1. A method for evaluating copper film quality comprising:
forming a cooper film on a substrate;
measuring hardness of said copper film;
annealing said copper film to produce an annealed copper film;
further measuring annealed hardness of said annealed copper film; and
evaluating conductivity of said annealed copper film based on said annealed hardness.
2. The method as in claim 1, further comprising evaluating effectiveness of said annealing by comparing a measured hardness of said copper film to a measured annealed hardness of said annealed copper film.
3. The method as in claim 2, wherein said evaluating further comprises estimating a change in average grain size of said copper film during said annealing.
4. The method as in claim 2, further comprising providing feedback to at least one of said annealing and a formation process used to form said copper film, based on at least one of said evaluating conductivity and said evaluating effectiveness.
5. The method as in claim 4, in which said providing feedback includes re-annealing said copper film.
6. The method as in claim 2, wherein at least one of said evaluating conductivity and said evaluating effectiveness further comprises establishing a correlation between copper film hardness and conductivity.
7. The method as in claim 2, wherein at least one of said evaluating conductivity and said evaluating effectiveness further comprises establishing a correlation between copper film hardness and grain size.
8. The method as in claim 1, wherein at least one of said measuring and said further measuring comprises using a probe that penetrates said copper film.
9. The method as in claim 1, wherein said annealing takes place at a temperature within the range of 150-250\xb0 C. and is carried out for 30-120 seconds.
10. The method as in claim 1, wherein said evaluating conductivity includes determining conductivity of said annealed copper film based on said annealed hardness and a thickness of said annealed copper film.
11. The method as in claim 1, wherein at least one of said measuring and said further measuring comprises measuring at least one of micro-hardness and nano-hardness.
12. The method as in claim 1, wherein at least one of said measuring and said further measuring comprises at least one of a Knoop hardness measurement and a Rockwell hardness measurement.
13. The method as in claim 1, wherein said measuring and said further measuring comprise measuring at a plurality of locations on said substrate.
14. The method as in claim 1, wherein said forming a copper film comprises depositing said copper film on a semiconductor substrate and further comprising using said annealed copper film as an interconnect in an active integrated circuit.
15. The method as in claim 1, further comprising patterning said copper film using damascene patterning methods including chemical mechanical polishing, prior to said measuring.
16. A method for evaluating copper film quality comprising:
forming a copper film on a semiconductor substrate;
measuring film hardness of said copper film; and
evaluating conductivity of said copper film based on said measuring.
17. The method as in claim 16, further comprising:
annealing said copper film after said measuring to produce an annealed copper film;
measuring an annealed film hardness;
evaluating conductivity of said annealed copper film based on measured annealed film hardness; and
evaluating anneal effectiveness by comparing said measured annealed film hardness to said measured film hardness.
18. The method as in claim 16, wherein said evaluating conductivity of said copper film is further based on a thickness of said copper film.
19. The method as in claim 17, wherein at least one of said measuring film hardness and said measuring an annealed film hardness comprise measuring with a nano-hardness tester.
20. The method as in claim 16, wherein said evaluating further comprises establishing a correlation between copper film hardness, grain size and conductivity, as a function of said thickness.
21. The method as in claim 1, wherein said copper film is not cold rolled.
22. The method as in claim 1, wherein said forming comprises one of sputtering, evaporation, and electroplating.
23. The method as in claim 1, wherein said forming a copper film comprises forming a copper film to a thickness within the range of 1000 to 2500 angstroms.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A hip hemiarthroplasty device for complete replacement of a femoral head in a subject or replacement of an articular surface of the femoral head of the subject, comprising:
a femoral component having a distal end and a proximal end, the distal end inserted and anchored in a reamed femoral canal in the subject, said femoral component expandable to fill the spatial confines of said reamed femoral canal;
a femoral head component with a smooth surface attached to the proximal end of the femoral component, the femoral head component containing a deflated balloon; and
the hip hemiarthroplasty device having a deflated position and an inflated position, wherein
the deflated position occurs when the hip hemiarthroplasty device is collapsed into a compact position suitable for insertion into the reamed femoral canal, and
the inflated position occurs when the deflated balloon has been inflated with a molding within the subject to expand within a reamed femoral neck and to form an inflated balloon that resembles the femoral head of the subject, such that the inflated balloon can completely replace the femoral head of the subject.
2. The hip hemiarthroplasty device of claim 1, further comprising an external sleeve attached to a flexible rod to guide the femoral component within the reamed femoral canal of the subject, wherein the external sleeve is disposed adjacent to the femoral component.
3. The hip hemiarthroplasty device of claim 1, further comprising
an insertion sleeve surrounding the deflated balloon;
a guiding string attached to the insertion sleeve, wherein a force is applied to the guiding string to guide the femoral head component within an acetabulum of the subject.
4. The hip hemiarthroplasty device of claim 1, further comprising a trajectory guidance tube adjacent to the hip hemiarthroplasty device to guide the femoral component down the reamed femoral canal.
5. The hip hemiarthroplasty device of claim 1, wherein the femoral component and the femoral head component further include radioopaque markers to indicate positioning within the subject.
6. The hip hemiarthroplasty device of claim 1, wherein the external sleeve is collapsible to allow complete inflation of the femoral component with the molding.
7. The hip hemiarthroplasty device of claim 1, wherein the compact position is the hip hemiarthroplasty device rolled lengthwise into a slimmer form.