1. An integrated circuit structure, comprising:
a semiconductor substrate;
a through-silicon via (TSV) extending into the semiconductor substrate;
a pad formed over the semiconductor substrate and spaced apart from the TSV; and
an interconnect structure formed over the semiconductor substrate and electrically connecting the TSV and the pad;
wherein the interconnect structure comprises
an upper portion which is formed on the pad and extends to electrically connect the TSV; and
a lower portion outside the TSV and adjacent to the pad.
2. An integrated circuit structure, comprising:
a semiconductor substrate;
a through-silicon via (TSV) extending into the semiconductor substrate;
a pad formed over the semiconductor substrate and spaced apart from the TSV; and
an interconnect structure formed over the semiconductor substrate and electrically connecting the TSV and the pad;
wherein the interconnect structure comprises an upper portion formed on the pad and a lower portion adjacent to the pad, and the upper portion extends to electrically connect the TSV; and
wherein the lower portion of the interconnect structure is a ring surrounding the pad.
3. The integrated circuit structure of claim 1, wherein the interconnect structure and the TSV are formed of the same conductive material.
4. The integrated circuit structure of claim 1, wherein at least one of the TSV or the interconnect structure comprises copper.
5. The integrated circuit structure of claim 1, wherein the lower portion of the interconnect structure is positioned between the TSV and the pad.
6. The integrated circuit structure of claim 1, wherein the pad comprises aluminum or an aluminum alloy.
7. The integrated circuit structure of claim 1, further comprising
a passivation layer formed between the semiconductor substrate and the upper portion of the interconnect structure and surrounding the lower portion of the interconnect structure.
8. The integrated circuit structure of claim 7, wherein the passivation layer extends into the semiconductor substrate to line the sidewall and bottom of the TSV.
9. The integrated circuit structure of claim 7, wherein the passivation layer comprises two isolation layers.
10. The integrated circuit structure of claim 7, wherein the passivation layer comprises silicon oxide, silicon nitride, or a combination thereof.
11. An integrated circuit structure, comprising:
a semiconductor substrate;
a low-k dielectric layer over the semiconductor substrate;
a metal line formed in the low-k dielectric layer;
a first passivation layer formed on the low-k dielectric layer and exposing a portion of the metal line;
a pad formed in the first passivation layer and on the exposed portion of the metal line;
a through-silicon via (TSV) passing through the first passivation layer and the low-k dielectric layer and extending into the semiconductor substrate, wherein the TSV is spaced apart from the pad; and
an interconnect structure formed over the first passivation layer and electrically connecting the TSV and the pad;
wherein the interconnect structure comprises
an upper portion which is formed directly on the pad and extends laterally into direct electrical connection with the TSV; and
a lower portion which extends from the upper portion toward the substrate, is located outside the TSV, and is free of direct contact with the TSV.
12. The integrated circuit structure of claim 11, wherein the lower portion of the interconnect structure is a ring surrounding the pad.
13. The integrated circuit structure of claim 11, wherein the interconnect structure and the TSV are formed of the same conductive material.
14. The integrated circuit structure of claim 11, wherein at least one of the TSV or the interconnect structure comprises copper.
15. The integrated circuit structure of claim 1, wherein the lower portion of the interconnect structure is co-elevational with the pad.
16. The integrated circuit structure of claim 11, wherein the pad comprises at least one of aluminum, copper, an aluminum alloy, or a copper alloy.
17. The integrated circuit structure of claim 11, further comprising
a second passivation layer formed between the first passivation layer and the upper portion of the interconnect structure and surrounding the lower portion of the interconnect structure.
18. The integrated circuit structure of claim 17, wherein the second passivation layer extends into the semiconductor substrate to line the sidewall and bottom of the TSV.
19. The integrated circuit structure of claim 17, wherein the second passivation layer comprises at least one of silicon oxide, silicon nitride, or a combination thereof.
20. The integrated circuit structure of claim 11, wherein the first passivation layer comprises at least one of silicon oxide, silicon nitride, or a combination thereof.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An automatic document feeder, comprising:
a housing having a back plate which may be raised and a base pivotably connected to the back plate;
a supporting element disposed on the housing and having a shaft hole;
a first engaging structure disposed on the housing; and
a friction roller assembly, which comprises:
a rotating shaft, which has a first end disposed in the shaft hole;
a friction roller, which is disposed onto the rotating shaft and fixed, wherein the rotating shaft drives the friction roller to rotate in order for the automatic document feeder to transport a sheet; and
a first sleeve, which is rotatably mounted on the rotating shaft and has a second engaging structure which is engaged with the first engaging structure in order to rotatably and firmly mount the rotating shaft on the housing, wherein the friction roller assembly may be replaced when the second engaging structure and the first engaging structure are disengaged.
2. The automatic document feeder according to claim 1, wherein the first engaging structure is engaged with the second engaging structure through relative rotation therebetween.
3. The automatic document feeder according to claim 2, wherein:
the first engaging structure has an arced slot and an elastic rib;
the second engaging structure has a projection and a radial part, both of which are connected to an external circumferential surface of the first sleeve, and an arced part, which is substantially parallel to the external circumferential surface and connected to the radial part;
the arced part is fit into the arced slot; and
the elastic rib is engaged with the projection.
4. The automatic document feeder according to claim 3, wherein the first sleeve further has an actuating part to be actuated to rotate the second engaging structure to engage with or disengage from the first engaging structure.
5. The automatic document feeder according to claim 1, wherein the first engaging structure and the second engaging structure are engaged through relative movement therebetween.
6. The automatic document feeder according to claim 5, wherein the first engaging structure has two elastic hooks, the second engaging structure has two wings disposed on an external circumferential surface of the first sleeve, and the wings are engaged with the elastic hooks, respectively.
7. The automatic document feeder according to claim 1, wherein the supporting element and the first engaging structure are disposed on the back plate or the base.
8. An automatic document feeder, comprising:
a housing having a back plate which may be raised and a base pivotably connected to the back plate;
a first engaging structure and a third engaging structure, both of which are disposed on the housing; and
a friction roller assembly, which comprises:
a rotating shaft;
a friction roller, which is disposed onto the rotating shaft and fixed, wherein the rotating shaft drives the friction roller to rotate in order for the automatic document feeder to transport a sheet; and
a first sleeve having a second engaging structure and a second sleeve having a fourth engaging structure, wherein:
both of the first sleeve and the second sleeve are rotatably mounted on the rotating shaft;
the first engaging structure and the third engaging structure are respectively engaged with the second engaging structure and the fourth engaging structure in order to rotatably and firmly mount the rotating shaft on the housing; and
the friction roller assembly may be replaced when the second engaging structure and the first engaging structure are disengaged and when the fourth engaging structure and the third engaging structure are disengaged.
9. The automatic document feeder according to claim 8, wherein the first engaging structure is engaged with the second engaging structure through relative rotation therebetween.
10. The automatic document feeder according to claim 9, wherein:
the first engaging structure has an arced slot and an elastic rib;
the second engaging structure has a projection and a radial part, both of which are connected to an external circumferential surface of the first sleeve, and an arced part, which is substantially parallel to the external circumferential surface and connected to the radial part;
the arced part is fit into the arced slot; and
the elastic rib is engaged with the projection.
11. The automatic document feeder according to claim 10, wherein the first sleeve further has an actuating part to be actuated to rotate the second engaging structure to engage with or disengage from the first engaging structure.
12. The automatic document feeder according to claim 10, wherein:
the third engaging structure has an arced slot and an elastic rib;
the fourth engaging structure has a projection and a radial part, both of which are connected to an projection and a radial part, both of which are connected to an external circumferential surface of the second sleeve, and an arced part substantially parallel to the external circumferential surface and connected to the radial part; and
the arced part is fit into the arced slot and the elastic rib is engaged with the projection.
13. The automatic document feeder according to claim 9, wherein the third engaging structure and the fourth engaging structure are engaged through relative rotation therebetween.
14. The automatic document feeder according to claim 9, wherein the third engaging structure and the fourth engaging structure are engaged through relative movement therebetween.
15. The automatic document feeder according to claim 8, wherein the first engaging structure and the second engaging structure are engaged through relative movement therebetween.
16. The automatic document feeder according to claim 15, wherein the first engaging structure has two elastic hooks, the second engaging structure has two wings disposed on an external circumferential surface of the first sleeve, and the wings are engaged with the elastic hooks, respectively.
17. The automatic document feeder according to claim 15, wherein the third engaging structure and the fourth engaging structure are engaged through relative movement therebetween.
18. The automatic document feeder according to claim 8, wherein the first engaging structure and the third engaging structure are disposed on the back plate or the base.