1. A Light Emitting Diode (LED) package, comprising:
a Printed Circuit Board (PCB);
an LED mounted on the PCB;
a pillar placed higher than the LED around the LED on the PCB;
a transparent plate disposed on the pillar, spaced apart from the LED, and configured to transmit light emitted from the LED; and
a fluorescent layer formed on a surface of the transparent plate, facing the LED, and conformably coated with a substance for converting the light emitted from the LED into white light by changing a wavelength of the light,
wherein an electrical pad of the LED and an electrical pad of the PCB are electrically connected to each other, and the LED and the fluorescent layer are spaced apart from each other.
2. The LED package as claimed in claim 1, wherein the LED is disposed within an area corresponding to the fluorescent layer.
3. The LED package as claimed in claim 1, wherein the fluorescent layer includes silicon.
4. The LED package as claimed in claim 1, wherein the pillar reflects the light emitted from the LED in a direction of the LED when the light comes in contact with the pillar.
5. The LED package as claimed in claim 1, wherein a face of the pillar, facing the LED, is formed at a specific angle.
6. The LED package as claimed in claim 5, wherein the face of the pillar, facing the LED, is formed at an angle of about 15\xb0 to 90\xb0 to the PCB.
7. The LED package as claimed in claim 1, wherein the transparent plate is formed of a lens or a transparent substrate.
8. The LED package as claimed in claim 1, wherein a distance between the fluorescent layer and the LED is about 10 to 20,000 \u03bcm.
9. A Light Emitting Diode (LED) package, comprising:
a Printed Circuit Board (PCB);
a first LED mounted on the PCB;
a second LED mounted on the PCB and spaced apart from the first LED;
a pillar placed higher than the first LED and the second LED around the first LED and the second LED on the PCB;
a transparent plate disposed on the pillar, spaced apart from the first LED and the second LED, and configured to transmit light emitted from the first LED or the second LED; and
a fluorescent layer formed on a surface of the transparent plate, facing the first LED and the second LED, and conformably coated with a substance for converting the light emitted from the first LED or the second LED into white light by changing a wavelength of the light,
wherein an electrical pad of the first LED and an electrical pad of the PCB are electrically connected to each other, an electrical pad of the second LED and an electrical pad of the PCB are electrically connected to each other, and the first and second LEDs and the fluorescent layer are spaced apart from each other.
10. The LED package as claimed in claim 9, wherein the first LED and the second LED are disposed within an area corresponding to the fluorescent layer.
11. The LED package as claimed in claim 9, wherein the fluorescent layer includes silicon.
12. The LED package as claimed in claim 9, wherein the pillar reflects the light of the first LED or the second LED in a direction of the first LED or the second LED when the light comes in contact with the pillar.
13. The LED package as claimed in claim 9, wherein a face of the pillar, facing the first LED and the second LED, is formed at a specific angle.
14. The LED package as claimed in claim 13, wherein the face of the pillar, facing the first LED and the second LED, is formed at an angle of about 15\xb0 to 90\xb0 to the PCB.
15. The LED package as claimed in claim 9, wherein the transparent plate is formed of a lens or a transparent substrate.
16. The LED package as claimed in claim 9, wherein a distance between the fluorescent layer and the first LED and the second LED is about 10 to 20,000 \u03bcm.
17. A Light Emitting Diode (LED) package, comprising:
a Printed Circuit Board (PCB);
a first LED mounted on the PCB;
a second LED mounted on the PCB and spaced apart from the first LED;
a pillar placed higher than the first LED and the second LED around the first LED and the second LED on the PCB;
a transparent plate disposed on the pillar, spaced apart from the first LED and the second LED, and configured to transmit light emitted from the first LED or the second LED;
a first fluorescent layer formed on a surface of the transparent plate, facing the first LED and the second LED, and conformably coated with a substance for converting the light emitted from the first LED into white light by changing a wavelength of the light; and
a second fluorescent layer formed on the surface of the transparent plate, facing the first LED and the second LED, and conformably coated with a substance for converting the light emitted from the second LED into white light by changing a wavelength of the light;
wherein an electrical pad of the first LED and an electrical pad of the PCB are electrically connected to each other, an electrical pad of the second LED and the electrical pad of the PCB are electrically connected to each other, the first LED and the first fluorescent layer are spaced apart from each other, the second LED and the second fluorescent layer are spaced apart from each other, and the first fluorescent layer and the second fluorescent layer are spaced apart from each other.
18. The LED package as claimed in claim 17, wherein:
the first LED is disposed within an area corresponding to the first fluorescent layer; and
the second LED is disposed within an area corresponding to the second fluorescent layer.
19. The LED package as claimed in claim 17, wherein the first fluorescent layer or the second fluorescent layer includes silicon.
20. The LED package as claimed in claim 17, wherein the pillar reflects the light of the first LED or the second LED in a direction of the first LED or the second LED when the light comes in contact with the pillar.
21. The LED package as claimed in claim 17, wherein a face of the pillar, facing the first LED and the second LED, is formed at a specific angle.
22. The LED package as claimed in claim 21, wherein the face of the pillar, facing the first LED and the second LED, is formed at an angle of about 15\xb0 to 90\xb0 to the PCB.
23. The LED package as claimed in claim 17, wherein the transparent plate is formed of a lens or a transparent substrate.
24. The LED package as claimed in claim 17, wherein a distance between the first fluorescent layer and the first LED or a distance between the second fluorescent layer and the second LED is about 10 to 20,000 \u03bcm.
25. A method of manufacturing a Light Emitting Diode (LED) package, the method comprising the steps of:
mounting an LED on a Printed Circuit Board (PCB), having a pillar formed thereon, within the pillar;
electrically connecting an electrical pad of the PCB and an electrical pad of the LED;
disposing a transparent plate, configured to include a fluorescent layer conformably coated with a substance for converting light emitted from the LED into white light by changing a wavelength of the light, and to transmit the light emitted from the LED on the pillar so that the fluorescent layer faces the LED; and
attaching the transparent plate to the pillar.
26. A method of manufacturing a Light Emitting Diode (LED) package, the method comprising the steps of:
mounting an LED on a Printed Circuit Board (PCB) having a pillar formed thereon;
electrically connecting an electrical pad of the PCB and an electrical pad of the LED;
disposing a transparent plate, configured to include a fluorescent layer conformably coated with a substance for converting light emitted from the LED into white light by changing a wavelength of the light, and to transmit the light emitted from the LED on the pillar so that the fluorescent layer faces the LED;
measuring a wavelength of the light, emitted from the LED, after the light passes through the transparent plate;
checking whether the light passing through the transparent plate satisfies a specific criterion; and
if, as a result of the check, the light passing through the transparent plate satisfies the specific criterion, attaching the transparent plate to the pillar.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An ion exchange agent for adsorbing cations, said agent comprising charred material, wherein said charred material is not activated and is produced from living plant material that is not wood, having an ash content of at least 15% (by weight).
2. The agent of claim 1, wherein said material is foliage and said cations are heavy metal cations.
3. The agent of claim 1, wherein said charred material is produced from plant tissues that are less than one year old at said time of harvest.
4. The agent of claim 1, wherein said material is not wood or secondary xylem material.
5. The agent of claim 1, wherein said living material is metabolically active at the time of harvesting.
6. The agent of claim 1, wherein said material is nettle, beet, an algae or seaweed.
7. The agent of claim 6, wherein said plant is a macro algae or seaweed, selected from the group consisting of: bladder wrack (Fucus spp), oarweedskelp (Laminaria spp), thongweed (Hinanthalia spp) and sea lettuce (Ulva spp) .
8. The agent of claim 1, wherein said plant material is from an herbaceous plant or a crop.
9. The agent of claim 8, wherein said plant material is selected from the group consisting of: nettle (Urticae spp), dead nettle (Lamium spp), Chenopodiaceae.
10. The agent of claim 1, wherein said plant material is selected from the group consisting of cabbage, garlic, bracken, horsetail, rye grass and oil seed rape.
11. (canceled)
12. The agent claim 1, wherein said ash content of said charcoal is at least 20% (by weight).
13. The agent of claim 1, wherein said ash content of said charcoal is at least 25% (by weight).
14. The agent of claim 1, wherein said ash content of said charcoal is at least 30% (by weight).
15. The agent of claim 1, wherein said ash content of said charcoal is at least 35% (by weight)
16. The agent of claim 1, wherein said ash content of said charcoal is at least 40% (by weight).
17. The agent of claim 1, wherein said ash content of said charcoal is at least 45% (by weight).
18. The agent of claim 1, wherein said ash content of said charcoal is at least 50% (by weight).
19. The agent of claim 1, wherein K, Ca, Mg, Mn andor P make up at least 10% of said charcoal weight.
20. The agent of claim 1, wherein K, Ca, Mg, Mn andor P make up at least 15% of said charcoal weight.
21. The agent of claim 1, wherein K, Ca, Mg, Mn andor P make up at least 20% of said charcoal weight.
22. The agent of claim 1, wherein K, Ca, Mg, Mn andor P make up at least 25% of said charcoal weight.
23. The agent of claim 1, wherein K, Ca, Mg, Mn andor P make up at least 30% of said charcoal weight.
24. The agent of claim 1, wherein K, Ca, Mg, Mn andor P make up at least 35% of said charcoal weight.
25. The agent of claim 1, wherein K. Ca, Mg, Mn andor P make up at least 40% of said charcoal weight.
26. The agent of claim 1, wherein 0.5 g of charred material is capable of raising said pH of 100 ml deionised water to a pH of at least 10.
27. The agent of claim 1, wherein said charred material adsorbs cations from a selected environment.
28. The agent of claim 27, wherein said cations are selected from the group consisting of: ammonium, copper, zinc, lead, mercury, nickel, cadmium, mercury and aluminium.
29. The agent of claim 27, wherein said environment or area for treatment is soil or an aqueous waste, selected from waste water or sewage.
30. Animal bedding or clothing comprising an agent of claim 1.
31. A method for removing a cationic dye from a solution, said method comprising contacting an agent any of claim 1 with said solution.
32. A filter comprising an agent of claim 1.
33. A composting enhancer or accelerator comprising an agent of claim 1.
34. A cosmetic product comprising an agent of claim 1.
35. A plant growth medium comprising an agent of claim 1.
36. A method for the removal or binding of cationic species in an environment, said method comprising contacting said cationic species with an agent of claim 1.
37. The method of claim 36, wherein said cationic species is one or more metal species.
38. The method of claim 36, wherein said environment is soil, solid waste, a slurry or an aqueous waste.
39. The method of claim 36, wherein treatment of said environment is effected by trapping said agent in a vehicle and passing a liquid over or through said vehicle, thereby to contact said trapped charcoal and permit removal of some or all of said contaminating cations.
40. A method for treating or remediating an environment, comprising contacting said area with an agent of claim 1, and optionally subsequently removing said agent.
41. A method to raise the apparent pH of acidic soil toward pH 7, said method comprising contacting said soil with an agent of claim 1 in an amount and for a period sufficient to elevate said pH of said soil.
42. A process for providing an ion-exhange agent of claim 1, where living plant material containing non-exchangable ions is charred, thereby providing said an ion-exchange agent.
43. The ion exchange agent of claim 1, modified after charring, wherein naturally occurring potassium ions are replaced by other suitablecations selected from Calcium, Manganese Magnesium, or Hydrogen ions.