1. A method for fabricating one or more semiconductor devices according to a semiconductor design on a semiconductor wafer comprising:
coating the semiconductor wafer with photoresist;
producing a common alignment mark on the photoresist coating the semiconductor wafer for use in both e-beam direct writing and optical exposure lithography;
creating critical dimension (CD) areas of the semiconductor design on the semiconductor wafer with electron (e-) beam direct writing, the CD areas including CD’s that are geometries and spacings used to monitor pattern size and ensure that the pattern size is within specification; and,
creating non-CD areas of the semiconductor design on the semiconductor with optical exposure lithography.
2. The method of claim 1, wherein e-beam direct writing comprises e-beam direct writing the CD areas on the photoresist coating the semiconductor wafer.
3. The method of claim 1, wherein optical exposure lithography comprises:
aligning a photomask having the non-CD areas of the semiconductor design over the photoresist coating the semiconductor wafer; and,
exposing the photoresist coating the semiconductor wafer with a light source through the photomask.
4. The method of claim 1, further comprising developing the photoresist coating the semiconductor wafer to partially remove the photoresist in accordance with the semiconductor design.
5. The method of claim 4, wherein the photoresist is sensitive to both e-beam direct writing and optical exposure lithography using a same developer to partially move the photoresist.
6. The method of claim 1, wherein the photoresist is one of positive photoresist and negative photoresist.
7. The method of claim 1, wherein optical exposure lithography comprising using stepper and scanner semiconductor photolithographic equipment.
8. The method of claim 1, wherein e-beam writing comprises one of scanner e-beam writing and vector e-beam writing.
9. The method of claim 1, further initially comprising separating the CD’s areas of the semiconductor design on a first layer from the non-CD areas of the semiconductor design on a second layer by applying a CD rule governing which of a plurality of dimensions of the semiconductor design are the CD’s.
10. The method of claim 1, further initially comprising defining the CD’s areas of the semiconductor design on a first layer as gate-shrink polysilicon areas of polysilicon gate layers of the semiconductor design, and defining the non-CD areas of the semiconductor design on a second layer as non-gate shrink polysilicon areas of the polysilicon gate layers.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A detachable assembly for installing and detaching a memory module having a printed circuit board in a memory slot, the printed circuit board defining a terminal portion and a free portion arranged opposite the terminal portion, comprising:
a plurality of metal parts disposed on the free portion of the printed circuit board, wherein the terminal portion of the printed circuit board includes a plurality of ground terminals;
wherein metal traces are disposed on a first surface and a second surface of the printed circuit board, and an end of one of the metal traces is directly connected to the metal parts and the other end is directly connected to the ground terminal,
wherein each of the plurality of metal parts is an L-shaped metal sleeve, the L-shaped metal sleeve has an L-shaped accommodating space therein, and the L-shaped accommodating space receives a corner of the free portion of the printed circuit board;
wherein the printed circuit board has a first surface and an oppositely arranged second surface, the first surface and the second surface each has a first corner and a second corner arranged proximate to the terminal portion and have a third corner and a fourth corner arranged away from the terminal portion, the metal parts are respectively disposed on the third corner of the first surface, the fourth corner of the first surface, the third corner of the second surface, and the fourth corner of the second surface;
wherein the metal parts are a plurality of metal sleeves, the metal sleeves envelop the free portion of the printed circuit board and respectively envelop the third corners of the first and second surfaces and the fourth corners of the first and second surfaces.
2. The detachable assembly as recited in claim 1, wherein the metal parts are arranged with a predetermined distance therebetween for exerting even force thereon.
3. The detachable assembly as recited in claim 1, wherein the metal parts are copper foil.
4. The detachable assembly as recited in claim 1, wherein each of the third and fourth corners of the first surface has a first coupling structure, each of the third and fourth corners of the second surface has a second coupling structure, and each of the metal sleeves has a first retaining structure corresponding to the first coupling structure and a second retaining structure corresponding to the second coupling structure.
5. The detachable assembly as recited in claim 4, wherein each of the metal sleeves has a base wall and an annular side wall connected to the base wall, the first retaining structure and the second retaining structure are oppositely arranged on an inner portion of the annular side wall.
6. A memory module, comprising:
a printed circuit board including a terminal portion and a free portion arranged away from the terminal portion; and
a detachable assembly including a plurality of metal parts disposed on the free portion, wherein the terminal portion of the printed circuit board includes a plurality of ground terminals;
wherein metal traces are disposed on a first surface and a second surface of the printed circuit board, and an end of one of the metal traces is directly connected to the metal parts and the other end is directly connected to the ground terminal,
wherein each of the plurality of metal parts is an L-shaped metal sleeve, the L-shaped metal sleeve has an L-shaped accommodating space therein, and the L-shaped accommodating space receives a corner of the free portion of the printed circuit board;
wherein the printed circuit board has a first surface and an oppositely arranged second surface, the first surface and the second surface each has a first corner and a second corner arranged proximate to the terminal portion and have a third corner and a fourth corner arranged away from the terminal portion, the metal parts are respectively disposed on the third corner of the first surface, the fourth corner of the first surface, the third corner of the second surface, and the fourth corner of the second surface;
wherein the metal parts are a plurality of metal sleeves, the metal sleeves envelop the free portion of the printed circuit board and respectively envelop the third corners of the first and second surfaces and the fourth corners of the first and second surfaces.
7. The memory module as recited in claim 6, wherein the metal parts are arranged with a predetermined distance therebetween for exerting even force thereon.
8. The memory module as recited in claim 6, wherein the metal parts are copper foil.
9. The memory module as recited in claim 6, wherein each of the third and fourth corners of the first surface has a first coupling structure, each of the third and fourth corners of the second surface has a second coupling structure, and each of the metal sleeves has a first retaining structure corresponding to the first coupling structure and a second retaining structure corresponding to the second coupling structure.
10. The memory module as recited in claim 9, wherein each of the metal sleeves has a base wall and an annular side wall connected to the base wall, the first retaining structure and the second retaining structure are oppositely arranged on an inner portion of the annular side wall.
11. A memory module, comprising:
a printed circuit board including a terminal portion and a free portion arranged away from the terminal portion; and
a detachable assembly including a plurality of metal parts disposed on the free portion, wherein each of the metal parts is a metal sleeve comprising a space therein, and shape of the space matches shape of one corner of the printed circuit board,
wherein each of the plurality of metal parts is an L-shaped metal sleeve, the L-shaped metal sleeve has an L-shaped accommodating space therein, and the L-shaped accommodating space receives a corner of the free portion of the printed circuit board;
wherein the printed circuit board has a first surface and an oppositely arranged second surface, the first surface and the second surface each has a first corner and a second corner arranged proximate to the terminal portion and have a third corner and a fourth corner arranged away from the terminal portion, the metal parts are respectively disposed on the third corner of the first surface, the fourth corner of the first surface, the third corner of the second surface, and the fourth corner of the second surface;
wherein the metal parts are a plurality of metal sleeves, the metal sleeves envelop the free portion of the printed circuit board and respectively envelop the third corners of the first and second surfaces and the fourth corners of the first and second surfaces.