1. A telescoping pullout guide for a pullout, the pullout guide configured to be extensible and retractable in a furniture body or household appliance body, the telescoping pullout guide comprising:
a guide rail configured to be fixed on the furniture body or household appliance body;
a fastener to fix the guide rail to the furniture body or household appliance body;
an angled web forming a connection between the guide rail and the fastener, the angled web engaging perforations of the fastener and overlapping an adjoining edge area of the perforations; and
a securing web of the fastener is inserted into an opening of the guide rail.
2. The telescoping pullout guide according to claim 1, wherein the angled web is formed by shaping of a notch in the guide rail.
3. The telescoping pullout guide according to claim 2, wherein the angled web is formed by shaping from a lower leg of the guide rail.
4. The telescoping pullout guide according to claim 1, wherein a free leg of the angled web overlaps an area of the fastener adjoining the perforation.
5. The telescoping pullout guide according to claim 1, wherein the connection between the fastener and the guide rail includes at least two spaced-apart angled webs.
6. The telescoping pullout guide according to claim 4, wherein an end area of the free leg of the angled web is angled to form an insertion bevel.
7. The telescoping pullout guide according to claim 1, wherein the securing web runs transversely to a central longitudinal axis of the guide rail.
8. The telescoping pullout guide according to claim 1, wherein the security web is formed by deformation of an area provided between two punched-out areas provided in the fastener and it engages in an opening of the guide rail.
9. The telescoping pullout guide according to claim 1, wherein the fastener is formed as a fastening angle.
10. The telescoping pullout guide according to claim 1, wherein the fastener is formed as a holding plate whose edge areas are fixed on side walls of the furniture body or the household appliance body.
11. The telescoping pullout guide according to claim 10, wherein the holding plate includes perforations in which the angled web engages in edge areas of the holding plate.
12. The telescoping pullout guide according to claim 11, wherein the edge areas of the holding plate are each fixed on at least one holding web, which at least one holding web is attached or formed on the side walls of the furniture body or household appliance body.
13. The telescoping pullout guide according to claim 12, wherein the edge areas of the holding plate are fixed in one or both of a formfitting and friction-locked manner in a slot formed by two spaced-apart holding webs.
14. The telescoping pullout guide according to claim 10, wherein a connection between the holding plate and the guide rail is formed by the angled web.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method for bonding a CMOS wafer and a MEMS wafer, the CMOS wafer including an integrated circuit, the MEMS wafer including a MEMS device, the method comprising:
depositing a germanium bonding layer on the MEMS wafer;
forming a substantially aluminum bonding layer on the CMOS wafer, wherein the CMOS wafer is placed in a first chuck and the MEMs wafer is placed in a second chuck;
aligning CMOS wafer and the MEMS wafer; and
forming a eutectic bond between the germanium bonding layer on the MEMS wafer and the substantially aluminum metalization bonding layer on the CMOS wafer, wherein the eutectic bond is formed by keeping the CMOS wafer and the MEMS wafer apart until the temperature on each of the top and bottom chucks reaches a first predetermined temperature that is less than 450\xb0 C., inducing forming gas at an atmospheric pressure prior to bonding, providing a vacuum to remove the forming gas, applying a uniform force across the first chuck and the second chuck, and then ramping the temperature over the eutectic point of the aluminumgermanium bond to a second predetermined temperature that is less than 500\xb0 C. for a period not to exceed thirty minutes.
2. The method of claim 1 wherein the CMOS wafer and the MEMs wafer is cleaned before forming the eutectic bond.
3. The method of claim 2, wherein cleaning the CMOS wafer and the MEMS wafer comprises one or more of:
dipping the CMOS wafer and the MEMS wafer in deionized water;
dipping the CMOS wafer and the MEMS wafer in a 50:1 HF solution;
placing the CMOS wafer and the MEMS wafer in a dump rinse; and
placing the CMOS wafer and the MEMS wafer through a spin-rinse-dry process.
4. The method of claim 1, wherein the substantially aluminum metalization bonding layer on the CMOS wafer is a ratio mix of 97.5:2:.5 Al:Si:Cu (Aluminum:Silicon:Copper)
5. The method of claim 1, wherein forming a eutectic bond includes creating a hermetic seal between the CMOS wafer and the MEMS wafer.
6. The method of claim 1 wherein the first predetermined temperature is approximately 420\xb0 C.
7. The method of claim 1 wherein the second predetermined temperature is approximately 450\xb0 C.
8. The method of claim 1 wherein the MEMS layer is doped to provide an ohmic contact to the CMOS once the aluminumgermanium eutectic bond is formed.
9. The method of claim 1 wherein the forming gas is utilized to deoxidize the surfaces of the germanium layer and the aluminum layer to initiate the reflow process of aluminumgermanium eutectic bond.
10. The method of claim 1 wherein the germanium layer can be deposited on a MEMS substrate layer that is highly doped such that the resulting contact with the CMOS wafer is an ohmic contact.