion of the second memory device;
a second semiconductor chip stacked on the first semiconductor chip and corresponding to the at least a portion of the second memory device;
a plurality of through electrodes arranged on the second memory device and connecting the first and second semiconductor chips to the second circuit pattern of the substrate; and
wherein the plurality of through electrodes are formed in a memory cell array of the second memory device.
26. The semiconductor device of claim 25, wherein the plurality of through electrodes are not arranged on areas between the plurality of memory devices.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method, comprising:
providing a virtual object in a virtual reality world, the virtual object to receive a message from an avatar representing a resident of the virtual reality world;
determining a context of the message;
selecting an advertisement based on the context; and
presenting the advertisement via the virtual object, the presented advertisement including an embedded reference to be used to request for a connection for real time communications.
2. The method of claim 1, wherein the virtual reality world comprises a three dimensional model of a plurality of virtual objects; and the advertisement is presented in the virtual reality world based on a view point of the avatar in the virtual reality world.
3. The method of claim 1, wherein the reference comprises a telephone number of a connection provider without an extension, a telephone number with an extension of a connection provider, a session initiation protocol (SIP) uniform resource identifier (URI), or a voice over Internet protocol (VoIP) user identifier.
4. The method of claim 1, further comprising:
computing a distance between the virtual object and the avatar at a time the message is provided by the avatar; and
transmitting the message to the virtual object if the distance is shorter than a threshold.
5. The method of claim 4, wherein the message is to be transmitted to listeners within the threshold from the avatar.
6. The method of claim 1, wherein the message is in voice from a user of the avatar.
7. The method of claim 1, wherein the message is publicly displayed in the vicinity of the avatar; and the virtual object is configured to view a surrounding of the virtual object in the virtual world to obtain the message.
8. The method of claim 1, wherein the determining of the context of the message comprises extracting one or more keywords from the message.
9. The method of claim 1, further comprising:
obtaining from the avatar a data packet configured to be carried by the avatar to indicate characteristics or preferences of the resident;
wherein the selecting of the advertisement includes selecting according to the data packet.
10. The method of claim 1, wherein the message is received via an instant messaging facility integrated with the virtual reality world.
11. The method of claim 10, wherein the message comprises a question asked by the avatar or a keyword search request submitted by the avatar.
12. The method of claim 1, wherein the advertisement further includes a second reference which when selected causes the avatar to be teleported to a location that is determined after the second reference is selected.
13. The method of claim 1, further comprising:
in response to a selection of the reference embedded in the advertisement, providing a connection between the avatar and an advertiser of the advertisement for real time communications.
14. The method of claim 13, wherein the providing of the connection comprises:
a connection provider establishing a first Voice over Internet Protocol (VoIP) connection to reach the avatar;
the connection provider placing a second Voice over Internet Protocol (VoIP) call to a telecommunication carrier which bridges the second VoIP call to a public switched telephone network (PSTN) to the advertiser; and
connecting the first VoIP connection with the second VoIP call.
15. The method of claim 14, wherein the connecting of the first VoIP connection with the second VoIP call comprises establishing a media connection to connect the advertiser and the avatar; and wherein the media connection does not go through the connection provider.
16. The method of claim 13, wherein the providing of the connection comprises:
a connection provider establishing a first connection with the avatar and a second connection with the advertiser;
the connection provider bridging the first connection and the second connection.
17. The method of claim 16, wherein the connection provider bridging the first connection and the second connection comprises translating a message from a first language to a second language for transferring the message from the first connection to the second connection.
18. The method of claim 16, wherein the connection provider bridging the first connection and the second connection comprises converting a message between text and voice to bridge the first connection and the second connection.
19. A machine readable media embodying instructions, the instructions causing a machine to perform a method, the method comprising:
providing a virtual object in a virtual reality world, the virtual object to receive a message from an avatar representing a resident of the virtual reality world;
determining a context of the message;
selecting an advertisement based on the context; and
presenting the advertisement via the virtual object, the presented advertisement including an embedded reference to be used to request for a connection for real time communications.
20. A system, comprising:
a virtual reality server to host a virtual reality world and an avatar representing a participant of the virtual reality world, the virtual reality world including a virtual object to receive a message from an avatar;
a controller to determine a context of the message and select an advertisement based on the context for presentation via the virtual object, the presented advertisement including an embedded reference to be used to request for a connection for real time communications;
a session border controller to interface with a packet switched network; and
one or more telecommunication servers coupled to the session border controller to connect the avatar to an advertiser of the advertisement for real time communications in response to a user of the avatar selecting the reference.