1. An oxide semiconductor device comprising a gate electrode formed over a main surface of a substrate, a gate insulating film formed to a layer over the gate electrode, a channel layer formed to a layer over the gate insulating film and a source electrode and a drain electrode formed with a predetermined distance therebetween to a layer over the channel layer, in which
the channel layer includes an oxide semiconductor composed mainly of zinc oxide and tin oxide,
the channel layer contains a contaminant that is a group III element, having an impurity concentration (B),
the channel layer contains a counter dopant, having an impurity concentration (A), that is group IV element, a group V element, or both of the group IV element and the group V element, and
a ratio between the impurity concentration (A) of the counter dopant that is the group IV element, the group V element, or both of the group IV element and the group V element and the impurity concentration (B) of the contaminant group III element is: AB\u22661.0.
2. The oxide semiconductor device according to claim 1, wherein
the ratio between the impurity concentration (A) of the group IV element, the group V element, or both of the group IV element and the group V element, and the impurity concentration (B) of the group III element is: AB\u22660.3.
3. The oxide semiconductor device according to claim 1, wherein
the impurity concentration of the group III element is 9.0 at. % or less.
4. The oxide semiconductor device according to claim 1, wherein
the group III element includes one of B, Al, Ga, and In, or a combination of two or more of B, Al, Ga, and In.
5. The oxide semiconductor device according to claim 1, wherein
the group IV element includes one of C, Si, and Ge, or a combination of two or more of C, Si, and Ge.
6. The oxide semiconductor device according to claim 1, wherein
the group V element includes one of N, P, and As, or a combination of two or more of N, P, and As.
7. The oxide semiconductor device according to claim 1, wherein
the ingredient compositional ratio (Zn(Zn+Sn)) of zinc (Zn) and tin (Sn) contained in the channel layer is 0.6 to 0.8.
8. The oxide semiconductor device according to claim 1, wherein
the ingredient compositional ratio (Zn(Zn+Sn)) of zinc (Zn) and tin (Sn) contained in the channel layer is 0.65 to 0.7.
9. The oxide semiconductor device according to claim 1, wherein
the resistivity of the channel layer is 1\xd710\u22121 \u03a9cm or more.
10. The oxide semiconductor device according to claim 1, wherein
the gate electrode, the source electrode, and the drain electrode each include a transparent electroconductive film.
11. An oxide semiconductor device comprising a source electrode and a drain electrode formed with a predetermined distance therebetween over the main surface of a substrate, a channel layer formed over the substrate between the source electrode and the drain electrode with the both ends riding over the source electrode and the drain electrode respectively, a gate insulating film formed over the channel layer, and a gate electrode formed to a layer over the gate insulating film, in which
the channel layer includes an oxide semiconductor composed mainly of zinc oxide and tin oxide,
the channel layer contains a contaminant that is a group III element, having an impurity concentration (B),
the channel layer contains a counter dopant, having an impurity concentration (A), that is a group IV element, a group V element, or both of the group IV element and the group V element, and
a ratio between the impurity concentration (A) of the counter dopant that is the group IV element, the group V element or both of the group IV element and the group V element, and the impurity concentration (B) of the contaminant group III element is AB:\u22661.0.
12. The oxide semiconductor device according to claim 11, wherein
the ratio of the impurity concentration (A) of the group IV element, the group V element, or both of the group IV element and the group V element, and the impurity concentration (B) of the group III element is: AB\u22660.3.
13. The oxide semiconductor device according to claim 11, wherein
the impurity concentration of the group III element is 9.0 at. % or less.
14. The oxide semiconductor device according to claim 11, wherein
the group III element includes one of B, Al, Ga, and In or a combination of two or more of B, Al, Ga, and In.
15. The oxide semiconductor device according to claim 11, wherein
the group IV element includes one of C, Si, and Ge or a combination of two or more of C, Si, and Ge.
16. The oxide semiconductor device according to claim 11, wherein
the group V element includes one of N, P, and As, or a combination of two or more of N, P, and As.
17. The oxide semiconductor device according to claim 11, wherein
the ingredient compositional ratio (Zn(Zn+Sn)) of zinc (Zn) and tin (Sn) contained in the channel layer is 0.6 to 0.8.
18. The oxide semiconductor device according to claim 11, wherein
the ingredient compositional ratio (Zn(Zn+Sn)) of zinc (Zn) and tin (Sn) contained in the channel layer is 0.65 to 0.7.
19. The oxide semiconductor device according to claim 11, wherein
the resistivity of the channel layer is 1\xd710\u22121 \u03a9cm or more.
20. The oxide semiconductor device according to claim 11, wherein
the gate electrode, the source electrode, and the drain electrode each include a transparent electroconductive film.
21. An oxide semiconductor device comprising a gate electrode formed over a main surface of a substrate, a gate insulating film formed to a layer over the gate electrode, a channel layer formed to a layer over the gate insulating film and a source electrode and a drain electrode formed with a predetermined distance therebetween to a layer over the channel layer, in which
the channel layer consists of zinc oxide, tin oxide, a contaminant that is a group III element, having an impurity concentration (B), and a counter dopant, having an impurity concentration (A), that is a group IV element, a group V element, or both of the group IV element and the group V element, and
a ratio between the impurity concentration (A) of the counter dopant that is the group IV element, the group V element, or both of the group IV element and the group V element and the impurity concentration (B) of the contaminant group III element is: AB\u22661.0.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method for determining compatibility of a computer component with a particular computer configuration through detection of identifiers that are detectable externally from a packaging, the method comprising the steps of:
(a) detecting at least one identifier of a computer component that is associated with a packaging, the identifier comprising information relating to the computer component, wherein detection of the at least one identifier is performed without substantially altering the packaging; and
(b) comparing at least a portion of the information relating to the computer component with a particular computer configuration to determine if the computer component is compatible with the computer configuration.
2. The method of claim 1, further comprising the step of:
(c) comparing the at least one identifier with a collection of identifiers located on a computer-readable medium.
3. The method of claim 2, wherein the collection of identifiers are selected from the group consisting of: computer components certified for use with a class of computers, computer components certified for use with a one or more software components, and computer components certified for use with the particular computer configuration.
4. The method of claim 3, further comprising the steps of:
(d) determining the at least one identifier is not located within the collection of identifiers; and
(e) transmitting a notification to a user indicating the at least one identifier is not located within the collection of identifiers.
5. The method of claim 3, further comprising the steps of:
(d) determining the at least one identifier is located within the collection of identifiers; and
(e) performing step (b).
6. The method of claim 1, further comprising the step of:
(c) determining the computer component is compatible with the particular computer configuration; and
(d) notifying a user that the computer component is compatible with the particular computer configuration.
7. The method of claim 1, wherein the at least one identifier is embodied in items selected from the group of: a bar code, UPC code, an IR-reflective pattern, RFID tag, and combinations thereof.
8. The method of claim 1, wherein the at least one identifier is located at a location selected from the group consisting of: a portion of the computer component, a portion of the packaging, and combinations thereof.
9. The method of claim 6, further comprising the step of:
(e) placing electronic content regarding the detected component on a computer-readable medium in operative communication with the computing device.
10. The method of claim 6, further comprising the step of:
(e) notifying a user of a recommended additional computer component that is compatible with both the computing device and the computer component detected.
11. A computer-readable medium having computer-executable instructions for a method of installing a computer component in a computer having a computer configuration comprising the steps of:
(a) detecting at least one identifier of a computer component associated with a packaging in proximity to a sensor operatively connected to a computing device having a particular configuration, the identifier comprising information relating to the computer component, wherein detection of the at least one identifier is performed without substantially altering the packaging;
(b) comparing at least a portion of the information relating to the computer component with a particular computer configuration to obtain a comparison result, the comparison result conveying information selected from the group consisting of: the computer component is compatible with the computing device; the computer component is not compatible with the computing device, and the computer component may be compatible with modifications to the computing device.
12. The computer-readable medium of claim 11, the instructions further performing the steps of:
(c) determining the computer component is not compatible with the computer device; and
(d) determining at least one configuration update that will allow the computer component to be compatible with the computing device.
13. The computer-readable medium of claim 12, the instructions further performing the steps of:
(e) installing at least one configuration update to the computing device, wherein the at least one configuration update renders the computer component to be compatible with the computing device.
14. The computer-readable medium of claim 12, the instructions further performing the steps of:
(c) determining the computer component is compatible with the computer device; and
(d) presenting an indication to a user that the computer component is compatible with the computing device.
15. The computer-readable medium of claim 14, the instructions further performing the steps of:
(e) presenting to a user at least one additional component selection that is compatible with the computer configuration.
16. The computer-readable of claim 12, wherein the at least one identifier is embodied in items selected from the group of: a bar code, UPC code, an IR-reflective pattern, RFID tag, and combinations thereof.
17. The method of claim 12, wherein the at least one identifier is located at a location selected from the group consisting of: a portion of the computer component, a portion of the packaging, and combinations thereof.
18. The computer-readable medium of claim 14, wherein at least one identifier is located on the computer component, the instructions further performing the steps of:
(e) upon being previously installed in the computing device, rescanning the computer component at a second computing device to determine compatibility of the computer component with a second the computing device to generate a result; and
(f) present the result to a user.
19. A computer component packaging apparatus comprising:
a packaging configured to be associated with a computer component; and
at least one identifier configured to be externally detectable from at least a portion of the packaging, the at least one identifier comprising information relating to the computer component, wherein detection of the at least one identifier is performed without substantially altering the packaging.
20. The packaging apparatus of claim 19, wherein at least one identifier is located at a location selected from the group consisting of: a portion of the computer component, a portion of the packaging, and combinations thereof.