1. A material for gas turbines, consisting essentially of:
an alloy of any one or more intermetallic compounds selected from the group of Be12M, but Be13M if M is Zr, Be10M, and Be17M2, where M is any one or more metallic elements selected from the group of Ti, V, Mo, W, Zr, Nb and Ta.
2. The material for gas turbines as recited in claim 1, wherein the alloy includes a composite phase including any two or more selected from the group of Be12M, but Be13M if M is Zr, Be10M, and Be17M2.
3. The material for gas turbines as recited in claim 1, wherein an average content x of M satisfies 7.7<x<10.5 (at %), but 7.1<x<10.5 (at %) if M is Zr.
4. The material for gas turbines as recited in claim 2, wherein an average content x of M satisfies 7.7<x<10.5 (at %), but 7.1<x<10.5 (at %) if M is Zr.
5. A material for gas turbines, wherein the alloy is produced by mixing, smelting, and casting one or more metals M selected from the group of Ti, V, Zr, Nb, Ta, Mo, W and Y, with Be and unavoidable impurities as a balance in a range of an average content x of M satisfying 7.7<x<10.5 (at %), but 7.1<x<10.5 (at %) if M is Zr.
6. The material for gas turbines as recited in claim 5, wherein a homogenizing treatment and furnace cooling are accomplished after casting.
7. The material for gas turbines as recited in claim 1, wherein the alloy is produced by casting and an average grain size of the alloy is 50 \u03bcm or less.
8. The material for gas turbines as recited in claim 7, wherein the casting is accomplished by a unidirectional solidification.
9. The material for gas turbines as recited in claim 1, wherein the alloy is produced by powder metallurgy and an average grain size of the material is 50 \u03bcm or less.
10. The material for gas turbines as recited in claim 5, wherein the alloy is produced by casting and an average grain size of the alloy is 50 \u03bcm or less.
11. The material for gas turbines as recited in claim 5, wherein the casting is accomplished by a unidirectional solidification.
12. The material for gas turbines as recited in claim 5, wherein the alloy is produced by powder metallurgy and an average grain size of the material is 50 \u03bcm or less.
13. A gas turbine rotor blade comprising the material for gas turbines as recited in claim 1.
14. A gas turbine rotor blade comprising the material for gas turbines as recited in claim 5.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An assembly adapted for insertion in a bath of electroplating solution for an electroplating operation on a workpiece, the workpiece having formed therein a plurality of through holes, wherein each said through hole has a first end and a second end, comprising:
a workpiece holder adapted to hold said workpiece such that said first ends of said through holes of said workpiece permit said electroplating solution to fill said through holes when said assembly is inserted in said bath;
a conductive plating base positioned against a surface of said workpiece and having a portion that covers said second ends of said through holes and contacts the electroplating solution that fills said through holes when said assembly is inserted in said bath, wherein said conductive plating base is electrically accessible externally of said electroplating solution when said assembly is inserted in said bath to permit application of a voltage to said conductive plating base to conduct an electroplating operation in said bath; and
a compression apparatus coupled to said workpiece holder pressing said conductive plating base against said surface of said workpiece with said portion covering said second ends of said through holes.
2. The assembly of claim 1, wherein said electroplating operation fills said through holes with a solid conductive material, and wherein said workpiece is a connection layer substrate for a multi-layer semiconductor apparatus.
3. The assembly of claim 2, wherein said workpiece is one of a semiconductor die, a semiconductor wafer, and a printed circuit board, and wherein said solid conductive material forms vias in said through holes.
4. The apparatus of claim 3, wherein said conductive plating base is a sacrificial copper foil.
5. The assembly of claim 1, including a sealing apparatus that seals a further portion of said conductive plating base from contact with said electroplating solution when said assembly is inserted in said bath.
6. The apparatus of claim 5, wherein:
said workpiece holder includes a first plate and a second plate; and
said compression apparatus includes a fastening arrangement coupling said first and second plates of said workpiece holder, and wherein said workpiece, said conductive plating base and said sealing apparatus are disposed between said first and second plates.
7. The apparatus of claim 6, wherein said sealing apparatus includes a first seal adjacent said workpiece and having therein an opening aligned with said workpiece.
8. The apparatus of claim 7, wherein said sealing apparatus includes a second seal adjacent said conductive plating base, and wherein said conductive plating base and said workpiece are disposed between said first and second seals.
9. The apparatus of claim 8, wherein said first seal is adjacent said first plate, and wherein said first plate has formed therein an opening aligned with said opening in said first seal to permit said electroplating solution to fill said through holes when said assembly is inserted in said bath.
10. The apparatus of claim 7, wherein said first seal is adjacent said first plate, and wherein said first plate has formed therein an opening aligned with said opening in said first seal to permit said electroplating solution to fill said through holes when said assembly is inserted in said bath.
11. The apparatus of claim 6, wherein said first plate and said second plate of said workpiece holder, and said fastening arrangement of said compression apparatus are made of Polyvinylidene Fluoride (PVDF), and said sealing arrangement includes a Viton gasket.
12. A method of filling a plurality of through holes in a workpiece with a solid conductive material, comprising:
immersing the workpiece in an electroplating solution, with the through holes covered at one end by a portion of a conductive plating base; and
during said immersing,
permitting the electroplating solution to fill the through holes in the workpiece and contact said portion of the conductive plating base, and
applying a voltage to the conductive plating base to enable an electroplating operation that deposits the solid conductive material on said portion of the conductive plating base to thereby fill the through holes with the solid conductive material.
13. The method of claim 12, including preventing the electroplating solution from contacting a further portion of the conductive plating base.
14. The method of claim 13, including forcibly pressing said portion of the conductive plating base against the workpiece.
15. The method of claim 13, wherein said preventing includes sealing said further portion of the conductive plating base from the electroplating solution.
16. The method of claim 15, wherein said sealing includes forcibly pressing a first seal against the conductive plating base.
17. The method of claim 16, wherein said sealing includes forcibly pressing a second seal against the first seal.
18. The method of claim 15, including forcibly pressing said portion of the conductive plating base against the workpiece.
19. The method of claim 18, wherein said sealing includes forcibly pressing a first seal against the conductive plating base.
20. The method of claim 19, wherein said sealing includes forcibly pressing a second seal against the first seal.