1. A system for dispensing a colored polymerizing composition, the system comprising:
(a) a first tank comprising a first reactive component;
(b) a second tank comprising a second reactive component;
(c) a paint pot comprising a color component;
(d) a dispensing device in fluid communication with the first tank, second tank and paint pot for mixing the first reactive component, second reactive component and color component to produce a colored mixture; and for dispensing the colored mixture from the dispensing device onto a surface to be coated.
2. The system according to claim 1, wherein the dispensing device comprises a dispenser containing a mixing chamber.
3. The systems according to claim 1, wherein the dispensing device comprises a dispenser and a mixing chamber in fluid communication with each other, the mixing chamber abutting the dispenser.
4. The system according to claim 2, wherein the dispenser comprises an atomizer.
5. The system according to claim 3, wherein the dispenser comprises an atomizer.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An electronic component, comprising
a mounting board,
a bump which is located on a mounting surface of the mounting board, and
an acoustic wave device which is located on the bump and is connected to the bump, wherein
the acoustic wave device comprises
an element substrate,
an excitation electrode which is located on a primary surface of the element substrate,
a pad which is located on the primary surface and is connected to the excitation electrode, and
a cover which is located above the excitation electrode and which is formed with a pad exposure portion exposing the pad and comprised of a hole portion or a cut away portion or a combination of the same, wherein
the top surface of the cover is made to face the mounting surface, the bump is located in the pad exposure portion, and the pad is contacted to the bump.
2. The electronic component according to claim 1, further comprising
a mold resin covering the acoustic wave device, wherein
the mold resin is filled between the top surface of the cover and the mounting surface, and between the bump and an inner circumferential surface of the pad exposure portion.
3. The electronic component according to claim 2, wherein
the cover comprises
a ring shaped frame section which is located on the primary surface of the element substrate and surrounds the excitation electrode, and
a lid section which is superimposed on the frame section and closes the frame section,
the pad exposure portion comprises
a first pad exposure portion which is formed in the frame section and is comprised of a hole portion or a cut away portion, and
a second pad exposure portion which is formed in the lid section so as to be communicated with the first pad exposure portion part and is comprised of a hole portion or a cut away portion, and
at least one of an inner surface of the first pad exposure portion and an inner surface of the second pad exposure portion is inclined in a direction whereby it becomes broader the closer to the top surface side of the cover.
4. The electronic component according to claim 2, wherein
the cover comprises
a ring shaped frame section which is located on the primary surface of the element substrate and surrounds the excitation electrode, and
a lid section which is superimposed on the frame section and closes the frame section,
the pad exposure portion comprises
a first pad exposure portion which is formed in the frame section and is comprised of a hole portion or a cut away portion, and
a second pad exposure portion which is formed in the lid section so as to be communicated with the first pad exposure portion and is comprised of a hole portion or a cut away portion, and
at least one of the inner surface of the first pad exposure portion and the inner surface of the second pad exposure portion is inclined in a direction whereby it becomes narrower the closer to the top surface side of the cover.
5. The electronic component according to claim 4, wherein
the inner surface of the second pad exposure portion is inclined in a direction whereby it becomes narrower than the closer to the top surface side of the cover, and
the acoustic wave device further comprises a reinforcing layer which is superimposed on the top surface of the cover, superimposed on the inner side of the frame section in a plan view and is made of a material having a higher Young’s modulus than that of the cover.
6. The electronic component according to claim 2, wherein
the cover comprises
a ring shaped frame section which is located on the primary surface of the element substrate and surrounds the excitation electrode, and
a lid section which is superimposed on the frame section and closes the frame section,
the pad exposure portion comprises
a first pad exposure portion which is formed in the frame section and is comprised of a hole portion or a cut away portion, and
a second pad exposure portion which is formed in the lid section so as to be communicated with the first pad exposure portion and is comprised of a hole portion or a cut away portion,
the inner surface of the first pad exposure portion is inclined in a direction whereby it becomes broader the closer to the top surface side of the cover, and
the inner surface of the second pad exposure portion is inclined in a direction whereby it becomes narrower the closer to the top surface side of the cover.
7. The electronic component according to claim 3, wherein
the mold resin is filled from the first pad exposure portion up to the second pad exposure portion, and
an opening area in the narrowest portion of the second pad exposure portion is larger than an opening area in the broadest portion of the first pad exposure portion.
8. The electronic component according to claim 3, wherein
the second pad exposure portion is comprised of a notch which is communicated with the outside of a side surface of the cover.
9. The electronic component according to claim 1, wherein
a plurality of the pad exposure portions are provided in a plan view of the top surface of the cover, and
at least portion of the pad exposure portions among the plurality of pad exposure portions are connected with each other in the portion on the top surface side of the cover.
10. An acoustic wave device, comprising
an element substrate,
an excitation electrode which is located on a primary surface of the element substrate,
a pad which is located on the primary surface and is connected to the excitation electrode, and
a cover which is located above the excitation electrode, which is formed with pad exposure portion exposing the pad and comprised of a hole portion or a cut away portion or a combination of the same, wherein
the pad exposure portion is communicated with the outside of the side surface of the cover at the top surface side portion of the cover.
11. An acoustic wave device, comprising
an element substrate,
an excitation electrode which is located on a primary surface of the element substrate,
a plurality of pads which are located on the primary surface and are connected to the excitation electrode, and
a cover which is located above the excitation electrode and which is formed with pad exposure portions exposing the plurality of pads and comprised of hole portions or cut away portions or combinations of the same, wherein
at least portion of the plurality of pad exposure portions are connected with each other at the top surface side portion of the cover.
12. The acoustic wave device according to claim 10, wherein
the cover comprises
a ring shaped frame section which is located on the primary surface of the element substrate and surrounds the excitation electrode, and
a lid section which is superimposed on the frame section and closes the frame section, and
the frame section comprises a projection which projecting outward from the outer periphery of the lid section in a plan view.
13. The acoustic wave device according to claim 10, wherein
the cover comprises
a ring shaped frame section which is located on the primary surface of the element substrate and surrounds the excitation electrode, and
a lid section which is superimposed on the frame section and closes the frame section,
the frame section comprises a first edge portion being a rounded edge portion,
the lid section comprises a second edge portion located diagonally upward from the first edge portion and being a rounded edge portion, and
the outer periphery of the second corner portion is located on an inner side from the outer periphery of the first corner portion, and a curvature radius of the second corner portion is larger than a curvature radius of the first corner portion.