1. An integrated circuit package, comprising:
a packaging substrate; and
a microelectromechanical systems (MEMS) device embedded in the packaging substrate.
2. The integrated circuit package of claim 1, in which a material in the packaging substrate surrounding the MEMS device comprises a low-stress laminate material.
3. The integrated circuit package of claim 2, in which the low-stress laminate material is a resin.
4. The integrated circuit package of claim 1, further comprising an embedded die in which the MEMS device is at least partially embedded, the embedded die being embedded in the packaging substrate.
5. The integrated circuit package of claim 4, further comprising a hermetic seal surrounding the MEMS device, the hermetic seal having a surface opposing a support surface of the packaging substrate that supports a surface mounted die.
6. The integrated circuit package of claim 5, in which the hermetic seal comprises at least one of a nitride, an oxide, and a polymer.
7. The integrated circuit package of claim 5, further comprising interconnect standoffs coupled to the embedded die, the interconnect standoffs reducing stress on the MEMS device.
8. The integrated circuit package of claim 7, in which a distance between the surface of the hermetic seal and the support surface of the packaging substrate corresponds to a length of the interconnect standoffs.
9. The integrated circuit package of claim 8, in which the distance is approximately 30-80 micrometers.
10. The integrated circuit package of claim 1, further comprising at least one surface die mounted on the packaging substrate and coupled to the MEMS device.
11. The integrated circuit package of claim 1, in which the MEMS device is at least one of a switch, a surface acoustic wave filter, and a thin film bulk acoustic resonator.
12. The integrated circuit package of claim 1, in which the integrated circuit package is integrated into at least one of a cell phone, a hand-held personal communication systems (PCS) unit, a portable data unit, and a fixed location data unit
13. A method of manufacturing an integrated circuit (IC) package, the method comprising embedding a microelectromechanical systems (MEMS) device in a packaging substrate.
14. The method of claim 13, in which embedding the MEMS device comprises:
drilling a cavity in a core;
placing an IC including the MEMS devices in the cavity; and
surrounding the IC with a low-stress material.
15. The method of claim 14, in which embedding the MEMS device comprises embedding the MEMS device at a distance below a support surface of the packaging substrate that supports a surface mounted die determined, in part, by a height of a hermetic seal on the MEMS device.
16. The method of claim 15, in which embedding the MEMS device comprises embedding the MEMS device such that the distance the support surface of the hermetic seal on the MEMS device and the support surface of the packaging substrate is approximately 30-80 micrometers.
17. An integrated circuit package, comprising:
a microelectromechanical systems (MEMS) device embedded in a packaging substrate; and
means for reducing stress on the MEMS device.
18. The integrated circuit package of claim 17, in which the stress reducing means comprises means for distancing the MEMS device from a support surface of the packaging substrate.
19. The integrated circuit package of claim 18, in which a distance between the MEMS device and the support surface of the packaging substrate is approximately 30-80 micrometers.
20. The integrated circuit package of claim 17, in which the integrated circuit package is integrated into at least one of a cell phone, a hand-held personal communication systems (PCS) unit, a portable data unit, and a fixed location data unit
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A visual presenting apparatus comprising:
a base;
a support column which is mounted via a pivot shaft on the base so as to be pivotable in a front-rear direction;
a friction braking mechanism which applies a predetermined frictional load to the pivot shaft over a whole range of pivotal movement of the support column;
a power assist mechanism which applies a spring force to the support column thereby to urge the support column rearward;
a video camera head which is mounted on a distal end of the support column and disposed over a document placed on an installation surface of the base, thereby imaging the document, wherein:
the support column mounted on the base is pivotable between a forwardly-tilted position where the support column stands at a forward tilt angle relative to the base and a folded position where the support column is laid rearward along the base;
the power assist mechanism is operatively coupled with the support column when the support column is tilted forward from an upright position where the support column stands substantially upright on the base; and
the power assist mechanism being released from the operatively coupled state with the support column when the support column is tilted rearward from the upright position.
2. The apparatus according to claim 1, wherein:
the power assist mechanism includes a twisted spring having two ends and a hook strip;
one of the ends of the twisted spring is fixed to the base and the other end of the twisted spring is engaged with the hook strip; and
the hook strip is retained in engagement with the twisted spring when the support column is tilted forward beyond the upright position, and the hook strip is disengaged from the twisted spring when the support column is tilted rearward beyond the upright position.
3. The apparatus according to claim 2, further comprising a first bearing plate and a second bearing plate, wherein:
the pivot shaft has two ends and the twisted spring is attached to one of the ends of the pivot shaft, and said one end of the pivot shaft is supported by the first bearing plate fixed to the base and the other end of the pivot shaft is supported by the second bearing plate fixed to the base; and
the friction braking mechanism includes a washer fixed to said other end of the pivot shaft and a disc spring which is attached to the pivot shaft to press the washer against the second bearing plate.
4. The apparatus according to claim 1, further comprising a clicking mechanism which retains the support column at the upright position.