1. A method, comprising:
processing a plurality of workpieces using a processing tool;
acquiring a continuous value relating to said processing of said plurality of workpieces;
defining an area common to said plurality of workpieces, said area comprising at least one common die location of said workpieces;
determining whether a predetermined percentage of continuous value results respectively corresponding to said plurality of workpieces are above a desired level;
assigning a first binary value to said area based upon determining that said predetermined percentage of continuous value results respectively corresponding to said plurality of workpieces are above a desired level;
assigning a second binary value to said area based upon determining that said predetermined percentage of continuous value results respectively corresponding to said plurality of workpieces are below a desired level; and
adjusting said processing of said plurality of workpieces in response to at least one of the first binary value being assigned to said area of the plurality of workpieces or the second binary value being assigned to said area of the plurality of workpieces.
2. The method of claim 1, further comprising performing at least one of a feedback process and a feed-forward process adjustment based upon said pattern recognition analysis.
3. The method of claim 2, further comprising processing a subsequent workpiece based upon said at least one of said feedback process and said feed-forward process.
4. The method of claim 1, further comprising generating a wafer map using said area.
5. The method of claim 1, wherein acquiring a continuous value comprises acquiring at least one of a performance characteristic associated with said area, a parametric data, and a metrology data associated with said area.
6. The method of claim 5, wherein acquiring said metrology data associated with said area comprises acquiring data relating to at least one of a thickness of a layer, a photolithography process parameter, an etch result parameter, a chemical-mechanical polishing result parameter, a deposition process result parameter, and an ion implant process result parameter.
7. The method of claim 5, wherein acquiring a performance characteristic associated with said area further comprises acquiring information regarding speed associated with a die region associated with said area.
8. A method, comprising:
processing a plurality of workpieces using a processing tool;
acquiring a continuous value data relating to processing a plurality of workpieces;
defining a region common to said plurality of workpieces, said region comprising at least one common die region of said workpieces;
determining whether a predetermined percentage of continuous value data results respectively corresponding to said plurality of workpieces are above a desired level;
assigning a first binary value to said region based upon determining that said predetermined percentage of continuous value data results respectively corresponding to said plurality of workpieces are above a desired level;
assigning a second binary value to said region based upon determining that said predetermined percentage of continuous value data results respectively corresponding to said plurality of workpieces are below a desired level;
performing a pattern recognition analysis based upon said first and second binary values; and
adjusting said processing of said plurality of workpieces in response to at least one of the first binary value being assigned to said area of the plurality of workpieces or the second binary value being assigned to said area of the plurality of workpieces.
9. The method of claim 8, further comprising performing at least one of a feedback process and a feed-forward process adjustment based upon said pattern recognition analysis.
10. The method of claim 9, further comprising processing a subsequent workpiece based upon said at least one of said feedback process and said feed-forward process.
11. The method of claim 2, further comprising generating a wafer map using said region.
12. The method of claim 2, wherein acquiring a continuous value comprises acquiring at least one of a performance characteristic associated with said region, a parametric data, and a metrology data associated with said region.
13. The method of claim 12, wherein acquiring said metrology data associated with said region comprises acquiring data relating to at least one of a thickness of a layer, a photolithography process parameter, an etch result parameter, a chemical-mechanical polishing result parameter, a deposition process result parameter, and an ion implant process result parameter.
14. The method of claim 12, wherein acquiring a performance characteristic associated with said region further comprises acquiring information regarding speed associated with a die region associated with said region.
15. A system, comprising:
a plurality of workpieces;
a processing tool to process said plurality of workpieces;
a measurement tool to acquire continuous value data relating to said plurality of workpieces;
a controller to organize said continuous value data to associated results relating to said continuous value data into a region common to said plurality of workpiece, said controller to also determine whether a predetermined percentage of organized continuous value data associated with said region is above a predetermined level, said controller to assign a first binary value to said region based upon determining that said predetermined percentage of organized continuous value data is above a desired level and assign a second binary value to said region based upon determining that said predetermined percentage of organized continuous value data is below a predetermined level;
wherein said processing of said plurality of workpieces further comprises adjusting said processing of said plurality of workpieces in response to at least one of the first binary value being assigned to said area of the plurality of workpieces or the second binary value being assigned to said area of the plurality of workpieces.
16. The system of claim 15, wherein said processing tool is adapted to process a subsequent workpiece.
17. The system of claim 15, further comprising a pattern recognition unit to perform a pattern recognition analysis based upon said first and said second binary values.
18. The system of claim 17, wherein said controller also to perform at least one of a feedback adjustment and a feed-forward adjustment to a subsequent process based upon said pattern recognition analysis.
19. The system of claim 15, further comprising database to store said continuous value data.
20. A non-transitory, computer readable storage device adapted to store instructions that, when executed, perform a method, the method comprising:
processing a plurality of workpieces;
acquiring a continuous value data relating to processing a plurality of workpieces;
defining a region common to said plurality of workpieces, said region comprising at least one common die region of said workpieces;
determining whether a predetermined percentage of continuous value data results respectively corresponding to said plurality of workpieces are above a desired level;
assigning a first binary value to said region based upon determining that said predetermined percentage of continuous value data results respectively corresponding to said plurality of workpieces are above a desired level;
assigning a second binary value to said region based upon determining that said predetermined percentage of continuous value data results respectively corresponding to said plurality of workpieces are below a desired level;
performing a pattern recognition analysis based upon said first and second binary values; and
adjusting said processing of said plurality of workpieces in response to at least one of the first binary value being assigned to said region of the plurality of workpieces or the second binary value being assigned to said region of the plurality of workpieces.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. Sensor apparatus for measuring the temperature of a pane surface comprising:
a temperature sensor mounted to a circuit board and positioned in a front end of the circuit board in the direct vicinity of the pane surface to be measured; and
a flexible heat conducting clement disposed between the surface to be measured and the circuit board in order that heat from the pane surface is transferred to the temperature sensor via the flexible heat conducting element and the circuit board and the temperature sensor measures the temperature of the pane surface.
2. Sensor apparatus according to claim 1, wherein the flexible heat conducting element is L-shaped and has a leg that is in contact with the surface to be measured, and a leg that is in flat contact with the circuit board.
3. Sensor apparatus according to claim 2, wherein a front side of the flexible heat conducting element, associated with the surface, has a smooth surface and is rounded at least at edges thereof.
4. Sensor apparatus according to claim 2, wherein the flexible heat conducting element comprises a heat conducting metal selection from a group consisting of copper, aluminium, brass, and bronze.
5. Sensor apparatus according to claim 2, further comprising means for providing resilient abutment of the heat conducting element on the surface.
6. Sensor apparatus according to claim 2, wherein the circuit board and the flexible heat conducting element flatly abut each other in the area of the temperature sensor.
7. Sensor apparatus according to claim 1, wherein the heat conducting element is displaceable with respect to the surface.
8. Sensor apparatus according to claim 1, wherein the circuit board is metalized at the front end, on a side opposite to the temperature sensor and on side surfaces and includes conductor paths for the temperature sensor.
9. Sensor apparatus according to claim 8, further comprises through connections in the circuit board in the vicinity of the temperature sensor.
10. Sensor apparatus according to claim 1 further comprising an evaluation unit disposed on the circuit board.