1. A thermoplastic molding composition comprising
(A) 10 to 99 percent of aromatic polycarbonate resin, and
(B) 90 to 1 percent of a vinyl (co)polymer and
(C) 1 to 30 parts per one hundred parts by weight of the total of A and B (pph) of a compound rubber graft copolymer, said graft copolymer being a product of graft polymerization of one or more vinyl monomers onto a compound rubber having a weight average particle diameter of 0.01 to 10 microns and containing 1 to 10% relative to its weight of a polyorganosiloxane rubber component and 90 to 99% relative to its weight of a polyalkyl (meth)acrylate rubber component, said components inseparably entangled.
2. The composition of claim 1, wherein the weight average particle diameter is 0.04 to 1 \u03bcm.
3. The composition of claim 1, wherein the polyorganosiloxane rubber component is present in an amount of 3 to 10 wt. %.
4. The composition of claim 1, wherein the polyorganosiloxane rubber component is present in an amount of 5 to 10 wt. %.
5. The thermoplastic molding composition of claim 1, wherein (A) is present in an amount of 20 to 95 percent, (B) is present in an amount of 8 to 5 percent and (C) is present in an amount of 2 to 25 pph.
6. The thermoplastic molding composition of claim 1, wherein (A) is present in an amount of 40 to 90 percent, (B) is present in an amount of 6 to 10 percent and (C) is present in an amount of 2 to 15 pph.
7. The thermoplastic molding composition of claim 1, wherein the vinyl (co)polymer is a product of polymerization of at least one monomer selected from the group consisting vinyl aromatics, vinyl cyanides, (meth)acrylic acid (C1-C8) alkyl esters, unsaturated carboxylic acids and derivatives of unsaturated carboxylic acids.
8. The thermoplastic molding composition of claim 1, wherein the vinyl (co)polymer is a product of polymerization of at least one monomer selected from the group consisting of styrene, \u03b1-methyl styrene, acrylic acid, methacrylic acid, methacrylic acid (C1 to C4) alkyl ester, acrylonitrile and maleic anhydride.
9. The thermoplastic molding composition of claim 1, wherein the vinyl (co)polymer is a copolymer of
50 to 99 wt. % of at least one monomer selected from the group consisting of vinyl aromatic, ring-substituted vinyl aromatics, methacrylic acid (C1-C8) alkyl esters and
1 to 50 wt. % of at least one monomer selected from the group consisting of vinyl cyanides (meth)acrylic acid (C1-C8) alkyl esters and derivatives of unsaturated carboxylic acids.
10. The thermoplastic molding composition of claim 1, wherein the vinyl (co)polymer is a copolymer styrene and acrylonitrile wherein content of acrylonitrile is 15 to 35 percent relative to the weight of the copolymer.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An electronic unit, comprising:
a thermally conductive electronic base plate having an upper side and an underside;
components, selected from the group consisting of electric components and electronic components, thermally coupled to said base plate;
a cooler section having a cutout formed therein, a ridge with an upper end running in an annularly closed manner along an edge of said cutout, and a leakage passage, said ridge having an inner side which together with said underside of said base plate delimiting a coolant passage; and
a sealing configuration, said underside of said base plate being connected in a coolant-sealing manner to said ridge via said sealing configuration running along said ridge, said sealing configuration having two seals running in an annularly closed manner along said upper end of said ridge and between said two seals a space running in an annularly closed manner is delimited and connected to said leakage passage leading out of said cooler section.
2. The electronic unit according to claim 1, further comprising a housing structure, said upper side of said base plate and said components are sealed against an ingress of coolant by said housing structure and said underside of said base plate is connected in said coolant-sealing manner to said ridge running in said annularly closed manner via said sealing configuration running in said annularly closed manner, said ridge being embodied in an upwardly projecting manner on an upper side of said cooler section and said inner side together with said underside of said base plate and said upper side of said cooler section delimiting said coolant passage.
3. The electronic unit according to claim 1, wherein said base plate is implemented as part of a housing of an electronics module containing at least some of said components.
4. The electronic unit according to claim 1, further comprising a circuit substrate for supporting said components and having an underside, said base plate is a metal plate attached flat to said underside of said circuit substrate.
5. The electronic unit according to claim 1, wherein said coolant passage is configured to take a coolant having a pressure of at least 2 bar.
6. The electronic unit according to claim 1, wherein said ridge has receiving grooves formed therein for receiving said seals.
7. The electronic unit according to claim 1, wherein one of said cooler section and said base plate, connected to said ridge via said sealing configuration, has receiving grooves formed therein for receiving said seals.
8. The electronic unit according to claim 1, wherein:
said sealing configuration is one of a plurality of sealing configurations; and
said base plate is formed of a plurality of separately embodied base plate parts connected to said cooler section via a corresponding one of said sealing configurations.
9. The electronic unit according to claim 1, wherein the electronic unit is a control unit for a motor vehicle.
10. The electronic unit according to claim 1, wherein said coolant passage is configured to take a coolant having a pressure of at least 3 bar.