1. A piezoelectric actuated device comprising:
a frame;
a platform that can take on different angular displacements relative to the frame;
at least one flexure coupling the platform to the frame; and
piezoelectric material mechanically coupled to at least a portion of the frame, wherein the piezoelectric material has a non-uniform area density, wherein the device exhibits a desired structural Eigenmode of vibration that results in stress on the frame, and the non-uniform area density is related to the stress.
2. The piezoelectric actuated device of claim 1 wherein the area density is greater in areas of greater stress.
3. A piezoelectric actuated device comprising:
a frame;
a platform that can take on different angular displacements relative to the frame;
at least one flexure coupling the platform to the frame; and
piezoelectric material mechanically coupled to at least a portion of the frame, wherein the piezoelectric material has a non-uniform area density, wherein a plurality of areas of piezoelectric material are mechanically coupled to the frame, and wherein at least two of the plurality of areas of piezoelectric material have common electrical connections.
4. A piezoelectric actuated device comprising:
a frame;
a platform that can take on different angular displacements relative to the frame;
at least one flexure coupling the platform to the frame; and
piezoelectric material mechanically coupled to at least a portion of the frame, wherein the piezoelectric material has a non-uniform area density, wherein the piezoelectric material has a non-uniform thickness.
5. A piezoelectric actuated device comprising:
a frame;
a platform that can take on different angular displacements relative to the frame;
at least one flexure coupling the platform to the frame, wherein the device exhibits a desired structural Eigenmode of vibration that results in stress on the frame; and
piezoelectric material mechanically coupled to at least a portion of the frame, wherein the piezoelectric material is coupled to areas of greatest stress for the desired structural Eigenmode of vibration, wherein a plurality of areas of piezoelectric material are mechanically coupled to the frame, and wherein at least two of the plurality of areas of piezoelectric material have common electrical connections.
6. A method comprising:
depositing piezoelectric material on a frame coupled to a resonant scanning mirror; and
etching portions of the piezoelectric material to yield a non-uniform area density of piezoelectric material on the frame, wherein the non-uniform area density is related to stress exhibited by the frame in a desired Eigenmode.
7. A method comprising:
depositing piezoelectric material on a frame coupled to a resonant scanning mirror;
etching portions of the piezoelectric material to yield a non-uniform area density of piezoelectric material on the frame, wherein etching comprises etching to create multiple separate areas of piezoelectric material with non-uniform area density, and
electrically connecting the multiple areas in common.
8. A method comprising:
depositing piezoelectric material on a frame coupled to a resonant scanning mirror;
etching portions of the piezoelectric material to yield a non-uniform area density of piezoelectric material on the frame, wherein etching comprises etching to create multiple separate areas of piezoelectric material with non-uniform area density, and
electrically connecting a subset of the multiple areas in common.
9. A projection device comprising:
at least one laser light source; and
a piezoelectric actuated resonant scanning mirror assembly to reflect light from the at least one laser light source, wherein the resonant scanning mirror assembly includes a frame with piezoelectric material having a non-uniform area density, wherein the piezoelectric material has a non-uniform thickness.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A frequency synthesizer module with phase hits compensation, comprising:
an enclosure;
a frequency synthesizer housed within the enclosure; and
a heater module including a heater element in thermal communication with the frequency synthesizer and operative to produce heat to adaptively adjust temperature of the frequency synthesizer.
2. The frequency synthesizer module of claim 1 configured in a wireless radio system with an outdoor unit (ODU) and an indoor unit (IDU), wherein the frequency synthesizer is disposed in the ODU.
3. The frequency synthesizer module of claim 1, further comprising an insulating material disposed within a wall of the enclosure and the heater module.
4. The frequency synthesizer module of claim 3, wherein the insulating material wraps at least a portion of the heater module.
5. The frequency synthesizer module of claim 1, wherein the enclosure has electromagnetic shielding properties.
6. The frequency synthesizer module of claim 1, wherein the heater module is substantially electrically isolated from the frequency synthesizer.
7. The frequency synthesizer module of claim 1, wherein the heater module is positioned near or within the enclosure.
8. The frequency synthesizer module of claim 1, wherein the heater module further includes
a posistor having an impedance value adapted to vary based on temperature; and
a voltage regulator having an input pin adapted for receiving a varying input voltage, an output pin adapted for providing a modifiable output voltage to the heater element for adaptively adjusting the heat generated by the heater element based on the modifiable output voltage, and an adjust pin operatively coupled to the posistor for maintaining a substantially constant voltage at the adjust pin.
9. The frequency synthesizer module of claim 8, wherein, for adaptively adjusting the heat, the voltage regulator and posistor are configured to activate the heater element when the frequency synthesizer is below room temperature, to activate the heater element at less than maximum power when the frequency synthesizer is between about room temperature and a high-temperature threshold, and to substantially deactivate the heater element when the temperature is substantially at or above the high-temperature threshold.
10. The frequency synthesizer module of claim 9, wherein the high-temperature threshold is about 65\xb0 C.
11. The frequency synthesizer module of claim 2, operative to control one or more frequency converters in the ODU.
12. A method, comprising:
providing a frequency synthesizer housed in an enclosure;
providing a heater module having a heater element in thermal communication with the frequency synthesizer; and
using the heater module to generate heat and to adaptively adjust the temperature of the frequency synthesizer.
13. The method of claim 12, performed by a wireless radio with an outdoor unit (ODU) and an indoor unit (IDU), wherein the frequency synthesizer is disposed in the ODU.
14. The method of claim 12, wherein insulating material is disposed between a wall of the enclosure and the heater module.
15. The method of claim 14, wherein the insulating material wraps at least a portion of the heater module.
16. The method of claim 12, wherein the enclosure has electromagnetic shielding properties.
17. The method of claim 12, wherein the heater module is substantially electrically isolated from the frequency synthesizer.
18. The method of claim 12, wherein the heater module is positioned near or within the enclosure.
19. The method of claim 12, wherein the heater module further includes
a posistor having an impedance value adapted to vary with temperature; and
a voltage regulator having an input pin adapted for receiving a varying input voltage, an output pin adapted for providing a modifiable output voltage to the heater element for adaptively adjusting the heat generated by the heater element based on the modifiable output voltage, and an adjust pin operatively coupled to the posistor for maintaining a substantially constant voltage at the adjust pin.
21. The method of claim 20, further comprising configuring the voltage regulator and the posistor to activate the heater element, for adaptively adjusting the heat, when the frequency synthesizer is below room temperature, to activate the heater element at less than maximum power when the frequency synthesizer is between about room temperature and a high-temperature threshold, and to substantially deactivate the heater element when the temperature is substantially at the high-temperature threshold and above.
22. The method of claim 21, wherein the high-temperature threshold is about 65\xb0 C.
23. The method of claim 13, operative to control one or more frequency converters in the ODU.
24. A method comprising:
obtaining a frequency synthesizer having predetermined operating characteristics when within a predetermined temperature range;
obtaining a heater module with a heater element operative to adaptively generate heat based on ambient temperature; and
positioning the heater element in thermal communication with the frequency synthesizer to adaptively heat the frequency synthesizer to within the predetermined temperature range.
25. A wireless radio system, comprising:
an ODU including
a transmit frequency upconverter for upconverting an outgoing signal to a transmit frequency;
a receive frequency downconverter for downconverting an incoming signal from a receive frequency to a lower frequency; and
a frequency synthesizer module coupled to the transmit frequency upconverter and to the receive frequency downconverter, the frequency synthesizer module having
an enclosure;
a frequency synthesizer housed within the enclosure; and
a heater module having a heating element in thermal communication with the frequency synthesizer to adaptively adjust temperature of the frequency synthesizer.
26. The wireless radio system of claim 25, further comprising an IDU and a transceiver antenna coupled to the ODU.
27. The wireless radio system of claim 25, wherein the incoming signal and outgoing signal are quadrature amplitude modulated (QAM) signals.