1. A semiconductor device containing a semiconductor chip, comprising:
a first circuit arranged in a center of said semiconductor chip and configured to operate at a first voltage;
a second circuit arranged in an inputoutput circuit area around said first circuit on said semiconductor chip, and configured to operate at the first voltage and a second voltage and to transfer a signal between an external unit outside said semiconductor chip and said first circuit;
a control signal line provided in said inputoutput circuit area on said semiconductor chip; and
a terminal connected with said control signal line and supplied with a control signal,
wherein said second circuit stops a transfer of the signal between the external unit and said first circuit in response to said control signal which is transferred on said control signal line.
2. The semiconductor device according to claim 1, further comprising:
at least one relay buffer provided in a middle portion of said control signal line.
3. The semiconductor device according to claim 2, wherein said relay buffer is provided in a corner section of said semiconductor chip.
4. The semiconductor device according to claim 1, wherein said second circuit comprises:
at least one of a plurality of input circuits and a plurality of output circuits, provided in a partial peripheral portion around said first circuit, and
said at least one of said plurality of input circuits and said plurality of output circuits is collectively controlled in response to said control signal.
5. The semiconductor device according to claim 1, wherein said second circuit comprises:
at least one of a plurality of input circuits and a plurality of output circuits, provided in a full peripheral portion around said first circuit, and
said at least one of said plurality of input circuits and said plurality of output circuits is collectively controlled in response to said control signal.
6. The semiconductor device according to claim 1, wherein said second circuit comprises:
at least one of a plurality of input circuits and a plurality of output circuits, provided in a peripheral portion around said first circuit, and
said at least one of said plurality of input circuits and said plurality of output circuits prevents a leak current therein.
7. A semiconductor device containing a semiconductor chip, comprising:
a first circuit arranged in a center of said semiconductor chip and configured to operate at a first voltage;
a second circuit arranged in an inputoutput circuit area around said first circuit on said semiconductor chip, and configured to operate at the first voltage and a second voltage and to transfer a signal between an external unit outside said semiconductor chip and said first circuit;
a control signal line provided in said inputoutput circuit area on said semiconductor chip; and
a voltage detecting circuit configured to detect whether supply of said first voltage is stopped and to supply a control signal onto said control signal line when the supply of said first voltage is stopped,
wherein said second circuit stops a transfer of the signal between the external unit and said first circuit in response to said control signal which is transferred on said control signal line.
8. The semiconductor device according to claim 7, further comprising:
at least one relay buffer provided in a middle portion of said control signal line.
9. The semiconductor device according to claim 8, wherein said relay buffer is provided in a corner section of said semiconductor chip.
10. The semiconductor device according to claim 7, wherein said second circuit comprises:
at least one of a plurality of input circuits and a plurality of output circuits, provided in a partial peripheral portion around said first circuit, and
said at least one of said plurality of input circuits and said plurality of output circuits is collectively controlled in response to said control signal.
11. The semiconductor device according to claim 7, wherein said second circuit comprises:
at least one of a plurality of input circuits and a plurality of output circuits, provided in a full peripheral portion around said first circuit, and
said at least one of said plurality of input circuits and said plurality of output circuits is collectively controlled in response to said control signal.
12. The semiconductor device according to claim 7, wherein said second circuit comprises:
at least one of a plurality of input circuits and a plurality of output circuits, provided in a peripheral portion around said first circuit, and
said at least one of said plurality of input circuits and said plurality of output circuits prevents a leak current therein.
13. An electronic apparatus comprising:
a semiconductor device containing a semiconductor chip; and
a power control unit arranged outside said semiconductor device and configured to control application of a first voltage to said semiconductor device,
wherein said semiconductor device comprises:
a first circuit arranged in a center of said semiconductor chip and configured to operate at the first voltage;
a second circuit arranged in an inputoutput circuit area around said first circuit on said semiconductor chip, and configured to operate at the first voltage and a second voltage and to transfer a signal between an external unit outside said semiconductor chip and said first circuit; and
a control signal line provided in said inputoutput circuit area on said semiconductor chip, and
said second circuit stops a transfer of the signal between the external unit and said first circuit in response to said control signal which is transferred on said control signal line.
14. The electronic apparatus according to claim 13, wherein said semiconductor device further comprises:
at least one relay buffer provided in a middle portion of said control signal line.
15. The electronic apparatus according to claim 14, wherein said relay buffer is provided in a corner section of said semiconductor chip.
16. The electronic apparatus according to claim 13, wherein said power control circuit applies the first voltage to said semiconductor device when said semiconductor device needs to operate and stops the supply of the first voltage to said semiconductor device when said semiconductor device needs not operate, and
said semiconductor device further comprises:
a detecting circuit configured to detect the application of the first voltage and to output said control signal to said control signal line when the first voltage is not applied.
17. The electronic apparatus according to claim 13, wherein said power control circuit supplies said control signal to semiconductor device and then stops of the application of the first voltage to said semiconductor device when said semiconductor device needs not operate and applies the first voltage to said semiconductor device and then stops the supply of said control signal to said semiconductor device when said semiconductor device needs to operate.
18. The electronic apparatus according to claim 13, wherein said second circuit comprises:
at least one of a plurality of input circuits and a plurality of output circuits, provided in a partial peripheral portion around said first circuit, and
said at least one of said plurality of input circuits and said plurality of output circuits is collectively controlled in response to said control signal.
19. The electronic apparatus according to claim 13, wherein said second circuit comprises:
at least one of a plurality of input circuits and a plurality of output circuits, provided in a full peripheral portion around said first circuit, and
said at least one of said plurality of input circuits and said plurality of output circuits is collectively controlled in response to said control signal.
20. The electronic apparatus according to claim 13, wherein said second circuit comprises:
at least one of a plurality of input circuits and a plurality of output circuits, provided in a peripheral portion around said first circuit, and
said at least one of said plurality of input circuits and said plurality of output circuits prevents a leak current therein.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A computer-readable medium having instructions stored thereon that, when executed by a processor, cause the processor to automatically convert an input into one or more haptic effects in near real-time, the automatic converting comprising:
sensing the input in near-real time;
automatically converting the sensed input into one or more haptic signals in near-real time; and
generating the one or more haptic effects based on the one or more haptic signals.
2. The computer-readable medium of claim 1, the automatic converting further comprising:
identifying one or more characteristics of the sensed input; and
modifying the one or more haptic signals based on the one or more identified characteristics.
3. The computer-readable medium of claim 2, wherein the modifying the one or more haptic signals further comprises:
modifying one or more haptic parameters of the one or more haptic signals to match the one or more identified characteristics.
4. The computer-readable medium of claim 3,
wherein the one or more characteristics of the sensed input comprises at least one of: an amplitude, a frequency, a duration, an envelope, a density, a magnitude, or a strength; and
wherein the one or more haptic parameters of the one or more haptic signals comprises at least one of: an amplitude haptic parameter, a frequency haptic parameter, a duration haptic parameter, an envelope haptic parameter, a density haptic parameter, a magnitude parameter, or a strength haptic parameter.
5. The computer-readable medium of claim 1, the automatic converting further comprising filtering the sensed input.
6. The computer-readable medium of claim 1, the automatic converting further comprising wirelessly transmitting the sensed input to a controller configured to perform the automatic converting.
7. The computer-readable medium of claim 1, wherein the generating the one or more haptic effects is performed by a wearable haptic device.
8. The computer-readable medium of claim 1, wherein the generating the one or more haptic effects further comprising sending the one or more haptic signals to one or more haptic output devices to generate the one or more haptic effects.
9. The computer-readable medium of claim 8, wherein at least one haptic output device of the one or more haptic output devices comprises an actuator.
10. The computer-readable medium of claim 1, wherein the input comprises audio data.
11. The computer-readable medium of claim 1, wherein the input comprises video data.
12. The computer-readable medium of claim 1, wherein the input comprises acceleration data.
13. A computer-implemented method for automatically converting an input into one or more haptic effects in near real-time, the computer-implemented method comprising:
sensing the input in near-real time;
automatically converting the sensed input into one or more haptic signals in near-real time; and
generating the one or more haptic effects based on the one or more haptic signals.
14. The computer-implemented method of claim 13, further comprising:
identifying one or more characteristics of the sensed input; and
modifying the one or more haptic signals based on the one or more identified characteristics.
15. The computer-implemented method of claim 14, wherein the modifying the one or more haptic signals further comprises:
modifying one or more haptic parameters of the one or more haptic signals to match the one or more identified characteristics.
16. The computer-implemented method of claim 15,
wherein the one or more characteristics of the sensed input comprises at least one of: an amplitude, a frequency, a duration, an envelope, a density, a magnitude, or a strength; and
wherein the one or more haptic parameters of the one or more haptic signals comprises at least one of: an amplitude haptic parameter, a frequency haptic parameter, a duration haptic parameter, an envelope haptic parameter, a density haptic parameter, a magnitude parameter, or a strength haptic parameter.
17. The computer-implemented method claim 13, the automatic converting further comprising filtering the sensed input.
18. A system for automatically converting an input into one or more haptic effects in near real-time, the system comprising:
a memory configured to store an automatic haptic conversion module; and
a processor configured to execute the automatic haptic conversion module stored on the memory;
wherein the automatic haptic conversion module is configured to sense the input in near-real time;
wherein the automatic haptic conversion module is further configured to automatically convert the sensed input into one or more haptic signals in near-real time; and
wherein the automatic haptic conversion module is further configured to generate the one or more haptic effects based on the one or more haptic signals.
19. The system of claim 18,
wherein the automatic haptic conversion module is further configured to identify one or more characteristics of the sensed input; and
wherein the automatic haptic conversion module is further configured to modify the one or more haptic signals based on the one or more identified characteristics.
20. The system of claim 19,
wherein the automatic haptic conversion module is further configured to modify one or more haptic parameters of the one or more haptic signals to match the one or more identified characteristics.
21. The system of claim 20,
wherein the one or more characteristics of the sensed input comprises at least one of: an amplitude, a frequency, a duration, an envelope, a density, a magnitude, or a strength; and
wherein the one or more haptic parameters of the one or more haptic signals comprises at least one of: an amplitude haptic parameter, a frequency haptic parameter, a duration haptic parameter, an envelope haptic parameter, a density haptic parameter, a magnitude parameter, or a strength haptic parameter.
22. The system of claim 18, wherein the automatic haptic conversion module is further configured to filter the sensed input.