1. A method for a device in a mobile communications network and which is inserted into a communication channel between a base station and a control unit in order to reduce the volume of data transmitted between the base station and the control unit, the method comprising:
by the device:
analyzing a voice data transmitted in a voice channel in each communication channel and associated with a plurality of connections, in addition to the voice data routed in a voice channel each connection also includes signaling data in at least one signaling channel, and
identifying from the analyzed voice data which connections originate from a first base station and terminate in the first or a second base station that are connected to the device;
interconnecting the voice channels of the identified connections in the device; and
preventing the voice data of the interconnected voice channels being transmitted to the control unit after the interconnection of the voice channels.
2. The method as claimed in claim 1, wherein the mobile communications network conforms to the GSM standard.
3. The method as claimed in claim 1, wherein the device is disposed in an aircraft.
4. The method as claimed in claim 1, wherein the device is disposed in a ship.
5. The method as claimed in claim 1, wherein the device is disposed at a physically remote location in the geographical sphere of action of the mobile communications system.
6. The method as claimed in claim 1, wherein the device applies the mathematical method of correlation analysis for analyzing the voice channels routed via the device.
7. A method for a mobile communications system to reduce the volume of data transmitted between a base station and a control unit, comprising:
providing a device inserted into a communication channel between a base station and a control unit;
analyzing a voice data transmitted in a voice channel in each communication channel and associated with a plurality of connections, in addition to the voice data routed in a voice channel each connection also includes signaling data in at least one signaling channel, and
identifying from the analyzed voice data which connections originate from a first base station and terminate in the first or a second base station that are connected to the device;
interconnecting the voice channels of the identified connections in the device; and
preventing the voice data of the interconnected voice channels being transmitted to the control unit after the interconnection of the voice channels.
8. The method as claimed in claim 7, wherein the mobile communications network conforms to the GSM standard.
9. The method as claimed in claim 7, wherein the device is disposed in an aircraft or a ship.
10. The method as claimed in claim 7, wherein the device is disposed at a physically remote location in the geographical sphere of action of the mobile communications system.
11. The method as claimed in claim 7, wherein the device applies the mathematical method of correlation analysis for analyzing the voice channels routed via the device.
12. A device for use in a mobile communications system, comprising:
a first voice channel connecting the device to a first base station, the first voice channel having a first voice transmission;
a second voice channel connecting the device to a second base station, the second voice channel having a second voice transmission;
a signaling channel connecting the device to the first base station, the signaling channel having signaling information;
a connection that transports the signaling information between control unit and the device;
a system identification that analyzes the first and second voice transmissions and identifies a connection originating from the first base station and terminating in the second base station; and
an interconnection of the first and second voice channels when the connection is identified to originate from the first base station and terminate in the second base station, such that the voice channels are connected via the device and not transmitted to the control unit, thereby preventing the voice data of the interconnected voice channels from being transmitted to the control unit.
13. The device as claimed in claim 12, further comprising a further signaling channel to the second base station.
14. The device as claimed in claim 12, wherein the first and the second base stations are the same base station.
15. The device as claimed in claim 12, wherein the device is disposed at a physically remote location in the geographical sphere of action of the mobile communications system.
16. The device as claimed in claim 12, wherein the device applies the mathematical method of correlation analysis for analyzing the voice channels routed via the device.
17. The method as claimed in claim 1, wherein the preventing includes stop transmitting voice data on interfaces from the device to the control unit, which are associated with the identified connections.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. Semiconductor module having:
a semiconductor device (10) having a contact device (11) for making electrical contact with a connection device (17; 20) via a rewiring device (15, 15\u2032, 15\u2033); and
a carrier device (12, 13, 14) for mechanically coupling the semiconductor device (10) to the connection device (17), the carrier device (12, 13, 14) having a gradient between a first modulus of elasticity at the semiconductor device (10) and a second, higher modulus of elasticity at the connection device (17; 20).
2. Semiconductor module according to claim 1,
characterized
in that the carrier device (12, 13, 14) has at least two non-conductive layers (12, 14) preferably three non-conductive layers (12, 13, 14).
3. Semiconductor module according to claim 1 or 2,
characterized
in that the gradient of the modulus of elasticity has a stepped or linear profile.
4. Semiconductor module according to claim 2 or 3,
characterized
in that a patterned or large-area, conductive layer (15\u2032, 15\u2033) is provided at least between two layers (12, 13, 14).
5. Semiconductor module according to one of the preceding claims,
characterized
in that a rewiring device (15, 15\u2032, 15\u2033) which is electrically conductively connected to the contact device (11) of the semiconductor device (10) is provided on andor within the carrier device (12, 13, 14).
6. Semiconductor module according to claim 4,
characterized
in that the connection device (17; 20) has elastic contact elevations (20), preferably with a contact tip, which are electrically contact-connected to the rewiring device (15).
7. Semiconductor module according to one of the preceding claims,
characterized
in that the connection device (17; 20) has solder balls, preferably for connection to a printed circuit board.
8. Semiconductor module according to one of the preceding claims,
characterized
in that the first modulus of elasticity of the carrier device (12, 13, 14) is less than 5 MPa and the second modulus of elasticity of the carrier device (12, 13, 14) is greater than 50 MPa.
9. Semiconductor module according to one of the preceding claims,
characterized
in that the carrier device (12, 13, 14) has silicone and also preferably epoxy resin as a covering layer, in particular with a patterned solder resist layer (16).
10. Semiconductor module according to one of the preceding claims,
characterized
in that the side areas of the carrier device (12, 13, 14) have a finite slope, preferably a slope of less than 4.
11. Semiconductor module according to one of the preceding claims,
characterized
in that the semiconductor device (10) is formed by a memory device, preferably a DRAM.
12. Method for producing a semiconductor module having the steps of:
applying a carrier device (12, 13, 14) to a semiconductor device (10) having a contact device (11);
applying a rewiring device (15) to the carrier device (12, 13, 14) with contact being made with the contact device (11) of the semiconductor device (10); and
applying a connection device (17; 20) to the carrier device (12, 13, 14) with electrical contact being made with the rewiring device (15),
the carrier device (12, 13, 14) having a gradient between a first modulus of elasticity at the semiconductor device (10) and a second, higher modulus of elasticity at the connection device (17; 20).
13. Method according to claim 12,
characterized
in that the production of the carrier device (12, 13, 14) has at least one printing step for applying at least one non-conductive layer (12, 13, 14).
14. Method according to claim 12 or 13,
characterized
in that in order to produce the carrier device (12, 13, 14), a plurality of non-conductive layers (12, 13, 14) are applied successively to the semiconductor device (10), which in each case have a smaller area than an underlying layer.
15. Method according to one of claims 12 to 14,
characterized
in that the gradient of the modulus of elasticity of the carrier device (12, 13, 14) is produced by introducing a rising proportion of filler in an elastic material, preferably silicone.