1. An apparatus comprising:
an electronic component body; and
one or more leads coupled to and extending from the electronic component body,
wherein a first lead of the one or more leads comprises a first leg and a second leg, the first leg and the second leg defining a first acute angle therebetween, the second leg comprising a first portion defining the first acute angle with the first leg, a second portion defining a second acute angle with the first portion, a third portion defining a first obtuse angle with the second portion, and a fourth portion defining a second obtuse angle with the third portion,
wherein the third portion is substantially parallel to the first leg,
wherein a length of the third portion that is substantially parallel to the first leg is substantially equal to a thickness of a substrate to which the electronic component body is to be mounted,
wherein a vertex of the first obtuse angle is to abut the substrate, and
wherein the substrate is to be disposed between the vertex and the electronic component body.
2. An apparatus according to claim 1, wherein the first lead is tin-coated.
3. A method comprising:
bending an electronic component body lead to form a first leg and a second leg, the first leg and the second leg defining a first acute angle therebetween; and
bending the second leg to form a first portion defining the first acute angle with the first leg, a second portion defining a second acute angle with the first portion, a third portion defining a first obtuse angle with the second portion, and a fourth portion defining a second obtuse angle with the third portion,
wherein the third portion is substantially parallel to the first leg,
wherein a vertex of the first obtuse angle is to abut the substrate,
wherein the substrate is to be disposed between the vertex and the electronic component body, and
wherein a length of the third portion that is substantially parallel to the first leg is substantially equal to a thickness of a substrate to which the electronic component body is to be mounted.
4. A method according to claim 3, further comprising:
electrically coupling the lead to an electronic component body.
5. A method according to claim 3, wherein the lead is attached to an electronic component body.
6. A method according to claim 3, wherein the electronic component body lead is tin-coated.
7. A method comprising:
placing a lead of an electronic component body into an opening of a substrate, wherein the lead comprises a first leg and a second leg defining a first acute angle therebetween, the second leg comprising a first portion defining the first acute angle with the first leg, a second portion defining a second acute angle with the first portion, a third portion defining a first obtuse angle with the second portion, and a fourth portion defining a second obtuse angle with the third portion,
wherein the third portion is substantially parallel to the first leg,
wherein a vertex of the first obtuse angle is to abut the substrate,
wherein the substrate is to be disposed between the vertex and the electronic component body, and
wherein a length of the third portion that is substantially parallel to the first leg is substantially equal to a thickness of the substrate.
8. A method according to claim 7, further comprising:
electrically coupling the lead to the substrate.
9. A method according to claim 7, wherein the lead of the electronic component body is tin-coated.
10. An expansion card comprising:
a circuit board;
a connector coupled to the circuit board, the connector to connect to a motherboard; and
an electronic component body coupled to the circuit board, the electronic component body comprising one or more leads coupled to and extending from the electronic component body,
wherein a first lead of the one or more leads comprises a first leg and a second leg, the first leg and the second leg defining a first acute angle therebetween, the second leg comprising a first portion defining the first acute angle with the first leg, a second portion defining a second acute angle with the first portion, a third portion defining a first obtuse angle with the second portion, and a fourth portion defining a second obtuse angle with the third portion,
wherein the third portion is substantially parallel to the first leg,
wherein a vertex of the first obtuse angle is to abut the substrate,
wherein the substrate is to be disposed between the vertex and the electronic component body, and
wherein a length of the third portion that is substantially parallel to the first leg is substantially equal to a thickness of the circuit board.
11. An expansion card according to claim 10, wherein the first lead is tin-coated.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A carpet strip, comprising:
a flat base;
a plurality of spikes extending through a lower surface of the base and protruding therefrom at an angle;
a resilient adhesive tape strip comprising two adhesive surfaces, the first adhesive surface permanently adhered to the lower surface of the base, the second adhesive surface covered with a removable protective film.
2. The carpet strip of claim 1, wherein the base is formed from wood.
3. The carpet strip of claim 1, wherein the base is formed from composite material.
4. The carpet strip of claim 1, wherein the base is formed from plastic.
5. The carpet strip of claim 1, wherein the base is formed from metal.
6. A process for manufacturing a carpet strip comprising the steps of:
forming a thin base of material comprising an upper surface and a lower surface;
installing spikes in the lower surface of the base such that the spikes extend through the base and protrude therefrom at an angle;
adhering double-sided adhesive tape to the lower surface of the base, the tape comprising a first and a second adhesive surface, the first adhesive surface adhered to the lower surface of the base, the second adhesive surface covered with a removable protective film;
compressing the base and tape together to affix the tape to the base.
7. The carpet strip of claim 6, wherein the forming the base of thin material step comprises forming the material into a strip.
8. The carpet strip of claim 6, further comprising the step of cutting the base into a plurality of individual strips.
9. The carpet strip of claim 6, wherein the first and second adhesive surfaces comprise rubber adhesive.
10. The carpet strip of claim 6, wherein the double-sided adhesive tape comprises closed cell crosslinked polyethylene foam.
11. The carpet strip of claim 10, wherein the tape is at least 132 inches thick.
12-17. (canceled)
18. The carpet strip of claim 6, further comprising the step of sealing the lower surface of the base with a protective sealant.
19. The carpet strip of claim 1, wherein the lower surface is coated with a protective sealant.
20. The carpet strip of claim 1, wherein the resilient adhesive tape strip comprises closed cell crosslinked polyethylene foam.