1. A commercial dishwasher comprising:
a treatment region in the form of a treatment chamber or a treatment zone for treating items to be washed;
spray nozzles for spraying liquid into the treatment region;
at least one tank for providing liquid to the spray nozzles;
a pump arrangement including at least an upstream centrifugal pump and a downstream centrifugal pump arranged hydraulically in series for conveying liquid from the tank to the spray nozzles; and
a control device for selectively operating only one of the upstream centrifugal pump or the downstream centrifugal pump or both the upstream centrifugal pump and the downstream centrifugal pump in order to selectively generate different liquid pressures.
2. The dishwasher according to claim 1, characterized in that the suction side of the upstream centrifugal pump is connected to receive liquid from the tank, and the pressure side of the downstream centrifugal pump is connected to deliver liquid to the spray nozzles.
3. The dishwasher according to claim 1, characterized in that the control device is operable to selectively switch on the upstream centrifugal pump without switching on any other pump in the pump arrangement.
4. The dishwasher according to claim 1, characterized in that the control device is operable to selectively switch on the downstream centrifugal pump without switching on any other pump in the pump arrangement.
5. The dishwasher according to claim 1, characterized in that the control device is configured to automatically first switch on only one of the upstream or downstream centrifugal pumps and only after a time interval then additionally switch on the other of the upstream or downstream centrifugal pumps for operation hydraulically in series, such that two different liquid pressures are generated one after the other, of which the first liquid pressure is lower than the second liquid pressure.
6. The dishwasher according to claim 5, characterized in that the time interval is defined by a predetermined delay time.
7. The dishwasher according to claim 5, characterized in that the time interval is dependent on a predetermined operating criterion.
8. The dishwasher according to claim 7, characterized in that the predetermined operating criterion is one of the following: type of item to be washed, degree of soiling of the item to be washed, or degree of soiling of the liquid.
9. The dishwasher according to claim 5, characterized in that the control device is configured such that all the centrifugal pumps of the pump arrangement are switched off at the same time.
10. The dishwasher according to claim 5, characterized in that the control device is configured such that the centrifugal pumps of the pump arrangement are switched off one after the other.
11. The dishwasher according to claim 1, characterized in that all the centrifugal pumps of the pump arrangement are designed for the same delivery rate.
12. The dishwasher according to claim 1, characterized in that the upstream centrifugal pump has a different delivery rate than the downstream centrifugal pump.
13. The dishwasher according to claim 1, characterized in that the upstream centrifugal pump and the downstream centrifugal pump have identical pump characteristic curves.
14. The dishwasher according to claim 1, characterized in that the upstream centrifugal pump has a different pump characteristic curve than the downstream centrifugal pump.
15. The dishwasher according to claim 1, characterized in that the dishwasher is a program-controlled dishwasher and the treatment region is a treatment chamber into which the items to be washed can be manually inserted.
16. The dishwasher according to claim 1, characterized in that the dishwasher is a conveyor-type dishwasher, the treatment region is a first treatment zone, at least a second treatment zone is provided, and a delivery apparatus is provided for automatically transporting items being washed through the treatment zones.
17. The dishwasher according to claim 1, characterized in that the treatment region is a wash chamber or a wash zone and the liquid is wash liquid.
18. The dishwasher according to claim 1, characterized in that the treatment region is a final rinse chamber or a final rinse zone and the liquid is final rinse liquid.
19. A method for operating a commercial dishwasher according to claim 1, characterized by a step of automatically varying liquid pressure at the spray nozzles by program-controlled selective actuation of one or both of the upstream centrifugal pump andor the downstream centrifugal pump.
20. A method for operating a commercial dishwasher, comprising the steps of:
providing a commercial dishwasher having
a treatment region for receiving and treating items to be washed,
spray nozzles for spraying liquid onto items in the treatment region,
at least one tank for providing liquid to the spray nozzles, and
a pump arrangement including at least first and second centrifugal pumps arranged hydraulically in series for conveying liquid from the tank to the spray nozzles; and
automatically varying liquid pressure of liquid that is sprayed into the treatment chamber by program-controlled selective actuation of:
just one of the first centrifugal pump or the second centrifugal pump during a certain time; and
both the first centrifugal pump and the second centrifugal pump at another time.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method of fabricating a semiconductor light emitting device comprising:
placing a suspension comprising particles suspended in solvent on at least a portion of a light emitting surface of a semiconductor light emitting element;
confining the suspension for controlled evaporation on at least a portion of the light emitting surface; and
evaporating at least some of the solvent to cause the particles to deposit on the at least a portion of the light emitting surface and form a coating thereon comprising the particles.
2. A method according to claim 1, wherein said particles comprise phosphor particles.
3. A method according to claim 1 wherein said suspension is confined in a cavity on the light emitting surface, and wherein placing comprises placing the suspension comprising phosphor particles suspended in solvent in the cavity.
4. A method according to claim 1 further comprising:
agitating the suspension comprising phosphor particles suspended in solvent while performing the placing andor the evaporating.
5. A method according to claim 1 wherein evaporating comprises evaporating at least some of the solvent to cause the particles to uniformly deposit on the at least a portion of the light emitting surface and form a uniform coating thereon comprising the particles.
6. A method according to claim 1 wherein evaporating comprises evaporating substantially all of the solvent to cause the phosphor particles to deposit on the at least a portion of the light emitting surface and form a coating thereon comprising the phosphor particles.
7. A method according to claim 1:
wherein placing comprises placing a suspension comprising particles suspended in solvent and binder on at least a portion of a light emitting surface of a semiconductor light emitting element; and
wherein evaporating comprises evaporating at least some of the solvent to cause the particles and the binder to deposit on the at least a portion of the light emitting surface and form a coating thereon comprising the particles and the binder.
8. A method according to claim 1:
wherein placing comprises placing a suspension comprising phosphor particles and light scattering particles suspended in solvent on at least a portion of a light emitting surface of a semiconductor light emitting surface; and
wherein evaporating comprises evaporating at least some of the solvent to cause the phosphor particles and the light scattering particles to deposit on the at least a portion of the light emitting element and form a coating thereon comprising the phosphor particles and the light scattering particles.
9. A method according to claim 3 wherein placing is preceded by:
providing a mounting substrate for a semiconductor light emitting device including the cavity therein; and
mounting the semiconductor light emitting element in the cavity.
10. A method according to claim 3 wherein the cavity includes a cavity floor, wherein the light emitting element is on the cavity floor, wherein the light emitting surface protrudes away from the cavity floor and wherein evaporating comprises:
evaporating at least some of the solvent to cause the phosphor particles to deposit on at least a portion of the light emitting surface that protrudes away from the cavity floor and on at least a portion of the cavity floor and form a coating thereon comprising the phosphor particles.
11. A method according to claim 3 wherein the cavity includes a cavity floor, wherein the light emitting element is on the cavity floor, wherein the light emitting surface protrudes away from the cavity floor and wherein evaporating comprises:
evaporating at least some of the solvent to cause the phosphor particles to uniformly deposit on at least a portion of the light emitting surface that protrudes away from the cavity floor and on at least a portion of the cavity floor and thereby form a coating thereon comprising the phosphor particles.
12. A method according to claim 1 wherein evaporating comprises:
evaporating substantially all of the solvent to cause the phosphor particles to uniformly deposit on all the light emitting surface and form a coating thereon comprising the phosphor particles.
13. A method according to claim 1 wherein the solvent comprises Methyl Ethyl Ketone (MEK), alcohol, toluene andor Amyl Acetate.
14. A method according to claim 7 wherein the binder comprises cellulose.
15. A method according to claim 8 wherein the light scattering particles comprise SiO2 particles.
16. A method according to claim 1 wherein the light emitting surface includes a face and a sidewall that extends from the face, and wherein evaporating comprises evaporating substantially all of the solvent to cause the phosphor particles to uniformly deposit on all the light emitting surface, including on all the face and on all the sidewall and form a coating thereon comprising the phosphor particles.
17. A method according to claim 3 wherein the cavity includes a cavity floor, wherein the light emitting surface includes a face remote from the cavity floor and a sidewall that extends from the face to the cavity floor, and wherein evaporating comprises evaporating substantially all of the solvent to cause the phosphor particles to uniformly deposit on all the light emitting surface, including on all the face and on all the sidewall and form a coating thereon comprising the phosphor particles.
18. A method according to claim 1 wherein the phosphor is configured to convert at least some light that is emitted from the light emitting surface such that light that emerges from the semiconductor light emitting device appears as white light.
19. A solid state emitter chip comprising:
a solid state emitter;
a coating over said solid state emitter, wherein said coating is formed by placing a suspension comprising particles suspended in a solvent on at least a portion of the light emitting surface of said solid state emitter and where at least some of the solvent is evaporated to cause the particles to deposit on and form said coating on said at least a portion of the light emitting surface.
20. The emitter chip of claim 19, wherein said solid state emitter comprises a light emitting diode (LED).
21. The emitter chip of claim 19, wherein said suspension is confined for controlled evaporation on at least a portion of said light emitting surface.
22. The emitter chip of claim 19, wherein said particles comprise phosphor particles.
23. The emitter chip of claim 19, said coating further comprising a binder.
24. The emitter chip of claim 23, wherein said binder is in said suspension with said particles, wherein evaporating said at least some solvent causes the particles and binder to deposit on and form said coating.
25. The emitter chip of claim 24, wherein said binder comprises cellulose.
26. The emitter chip of claim 19, wherein said coating comprises light scattering particles.
27. The emitter chip of claim 19, further comprising a mounting substrate including a cavity therein, said emitter within said cavity.
28. The emitter chip of claim 20, wherein said phosphor is configured to convert at least some light that is emitted from said light emitting surface such that light that is emitted from said chip appears as white light.
29. The emitter chip of claim 19, wherein said coating has a substantially uniform thickness.
30. The emitter chip of claim 19, wherein said coating has a substantially uniform particle concentration.