1. An optoelectronic device comprising:
a doped semiconductor substrate of a first conductivity type;
pads (54) or a layer, on a surface (16 ) of the substrate, doped with a second conductivity type opposite to the first type;
wire-shaped, conical, or tapered semiconductor elements, doped with the first conductivity type, each element resting on one of the pads or on the layer;
light-emitting semiconductor portions, each portion at least partially covering one of the semiconductor elements; and
a circuit for biasing the pads or the layer,
wherein the substrate is made of a semiconductor material selected from the group comprising silicon, germanium, silicon carbide, a III-V compound, a II-VI compound, and a combination of these compounds, and wherein the pads or the layer are made of a material selected from the group comprising aluminum nitride, boron nitride, silicon carbide, magnesium nitride, magnesium gallium nitride, or a combination thereof and of their nitrided compounds.
2. The optoelectronic device of claim 1, further comprising a circuit for biasing the semiconductor portions.
3. The optoelectronic device of claim 1, wherein the dopant concentration of the pads or of the layer is in the range from 1015 atomscm3 to 1019 atomscm3.
4. The optoelectronic device of claim 1, wherein the dopant concentration of the substrate is in the range from 1016 atomscm3 to 1021 atomscm3.
5. The optoelectronic device of claim 1, wherein the dopant concentration of each semiconductor element is in the range from 1016 atomscm3 to 1021 atomscm3.
6. The optoelectronic device of claim 1, wherein the thickness of each pad or of the layer is in the range from 1 nm to 1 \u03bcm.
7. The optoelectronic device of claim 1, wherein the substrate is made of single-crystal silicon.
8. The optoelectronic device of claim 1, wherein each semiconductor element mainly comprises a semiconductor material selected from the group comprising a III-V compound, a II-VI compound, and a combination of these compounds.
9. The optoelectronic device of claim 1, wherein each semiconductor element is a microwire or a nanowire.
10. The optoelectronic device of claim 1, wherein each semiconductor element is at least partially covered with a semiconductor structure capable of emitting light.
11. A method of manufacturing an optoelectronic device, comprising the successive steps of:
providing a doped semiconductor substrate of a first conductivity type;
forming, on a surface of the substrate, a layer or pads, doped with a second conductivity type opposite to the first type;
forming wire-shaped, conical, or tapered semiconductor elements, doped with the first conductivity type, each semiconductor element resting on one of the pads or on the layer;
forming light-emitting semiconductor portions, each portion at least partially covering one of the semiconductor elements; and
providing a circuit for biasing the pads or the layer,
wherein the substrate is made of a semiconductor material selected from the group comprising silicon, germanium, silicon carbide, a III-V compound, a II-VI compound, and a combination of these compounds and wherein the pads or the layer are made of a material selected from the group comprising alumi-num nitride, boron nitride, silicon carbide, magnesium nitride, magnesium gallium nitride, or a combination thereof and of their nitrided compounds.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A wireless communications terminal comprising:
a housing having an interior surface that is configured to enclose at least a controller circuit, a transceiver circuit, and a RF feed circuit and is configured to at least partially enclose a display device and a user input interface, wherein the housing extends between opposing top and bottom surfaces, between opposing first and second side surfaces, and between opposing front and back surfaces;
a first radiator line that is connected on distal ends to a feed node and to a ground node and extends in a loop across at least a majority of a width of the housing between the first and second side surfaces, wherein the first radiator line is configured to resonate in a first frequency range responsive to first electromagnetic radiation coupled to the feed and ground nodes;
a second radiator line that is connected to the feed node and extends away from an adjacent portion of the first radiator line, wherein the second radiator line is configured to resonate in a second frequency range responsive to second electromagnetic radiation coupled to the feed and ground nodes; and
a third radiator line that is connected to the first radiator line at a branch node that is spaced apart from the feed node and the ground node, wherein the third radiator line extends away from an adjacent portion of the first radiator line and is configured to resonate in a third frequency range responsive to third electromagnetic radiation coupled to the feed and ground nodes, wherein the first, second, and third frequency ranges are different from one another.
2. The wireless communications terminal of claim 1, wherein:
the first radiator line extends from the feed node, which is adjacent to the first side surface, through a central region of the housing and the branch node, which is adjacent to the second side surface, and loops back to the ground node, which is adjacent to the first side surface.
3. The wireless communications terminal of claim 1, wherein:
the first, second, and third radiator lines are integrally formed as a single layer on a flexible film surface.
4. The wireless communication terminal of claim 1, wherein:
the first, second, and third radiator lines extend along a single flexible film surface;
the first radiator line extends on the flexible film surface across the terminal and is fixedly attached to the top surface or the bottom surface; and
the second and third radiator lines extend on the flexible film surface along and are fixedly attached to at least one side surface of the housing.
5. The wireless communication terminal of claim 4, wherein:
the second and third radiator lines extend on the flexible film surface along and are fixedly attached to opposite side surfaces of the housing.
6. The wireless communications terminal of claim 1, further comprising:
a printed circuit board that electrically connects and fixedly supports the controller circuit, the transceiver circuit, and the RF feed circuit, the printed circuit board having opposing major surfaces,
wherein the first, second, and third radiator lines do not overlap either of the opposing major surfaces of the printed circuit board.
7. The wireless communications terminal of claim 6, wherein:
the first, second, and third radiator lines are located in a bottom portion of the housing relative to how the housing is held by a user during voice communications through the enclosed controller, transceiver, and RF feed circuits, and the first, second, and third radiator lines are spaced apart from an edge of the printed circuit board.
8. The wireless communications terminal of claim 6, wherein:
the first, second, and third radiator lines are located in a top portion of the housing relative to how the housing is held by a user during voice communications through the enclosed controller, transceiver, and RF feed circuits, and the first, second, and third radiator lines are spaced apart from an edge of the printed circuit board.
9. The wireless communications terminal of claim 1, wherein:
the third radiator line is connected to the branch node midway along a length of the first radiator line between the feed node and the ground node.
10. The wireless communications terminal of claim 1, wherein:
the first radiator line extends to the ground node adjacent to one of the front and back housing surfaces, the second radiator line extends along the first side housing surface and along the other one of the front and back housing surfaces that is opposite the ground node, and the third radiator line extends along the second side housing surface and along the same one of the front and back housing surfaces as the second radiator line.
11. The wireless communications terminal of claim 10, wherein:
a portion of the first radiator line is fixedly connected to and supported by the one of the front and back interior housing surfaces that is adjacent to the ground node;
a majority of the second radiator line is fixedly connected to and supported by both the first side interior housing surface and the other one of the front and back interior housing surfaces that is opposite to that adjacent the ground node; and
the third radiator line is fixedly connected to and supported by both the second side interior housing surface and the same one of the front and back interior housing surfaces as the second radiator line.
12. The wireless communications terminal of claim 11, wherein:
the second and third radiator lines extend in opposite directions toward each other along at least a quarter of the one of the front and back interior housing surfaces that is opposite to that adjacent the ground node.
13. The wireless communications terminal of claim 1, wherein:
the first radiator line extends to the ground node adjacent to one of the front and back housing surfaces, the second radiator line extends along the first side housing surface and along the other one of the front and back housing surfaces that is opposite to that adjacent the ground node, and the third radiator line extends along the second side housing surface and along the same one of the front and back surfaces as the ground node.
14. The wireless communications terminal of claim 13, wherein:
a portion of the first radiator line is fixedly connected to and supported by the one of the front and back interior housing surfaces that is adjacent to the ground node;
a majority of the second radiator line is fixedly connected to and supported by both the first side interior housing surface and the other one of the front and back interior housing surfaces that is opposite to that adjacent the ground node; and
the third radiator line is fixedly connected to and supported by both the second side interior housing surface and the same one of the front and back interior housing surfaces that is adjacent to the ground node.
15. The wireless communications terminal of claim 14, wherein:
the second and third radiator lines extend in opposite directions toward each other along at least a quarter of respective ones of the front and back interior housing surfaces.
16. The wireless communications terminal of claim 1, wherein:
the first frequency range resonated by the first radiator line is a higher frequency range than the second and third frequency ranges; and
the second frequency range resonated by the second radiator line is a higher frequency range than the third frequency range.
17. The wireless communications terminal of claim 16, wherein:
a length of the first radiator line between the feed node and the ground node is at least twice as long as a length of the second radiator line and a length of the third radiator line.
18. The wireless communications terminal of claim 16, wherein:
the first frequency range resonated by the first radiator line is in a frequency range between 2000 and 2700 MHz;
the second frequency range resonated by the second radiator line is in a frequency range between 800 and 950 MHz; and
the third frequency range resonated by the third radiator line is in a frequency range between 1800 and 2000 MHz.
19. The wireless communications terminal of claim 18, wherein:
the first frequency range resonated by the first radiator line includes 2100 MHz;
the second frequency range resonated by the second radiator line includes 850 MHz; and
the third frequency range resonated by the third radiator line includes 1800 MHz.
20. A wireless communications terminal comprising:
a housing having an interior surface that is configured to enclose at least a controller circuit, a transceiver circuit, and a RF feed circuit and is configured to at least partially enclose a display device and a user input interface, wherein the housing extends between opposing top and bottom surfaces, between opposing first and second side surfaces, and between opposing front and back surfaces;
a first radiator line that extends from a feed node that is adjacent to the first side surface through a central region of the housing and a branch location adjacent to the second side surface and loops back to a ground node that is adjacent to the first side surface, wherein the first radiator line is configured to resonate in a first frequency range responsive to first electromagnetic radiation coupled to the feed and ground nodes, and wherein a portion of the first radiator line is fixedly connected to and supported by the one of the front and back interior housing surfaces that is adjacent to the ground node;
a second radiator line that is integrally connected to the first radiator line at the feed node and extends away from the ground node toward the frontback surface of the housing, wherein the second radiator line is configured to resonate in a second frequency range responsive to second electromagnetic radiation coupled to the feed and ground nodes, wherein a majority of the second radiator line is fixedly connected to and supported by both the first side interior housing surface and the other one of the front and back interior housing surfaces that is opposite the ground node;
a third radiator line that is integrally connected to the branch node and extends away from an adjacent portion of the first radiator line, wherein the third radiator line is configured to resonate in a third frequency range responsive to third electromagnetic radiation coupled to the feed and ground nodes, wherein the first, second, and third frequency ranges are different from one another, and wherein the third radiator line is fixedly connected to and supported by both the second side interior housing surface and the same one of the front and back interior housing surfaces as the second radiator line;
a printed circuit board that electrically connects and fixedly supports the controller, transceiver, and RF feed circuits, the printed circuit board having opposing major surfaces, wherein the first, second, and third radiator lines are located in a bottom portion of the housing relative to how the housing is held by a user during voice communications through the enclosed controller, transceiver, and RF feed circuits, and the first, second, and third radiator lines are spaced apart from an edge of the printed circuit board.