1. A system for analyzing hearing-related function in humans comprising:
a host processor having first and second personal computer memory card international association (PCMCIA) defined ports, said host processor including a memory system to store hearing aid programming instructions and hearing analysis instructions;
a first PCMCIA Card coupled to said first PCMCIA defined port, said first PCMCIA Card including first circuits interacting with said host processor to download said hearing aid programming instructions, and further including a first processor system coupled to said first circuits to execute said hearing aid programming instructions;
a second PCMCIA Card coupled to said second PCMCIA defined port, said second PCMCIA Card including second circuits interactive with said host processor to download said hearing-related analyzing instructions, and further including a second processor system coupled to said second circuits to execute said hearing-related analyzing instructions.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method comprising:
forming a plurality of photodiodes on a semiconductor substrate;
forming a color filter layer over the semiconductor substrate such that respective color filters of the color filter layer correspond to locations of respective photodiodes;
forming an overcoat layer over the color filter layer;
selectively removing portions of the overcoat layer to a prescribed thickness from a surface of the color filter layer to correspond to locations of the respective photodiodes to form trenches having a substantially rounded shape over corresponding photodiodes; and
forming microlenses, each having a convex lens shape, inside each of the trenches
wherein the forming microlenses comprises coating a resist on a surface of the trenches, selectively patterning the resist to form microlens patterns, and performing reflow on the microlens patterns at a prescribed temperature,
wherein the microlens patterns are formed only in the trench.
2. The method of claim 1, further comprising forming an interlayer insulating layer over the semiconductor substrate, and forming the color filter layer over the interlayer insulating layer.
3. The method of claim 2, wherein the interlayer insulating layer comprises at least one of a phosphosilicate glass layer, a borosilicate glass layer, and a borophosphosilicate glass layer.
4. The method of claim 1, wherein the overcoat layer comprises a transparent insulating layer.
5. The method of claim 4, wherein the overcoat layer comprises a low temperature oxide layer.
6. The method of claim 5, wherein the low temperature oxide layer is formed at a temperature of 300\xb0 C. or below.
7. The method of claim 5, further comprising decomposing a photo active compound remaining within the microlens patterns by performing a flood exposure to the microlens patterns.
8. The method of claim 4, wherein the overcoat layer is formed to have a thickness of 1000-6000 \u212b.
9. The method of claim 1, wherein the overcoat layer is removed using isotropic etching.
10. The method of claim 9, wherein the isotropic etching is wet etching.
11. The method of claim 1, wherein the prescribed temperature for the reflow on the microlens patterns is in a range of 150-300\xb0 C.
12. The method of claim 1, wherein the microlenses are substantially oblongly spherically shaped.
13. The method of claim 1, further comprising illuminating an ultraviolet light onto the microlenses.