We claim:
1. A binder-free shaped objected selected from the group consisting of microporous and mesoporous metal silicates, obtained by the hydrothermal reaction of a silicon and metal source in the presence of a template, wherein a pyrogenic metal-silicon mixed oxide is the silicon and metal source.
2. The binder-free shaped object according to claim 1 wherein the crystalline microporous and mesoporous metal silicates are represented by the composition
(SiO2)1x(AmOn)x (Ia), (SiO2)1x((AmOn)1-y(Am,On,)y)x (Ib)
or
(SiO2)1x(MrAmOn,)x (II)
in which
x is a number from 0.0001 to 0.25;
y is a number greater than 0 and less than 1;
A and A are a metal of valency p selected from the group consisting of B, Al, Ga, In, Ge, Sn, Pb, and subgroups 3 to 8 of the Periodic Table of Elements;
M is a cation of valency q selected from the group consisting of alkali metals, alkaline earth metals, H, NH4and N(alkyl)4
m, m, n, n, n and r are the number of atoms, where:
mp2n and mp2n and
mprq2n,
wherein a pyrogenic mixed oxide of composition (Ia) or (Ib) is used and the cation M of formula (II) is incorporated via the template or via alkali metal or alkaline earth metal hydroxide present in the hydrothermal reaction.
3. The binder-free shaped object according to claim 1 wherein said pyrogenic metal-silicon mixed oxide is prepared by flame hydrolysis.
4. The binder-free shaped object according to claim 1 wherein said pyrogenic mixed oxide is selected from the group consisting of
(SiO2)1x(TiO2)x, (SiO2)1x(Al2O3)x, (SiO2)1x(B2O3)x, (SiO2)1x(V2O5)x and (SiO2)1x (ZrO2)x.
5. The binder-free shaped object according to claim 4 which is
(SiO2)1x(TiO2)x
.
6. The binder-shaped object according to claim 1 wherein said template is an amine having one or more amino groups, an amino alcohol or a tetrasubstituted ammonium compound.
7. The binder-free shaped object according to claim 1 wherein said template is used in an amount of 0.05 to 2.0 mol per mol of SiO2 in the mixed oxide.
8. The binder-free shaped object according to claim 1 further comprising carrying out the hydrothermal reaction for the preparation of microporous metal silicates at a temperature from 100 to 220C.
9. The binder-free shaped object according to claim 1 further comprising carrying out the hydrothermal reaction for preparation of microporous metal silicates at a temperature from 150 to 190C.
10. The binder-free shaped object according to claim 1 wherein the preparation of mesoporous metal silicates is carried out at a temperature from 50 to 175C. under at least autogenous pressure.
11. A process for catalytic oxidation reactions, wherein a catalyst is present corresponding to an Al-free metal silicalite defined in claim 1.
12. The process according to claim 11 wherein the catalyst is (SiO2)1x(TiO2)x.
13. A process for the oxidation of an olefin wherein a catalyst is present, said catalyst being the binder-free shaped object of claim 1.
14. The process according to claim 13 wherein the catalyst is (SiO2)1x(TiO2)x.
15. The process according to claim 11 wherein propene is oxidized with hydrogen peroxide to give the corresponding epoxide.
16. The process according to claim 12 wherein propene is oxidized with hydrogen peroxide to give the corresponding expoxide.
17. A process for preparing a hydroxy aromatic compound comprising reacting an aromatic compound with hydrogen peroxide or an organic hydroperoxide in the presence of a binder-free shaped object according to claim 1.
18. A process for producing an alcohol or ketone comprising reacting an aliphatic hydrocarbon with hydrogen peroxide or an organic hydroperoxide in the presence of a binder-free shaped object according to claim 1.
19. The process according to claim 18, wherein a ketone is converted to an oxime by reacting with hydrogen peroxide and ammonia.
20. A process for the catalytic epoxidation of an olefin with hydrogen peroxide as the oxidant comprising carrying out the epoxidation in the presence of a catalyst which is a crystalline microporous titanium silicate of the composition (SiO2)1x(TiO2)x in which x is a number from 0.001 to 0.2 wherein a pyrogenic silicon-titanium mixed oxide is reacted with tetraalkylammonium hydroxide template in a hydrothermal reaction at a temperature from 100 to 220C., and wherein the pyrogenic silicon-titanium mixed oxide is shaped to microgranules by a spray drying process prior to the hydrothermal reaction and a crystalline microporous titanium silicate in the form at microgranules is formed.
21. The process of claim 20, wherein the olefin is propene.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An electronic module cooling apparatus for cooling a plurality of electronic modules, in particular memory modules, disposed on a substrate in spaced-apart parallel relationship, each module including a circuit board to which one or more electronic components are mounted, the apparatus comprising:
a row of parallel, spaced apart, thermally conductive, cold plates that extend longitudinally and define planar slots that are open top and bottom for receiving respective electronic modules, at least one of the cold plates having a thermally conducting, in particular planar, surface for contacting the one or more electronic components of a relatively adjacent electronic module;
a first fluid conduit providing a passageway for cooling fluid, the first fluid conduit extending along the row of cold plates outwardly in relation to the planar slots, the conduit being connected to adjacent first longitudinal ends of a plurality of the cold plates for transferring heat absorbed by the plurality of cold plates to the cooling fluid flowing through the first conduit; and
a second conduit providing a passageway for cooling fluid, wherein the second conduit is spaced apart from the first fluid conduit and is connected to second ends of the plurality of cold plates opposite the first ends.
2. The electronic module cooling apparatus of claim 1, wherein each planar slot is bounded by a respective pair of the cold plates, and means are provided for pressing the cold plates against respective sides of the electronic module received in the planar slot formed between the pair of cold plates.
3. The electronic module cooling apparatus of claim 2, wherein the means for pressing includes a resilient clip for engaging backsides of the cold plates for squeezing the cold plates together for holding the cold plates against respective sides of the electronic module received in the planar slot formed between the pair of cold plates.
4. The electronic module cooling apparatus of claim 2, wherein a front side of each cold plate of the pair of cold plates has the thermally conducting surface for contacting respective confronting surfaces of the electronic module disposed between the cold plates.
5. The electronic module cooling apparatus of claim 1, wherein the cold plates include a thermally conductive resilient dielectric material on surfaces of the cold plates for engaging the memory modules.
6. (canceled)
7. The electronic module cooling apparatus of claim 5, wherein the thermally conductive resilient dielectric material is in the form of a thin solid film.
8. The electronic module cooling apparatus of claim 1, wherein the first and second ends of the plurality of cold plates are held in spaced apart relationship by the first and second fluid conduits.
9-10. (canceled)
11. The electronic module cooling apparatus of claim 1, wherein at least one of the cold plates includes a fluid passage communicating at one end with the first conduit and at an opposite end with the second conduit for passage of cooling fluid through said one cold plate.
12-13. (canceled)
14. The apparatus of claim 1, in combination with the plurality of electronic modules disposed between respective pairs of the cold plates, the combination further comprising a base substrate to which the electronic modules are removably mounted by module receptacles, wherein the electronic module cooling apparatus is mounted to the base substrate independently of the electronic modules.
15. The combination of claim 14, wherein at least of the electronic modules is removable from the base substrate without removing the electronic module cooling apparatus.
16. The apparatus of claim 1, wherein the cold plates are fixed to each fluid conduit by brazing.
17. A cooling module for cooling a memory board, comprising:
a first heat absorbing element for removing heat from a memory board, the first heat absorbing element having an elongated surface for thermally contacting a first surface of the memory board;
a second heat absorbing element for removing heat from a memory board, the second heat absorbing element having an elongated surface for thermally contacting a second surface of the memory board, the elongated surface of the second heat absorbing element facing the elongated surface of the first heat absorbing element and being spaced therefrom to form a space into which the memory board is receivable; and
a conduit connecting the first heat absorbing element and the second heat absorbing element, the conduit providing a passageway for a fluid flow through the cooling module to remove heat absorbed by the first heat absorbing element and the second heat absorbing element; and
wherein means are used to enhance thermal contact between the heat absorbing elements and respective sides of the memory board.
18. The cooling module of claim 17, wherein the first heat absorbing element and the second heat absorbing element are part of an array of heat absorbing elements for absorbing heat from a plurality of memory boards disposed in spaces between the heat absorbing elements in the array.
19. The cooling module of claim 17, wherein the means used to enhance thermal contact includes a clip for sandwiching the memory board between the elongated surface of the first heat absorbing element and the elongated surface of the second heat absorbing element.
20. (canceled)
21. The cooling module of claim 17, further comprising a second conduit connecting the first heat absorbing element and the second heat absorbing element, the second conduit providing a passageway for a fluid flow through the cooling module to remove heat absorbed by the first heat absorbing element and the second heat absorbing element, and wherein the conduits are spaced apart from one another and located at opposite ends of the heat absorbing elements.
22-23. (canceled)
24. The cooling module of claim 17, wherein the heat absorbing elements are brazed to the conduit.
25-27. (canceled)
28. The cooling module of claim 17, in combination with a memory board having a first surface and a second surface, the memory board received in the space between the first heat absorbing element and the second heat absorbing element, wherein the elongated surface of the first heat absorbing element is in thermal contact with the first surface of the memory board and the elongated surface of the second heat absorbing element is in thermal contact with the second surface of the memory board.
29-30. (canceled)
31. A method of cooling a memory board, comprising:
providing a cooling apparatus or module including
a first cold plate for removing heat from a memory board, the first cold plate having an elongated surface for thermally contacting a first surface of the memory board,
a second cold plate for removing heat from a memory board, the second cold plate having an elongated surface for thermally contacting a second surface of the memory board, the elongated surface of the second cold plate facing the elongated surface of the first cold plate and being spaced therefrom to form a slot into which the memory board is receivable, and,
fluid conduits located at each end of the cold plates;
inserting a memory board into the slot between the cold plates; and
pumping a fluid through the conduits to remove heat from the cold plates.
32. The cooling module of claim 17, wherein the means used to enhance thermal contact includes a thermally conductive resilient dielectric material on surfaces of the heat absorbing elements for engaging the memory board.
33. The cooling module of claim 32, wherein the thermally conductive resilient dielectric material is in the form of a thin film.