1. A margin design apparatus, comprising:
a storage for recording the information about locations where the deterioration of communication quality or radio wave quality has been confirmed in relation with the information about radio wave condition at the location;
an estimating means for estimating a radio wave quality at the location which is picked up as the location which has the same radio wave condition from said storage wherein information relating to location where deterioration of communication quality or radio wave quality is confirmed, with a radio wave propagation simulator; and
a margin calculating means for calculating a margin of radio wave quality estimation value based on said estimated radio wave quality and revising a radio wave quality distribution of the design target area based on the margin.
2. A margin design apparatus according to claim 1, wherein said margin calculating means calculates statistic values based on said estimated radio wave quality at the location which has the same information about the radio wave condition and calculate a margin of the radio wave quality estimation values comparing the statistic values with a prescribed threshold.
3. A margin design apparatus according to claim 2, wherein said statistic values are calculated from a cumulative probability distribution of said estimated radio wave quality.
4. A margin design apparatus according to claim 2, wherein said statistic value is one of an average, a median or a mode of said estimated radio wave quality.
5. A margin design apparatus according to claim 1, wherein said estimating means picks up said location which has the same information about the radio wave condition from an area which is included in at least one of the design target area, the area adjoining the design target area and the area whose geographic characteristics belongs to the same category as those of the design target area.
6. A margin design apparatus according to claim 1, wherein said estimating means picks up said location which has the same information about the radio wave condition from indoors or outdoors.
7. A margin design apparatus according to claim 1, wherein the radio wave quality estimated by said estimating means is a Received Signal Code Power (RSCP) or a ratio of energy per chip of a desired wave to in-band received power density (EcNO).
8. A margin design apparatus according to claim 1, wherein the location where said estimating means estimates the radio wave quality is the location where its radio wave condition is the out of service.
9. A margin design system, comprising:
a storage for recording information about locations where the deterioration of communication quality or radio wave quality was confirmed in relation with that about radio wave condition at the location;
an estimating means for estimating a radio wave quality at the location which is picked up as the location which has the same radio wave condition from said storage wherein information relating to location where deterioration of communication quality or radio wave quality is confirmed, with a radio wave propagation simulator; and
a margin calculating means for calculating a margin of radio wave quality estimation value based on said estimated radio wave quality and revising a radio wave quality distribution of a design target area based on the margin.
10. A margin design method, comprising:
an estimating step of estimating radio wave quality at the location which is picked up as the location which has the same radio wave condition from a storage wherein information relating to location where deterioration of communication quality or radio wave quality is confirmed and information relating to the radio wave condition at said location are associated with each other, with a radio wave propagation simulator; and
a margin calculating step of calculating a margin of radio wave quality estimation value based on said estimated radio wave quality.
11. A margin design method according to claim 10, wherein said margin calculating step comprises calculating statistic values based on said estimated radio wave quality at the location which has the same information about the radio wave condition, and calculating a margin of the radio wave quality estimation values comparing the statistic values with a prescribed threshold.
12. A margin design method according to claim 11, wherein said margin calculating step comprises calculating statistic values from a cumulative probability distribution of said estimated radio wave quality at the location which has the same information about the radio wave condition.
13. A margin design method according to claim 11, wherein said margin calculating step comprises calculating an average, a median or a mode as a statistic value of said estimated radio wave quality at the location which has the same information about the radio wave condition.
14. A margin design method according to claim 10, wherein said estimating step comprises picking up said location which has the same information about the radio wave condition, from an area which is included in at least one of the design target area, the area adjoining the design target area and the area whose geographic characteristics belongs to the same category as those of the design target area.
15. A margin design method according to claim 10, wherein said estimating step comprises picking up said location which has the same information about the radio wave condition from indoors or outdoors.
16. A margin design method according to claim 10, wherein the radio wave quality estimated in said estimating step is a Received Signal Code Power (RSCP) or a ratio of energy per chip of a desired wave to in-band received power density (EcNO).
17. A margin design method according to claim 10, wherein the location whose radio wave quality is estimated in said estimating step is the location where its radio wave condition is the out of service.
18. A non-transitory computer readable storage medium storing program for a margin design apparatus, said program makes said margin design apparatus execute:
an estimating processing of estimating radio wave quality at the location which is picked up as the location which has the same radio wave condition from a storage wherein information relating to location where deterioration of communication quality or radio wave quality is confirmed and information relating to the radio wave condition at said location are associated with each other, with a radio wave propagation simulator; and
a margin calculating processing of calculating a margin of radio wave quality estimation value based on said estimated radio wave quality.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A semiconductor package, comprising:
a micro electro mechanical system (MEMS) chip;
a cap provided on the MEMS chip;
an electronic element provided on the cap including a plurality of first conductive pads and second conductive pads;
a plurality of first conductive elements electrically connected to the first conductive pads and the MEMS chip;
a plurality of second conductive elements disposed on the second conductive pads; and
an encapsulant encapsulating the MEMS chip, the cap, the electronic element, the first conductive elements and the second conductive elements, and the second conductive elements being exposed from the encapsulant.
2. The semiconductor package of claim 1, further comprising a circuit layer disposed on the encapsulant, and including a plurality of pads.
3. The semiconductor package of claim 2, further comprising conductive elements or pins disposed on the pads of the circuit layer.
4. The semiconductor package of claim 1, wherein the first conductive elements are bonding wires.
5. The semiconductor package of claim 1, wherein the second conductive elements are metal studs, solder, bonding wires or metal pillars.
6. The semiconductor package of claim 1, wherein the electronic element is arranged on the cap in a staggered manner.
7. The semiconductor package of claim 1, wherein the second conductive elements has a height less than 100 \u03bcm.
8. The semiconductor package of claim 1, wherein the electronic element is an application specific integrated circuit (ASIC).
9. A method, comprising:
disposing a cap on a substrate having at least one MEMS element, in a manner that the MEMS element is covered by the cap;
mounting on the cap an electronic element with a plurality of first conductive pads and second conductive pads;
electrically connecting the first conductive pads and the substrate by a plurality of first conductive elements, and disposing a plurality of second conductive elements on the second conductive pads; and
forming an encapsulant on the substrate encapsulating the cap, the electronic element, the first conductive elements and the second conductive elements, with the second conductive elements being exposed from the encapsulant.
10. The method of claim 9, further comprising forming on the encapsulant a circuit layer having a plurality of pads.
11. The method of claim 10, further comprising forming conductive elements or pins on the pads.
12. The method of claim 9, further comprising singulating the substrate to form a plurality of individual semiconductor packages.
13. The method of claim 9, wherein the first conductive elements are bonding wires.
14. The method of claim 9, wherein the second conductive elements are metal studs, solder, bonding wires or metal pillars.
15. The method of claim 9, further comprising grinding a top surface of the encapsulant to expose the second conductive elements from the encapsulant.
16. The method of claim 9, wherein the electronic element is arranged on the cap in a staggered manner.
17. The method of claim 9, wherein the second conductive elements has a height less than 100 \u03bcm.
18. The method of claim 9, wherein the electronic element is an application specific integrated circuit (ASIC).