1. An exposure apparatus for exposing a substrate to exposure light via an original, said apparatus comprising:
a reflector which includes a multilayer film and a ruthenium film, and is configured to reflect the exposure light, said multilayer film reflecting the exposure light, and said ruthenium film being arranged on said multilayer film;
a vacuum container configured to contain said reflector;
an exhauster configured to exhaust gas in said vacuum container; and
a regulator configured to supply water vapor into said vacuum container and configured to regulate an amount of the water vapor in said vacuum container, based on an amount of carbonaceous gas in said vacuum chamber, so as to retard oxidation of said ruthenium film.
2. An apparatus according to claim 1, wherein said regulator is further configured to supply at least one of hydrocarbon and alcohol into said vacuum container, and to regulate an amount of the at least one of the hydrocarbon and the alcohol in said vacuum container.
3. An apparatus according to claim 2, wherein said regulator is configured to regulate a pressure of the at least one of the hydrocarbon and the alcohol in said vacuum container to a value not less than 1\xd710\u221210 Pa and not greater than 1\xd710\u22126 Pa.
4. An apparatus according to claim 1, further comprising an irradiator configured to irradiate said reflector with vacuum ultraviolet light.
5. An apparatus according to claim 1, wherein said regulator is configured to regulate a pressure of the water vapor in said vacuum container to a value not less than 1\xd710\u22126 Pa and not greater than 1\xd710\u22122 Pa.
6. An apparatus according to claim 1, wherein the exposure light includes extreme ultraviolet light.
7. A method of manufacturing a device, said method comprising:
exposing a substrate to exposure light using an exposure apparatus as defined in claim 1;
developing the exposed substrate; and
processing the developed substrate to manufacture the device.
8. An exposure method of exposing a substrate to exposure light via an original, said method comprising:
exhausting gas in a vacuum container which contains a reflector that includes a multilayer film and a ruthenium film, and reflects the exposure light, the multilayer film reflecting the exposure light, and the ruthenium film being arranged on the multilayer film;
supplying water vapor into the vacuum container; and
regulating an amount of the water vapor in the vacuum container, based on an amount of carbonaceous gas in the vacuum container, so as to retard oxidation of the ruthenium film.
9. An exposure apparatus for exposing a substrate to exposure light via an original, said apparatus comprising:
a reflector including a multilayer film and a ruthenium film, and configured to reflect the exposure light, said multilayer film reflecting the exposure light, and said ruthenium film being arranged on said multilayer film;
a vacuum container configured to contain said reflector;
an exhauster configured to exhaust gas in said vacuum container;
a detector configured to detect an amount of water vapor and an amount of carbonaceous gas in said vacuum container;
a supplier being capable of supplying both water vapor and carbonaceous gas into said vacuum chamber and being capable of supplying only one of the water vapor and the carbonaceous gas into said vacuum container; and
a controller configured to control said supplier, based on the amount of the water vapor and the amount of carbonaceous gas detected by said detector, a ratio between an amount of the water vapor and an amount of the carbonaceous gas in said vacuum container being regulated to a predetermined ratio, so as to retard oxidation of said ruthenium film.
10. An apparatus according to claim 9, further comprising a storage configured to store information of the predetermined relationship.
11. An apparatus according to claim 10, wherein said storage is configured to store information of the predetermined relationship with respect to each of a plurality of exposure conditions.
12. An apparatus according to claim 11, wherein the exposure conditions include an irradiation condition of the exposure light.
13. An apparatus according to claim 11, wherein the exposure conditions include energy of the exposure light.
14. An apparatus according to claim 9, wherein the carbonaceous gas includes at least one of the hydrocarbon and alcohol.
15. An apparatus according to claim 9, further comprising an irradiator configured to irradiate said reflector with vacuum ultraviolet light.
16. An apparatus according to claim 9, wherein the exposure light is extreme ultraviolet light.
17. A method of manufacturing a device, said method comprising:
exposing a substrate to exposure light using an exposure apparatus as defined in claim 9;
developing the exposed substrate; and
processing the developed substrate to manufacture the device.
18. An exposure method of exposing a substrate to exposure light via an original, said method comprising:
an exhaust step of exhausting gas in a vacuum container, which contains a reflector that includes a multilayer film and a ruthenium film, and reflects the exposure light, the multilayer film reflecting the exposure light, and the ruthenium film being arranged on the multilayer film;
a detection step of detecting an amount of water vapor and an amount of carbonaceous gas in the vacuum container; and
a supply step of supplying at least one of water vapor and a carbonaceous gas in the vacuum container, by controlling a supplier configured to supply both water vapor and carbonaceous gas into the vacuum container and being capable of supplying only one of water vapor and carbonaceous gas into the vacuum container, based on the amount of the water vapor and the amount of the carbonaceous gas detected in said detection step, so that a ratio between the amount of water vapor and the amount of carbonaceous gas in the vacuum container is regulated to a predetermined ratio, so as to retard oxidation of the ruthenium film.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A connector assembly comprising:
a conducting structure having a top section, a first flange at one side of said top section, a second flange at an opposite side of said top section, and a plurality of connector apertures in said top section, wherein said first flange and said second flange each comprise one or more legs, wherein each leg is physically configured to be seated into a first aperture pattern of a substrate; and
a plurality of connectors coupled to said structure, wherein each connector of said plurality of connectors comprises a first conductor electrically coupled to said structure, and a second conductor electrically isolated from said structure and extending through a respective connector aperture and configured to be coupled into a second aperture pattern of said substrate.
2. The connector assembly of claim 1, wherein said structure provides a common ground plane to said plurality of connectors.
3. The connector assembly of claim 1, wherein said connectors comprise BNC connectors.
4. The connector assembly of claim 1, wherein said top section of said structure further comprises a top face and a bottom face, with said first flange and said second flange extending outwards from said bottom face.
5. The connector assembly of claim 4, wherein said plurality of connector apertures extends from said top face to said bottom face of said top section.
6. The connector assembly of claim 4, wherein said first flange and said second flange extend perpendicular to said top section from respective edges of said top section.
7. The connector assembly of claim 1, wherein each leg is configured with a step surface for abutting said substrate when said leg is seated in said first aperture pattern.
8. The connector assembly of claim 7, wherein said step surface is configured to prevent a lower edge of a respective flange from abutting said substrate.
9. The connector assembly of claim 1, wherein at least one of said plurality of connectors is an input jack.
10. The connector assembly of claim 1, wherein at least one of said plurality of connectors is an output jack.
11. The connector assembly of claim 1, wherein at least one of said plurality of connectors is a video jack.
12. The connector assembly of claim 1, wherein at least one of said plurality of connectors is an audio jack.
13. The connector assembly of claim 1, wherein said plurality of connectors are distributed linearly along said structure.
14. The connector assembly of claim 1, wherein said plurality of connectors are distributed in a two-dimensional array along said structure.
15. The connector assembly of claim 4, wherein said second conductors extend through a spatial cavity defined by said top section, said first flange and said second flange.
16. A connector assembly for electronic equipment comprising:
a substrate having a first aperture pattern and a second aperture pattern formed thereon;
a conducting structure comprising a plurality of flanges having a plurality of legs seated in said first aperture pattern, and a top section having a plurality of connector apertures; and
a plurality of connectors coupled to said plurality of connector apertures in said top section of said conducting structure, each of said connectors comprising a first conductor isolated from said conducting structure and extending into said second aperture pattern and a second conductor coupled to said conducting structure.
17. The connector assembly of claim 16, wherein said subtrate is a printed circuit board.
18. The connector assembly of claim 16, wherein said legs and said first conductors are soldered to said substrate.
19. The connector assembly of claim 18, wherein said subtrate comprises one or more circuit traces electrically coupled to said first conductors.
20. The connector assembly of claim 18, wherein said substrate comprises one or more circuit traces electrically coupled to said legs.
21. The connector assembly of claim 16, wherein said plurality of connectors comprise BNC connectors.
22. The connector assembly of claim 16, wherein said structure provides a common ground plane for said plurality of connectors.
23. The connector assembly of claim 16, wherein said plurality of flanges extend from said top section, each of said flanges comprising one or more of said plurality of legs.
24. The connector assembly of claim 23, wherein said top section comprises a top face and a bottom face, wherein each of said plurality of apertures extends from said top face to said bottom face.
25. The connector assembly of claim 23, wherein one or more of said plurality of legs comprises a step surface abuting said substrate and defining a gap between a lower edge of a corresponding flange and said substrate.
26. The connector assembly of claim 25, further comprising one or more circuit traces on a surface of said substrate, wherein said traces pass through said gap.
27. A method for assembling an electronic device comprising:
providing a conducting structure having a top section and a plurality of flanges extending from said top section;
coupling a plurality of connectors to said top section of said structure to form a connector assembly. Wherein said structure is configured to act as a common ground for said plurality of connectors;
forming a pattern of apertures on a printed circuit board;
inserting said connector assembly into said pattern of apertures; and
affixing said connector assembly to said printed circuit board.
28. The method of claim 27, wherein coupling said plurality of connectors to said structure comprises:
electrically coupling a first conductor of each connector to said structure; and
extending a second conductor of each connector through said structure.
29. The method of claim 28, wherein said forming a pattern of apertures comprises:
forming a plurality of conductor apertures, wherein each of said conductor apertures is configured to receive a respective second conductor; and
forming a plurality of leg apertures configured to receive a plurality of legs of said structure.
30. The method of claim 29, wherein inserting said connector assembly comprises simultaneously inserting said second conductors into said plurality of conductor apertures and inserting said plurality of legs into said plurality of leg apertures.
31. The method of claim 30, wherein affixing said connector assembly to said printed circuit board comprises:
placing solder within one or more of said plurality of leg apertures and one or more of said plurality of conductor apertures.
32. A connector assembly for assembly with a printed circuit board having a plurality of leg apertures and a plurality of conductor apertures, said connector assembly comprising:
a rigid conducting bracket comprising a top section and a plurality of flanges;
said top section comprising a plurality of connector apertures;
said plurality of flanges comprising a plurality of legs, said legs each having a first surface configured to abut said PC board;
a plurality of connectors seated in said plurality of connector apertures, each of said connectors comprising:
an outer conductor electrically coupled to said bracket, said outer conductor having a hollow bore, said outer conductor extending through said aperture a majority of a first distance from said top section to said first surface; and
a signal conductor within said hollow bore, said signal conductor configured to be inserted into one of said conductor apertures when said plurality of legs are inserted into said plurality of leg apertures, said signal conductor extending beyond said first distance.
33. The connector assembly of claim 32, wherein a second distance between said end of said outer conductor and said first surface is equal to or less than 0.5 inches.
34. The connector assembly of claim 32, wherein said bracket comprises a common ground plane for said plurality of connectors.
35. The connector assembly of claim 34, wherein said plurality of legs are configured to couple to ground traces of said PC board.
36. The connector assembly of claim 32 wherein said first surface forms a step in each of said plurality of legs, which is configured to support a lower edge of at least one of said plurality of flanges away from said PC board.
37. The connector assembly of claim 32, wherein said plurality of connectors are distributed linearly in said bracket.