1. A backlight module comprising:
a light source;
a diffusion plate disposed on the light source, wherein the diffusion plate has a light incident surface and a light emitting surface opposite to the light incident surface, and the light incident surface faces the light source; and
an integrated optical film disposed on the diffusion plate and comprising:
a base having a first surface and a second surface opposite to each other, wherein the second surface faces the light emitting surface of the diffusion plate;
a brightness enhancement layer having a plurality of brightness enhancement columns and a plurality of diffusion particles, wherein the brightness enhancement columns are disposed on the first surface and the diffusion particles are dispersed in the brightness enhancement columns; and
a diffusion layer having a plurality of granular patterns disposed on the second surface in an irregular arrangement.
2. The backlight module as claimed in claim 1, wherein the thickness of the base is in the range from 250 to 350 micrometers.
3. The backlight module as claimed in claim 1, wherein the thickness of the brightness enhancement layer is less than 40 micrometers.
4. The backlight module as claimed in claim 1, wherein the thickness of the diffusion layer is less than 5 micrometers.
5. The backlight module as claimed in claim 1, wherein each of the brightness enhancement columns comprises a prism or a cambered column.
6. The backlight module as claimed in claim 1, wherein the granular patterns comprise a plurality of granular protrusions, a plurality of granular dents or a combination thereof.
7. The backlight module as claimed in claim 1, wherein each of the diffusion particles comprises polymethylmethacrylate, polycarbonate, polystyrene or silicon dioxide.
8. The backlight module as claimed in claim 1, wherein the base comprises polyethylene terephthalate.
9. The backlight module as claimed in claim 1, wherein each of the brightness enhancement columns comprises acrylic resin.
10. The backlight module as claimed in claim 1, wherein the diffusion layer comprises acrylic resin.
11. A backlight module comprising:
a light guiding plate having a light incident surface, a bottom surface and a light emitting surface, wherein the light incident surface connects the bottom surface and the light emitting surface, and the bottom surface and the light emitting surface are opposite to each other;
a light source disposed adjacent to the light incident surface;
a diffusion film disposed on the light emitting surface; and
an integrated optical film disposed on the diffusion film and comprising:
a base having a first surface and a second surface opposite to each other, wherein the second surface faces the diffusion film and the light guiding plate;
a brightness enhancement layer having a plurality of brightness enhancement columns and a plurality of diffusion particles, wherein the brightness enhancement columns are disposed on the first surface and the diffusion particles are dispersed in the brightness enhancement columns; and
a diffusion layer having a plurality of granular patterns disposed on the second surface in an irregular arrangement.
12. The backlight module as claimed in claim 11, wherein the thickness of the base is in the range from 250 to 350 micrometers.
13. The backlight module as claimed in claim 11, wherein the thickness of the brightness enhancement layer is less than 40 micrometers.
14. The backlight module as claimed in claim 11, wherein the thickness of the diffusion layer is less than 5 micrometers.
15. The backlight module as claimed in claim 11, wherein each of the brightness enhancement columns comprises a prism or a cambered column.
16. The backlight module as claimed in claim 11, wherein the granular patterns comprise a plurality of granular protrusions, a plurality of granular dents or a combination thereof.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A thin film transistor array panel comprising:
a substrate;
a gate line disposed on the substrate;
a first insulating layer disposed on the gate line;
a semiconductor member disposed on the first insulating layer;
a plurality of ohmic contacts disposed on the semiconductor member;
a source electrode and a drain electrode disposed on the ohmic contacts, each of the source electrode and the drain electrode comprising a first film and a second film disposed on the first film;
a second insulating layer that is disposed on the source electrode and the drain electrode and has a first contact hole exposing a portion of the drain electrode and a portion of the first insulating layer adjacent thereto and an opening exposing a portion of the semiconductor member;
a pixel electrode disposed on the second insulating layer and contacting the first film of the drain electrode through the first contact hole; and
a columnar spacer disposed on the exposed portion of the semiconductor member.
2. The thin film transistor array panel of claim 1, wherein the opening has at least an edge that coincides with an edge of the exposed portion of the semiconductor member.
3. The thin film transistor array panel of claim 2, wherein the at least an edge of the opening coincides with an edge of the source electrode, an edge of the drain electrode, and edges of the ohmic contacts.
4. The thin film transistor array panel of claim 3, wherein a planar shape of the ohmic contacts is substantially the same as a planar shape of the source electrode and the drain electrode.
5. The thin film transistor array panel of claim 4, wherein a planar shape of the semiconductor member except for the exposed portion is substantially the same as a planar shape of the source electrode and the drain electrode.
6. The thin film transistor array panel of claim 1, wherein the first film of the drain electrode has at least an edge that coincides with an edge of the first contact hole.
7. The thin film transistor array panel of claim 6, further comprising a data line connected to the source electrode and comprising a third film and a fourth film disposed on the third film,
wherein the second insulating layer further has a second contact hole exposing a portion of the third film of the data line, and the third film of the data line has at least an edge that coincides with an edge of the second contact hole.
8. The thin film transistor array panel of claim 7, further comprising a contact assistant disposed on the exposed portion of the third film of the data line and comprising indium tin oxide or indium zinc oxide.
9. The thin film transistor array panel of claim 8, wherein the pixel electrode comprises indium tin oxide or indium zinc oxide, and wherein the fourth films of the data line, the source electrode, and the drain electrode comprise aluminum (Al).
10. The thin film transistor array panel of claim 9, wherein the third films of the data line, the source electrode, and the drain electrode comprise chromium (Cr).
11. The thin film transistor array panel of claim 1, wherein the gate line comprises a third film and a fourth film disposed on the third film, and the third film of the gate line comprises an uncovered portion disposed out of the fourth film of the gate line.
12. The thin film transistor array panel of claim 11, wherein the second insulating layer further has a second contact hole exposing the uncovered portion of the gate line, and the uncovered portion of the gate line has an edge that coincides with an edge of the second contact hole.
13. The thin film transistor array panel of claim 12, further comprising a contact assistant disposed on the uncovered portion of the gate line and comprising indium tin oxide or indium zinc oxide.
14. The thin film transistor array panel of claim 13, wherein the pixel electrode comprises indium tin oxide or indium zinc oxide, the third film of the gate line, the first film of the source electrode, and the first film of the drain electrode comprise chromium (Cr), and the fourth film of the gate line, the second film of the source electrode, and the second film of the drain electrode comprise aluminum (Al).
15. The thin film transistor array panel of claim 1, further comprising a protection member disposed between and the spacer and the exposed portion of the semiconductor member.
16. A thin film transistor array panel comprising:
a substrate;
a plurality of gate lines disposed on the substrate;
a first insulating layer disposed on the gate lines;
a semiconductor layer formed on the gate insulating layer;
a plurality of ohmic contacts formed on the semiconductor layer;
source and drain electrodes formed on the ohmic contacts, each of the source and drain electrodes comprising a first film and a second film disposed on the first film;
a second insulating layer disposed on the source and the drain electrodes and having a plurality of first contact holes exposing portions of the drain electrodes and portions of the gate insulating layer adjacent thereto and a plurality of openings exposing first portions of the semiconductor layer;
a plurality of pixel electrodes formed on the second insulating layer and contacting the first films of the drain electrodes through the first contact holes; and
first and second columnar spacers formed on the exposed first portions of the semiconductor layer and having different heights.