1. A light emitting diode (LED) light fixture comprising:
a. a printed circuit board (PCB) having a first and second side;
b. at least one LED pad, said at least one LED pad mounted on either said PCB first or second side;
c. a plurality of LEDs mounted on said first side of said PCB in electrical communication with said at least one LED pad; and
d. at least one thermal via positioned adjacent at least one LED of said plurality, wherein said at least one thermal via allows a flow of air between said PCB first and second sides, wherein said at least one thermal via is coated with a plating, and wherein said plating is in conductive thermal communication with said at least one LED pad.
2. A light emitting diode (LED) light fixture comprising:
a. a housing;
b. a power supply mounted adjacent said housing, wherein said power supply is capable of connection to an electrical energy source;
c. a printed circuit board (PCB) mounted within said housing having a first and a second side, wherein said PCB is configured to be connected to said power supply, wherein said PCB comprises:
i. a PCB substrate;
ii. at least one power conductive pathway affixed to said PCB substrate;
iii. at least one ground conductive pathway affixed to said PCB substrate;
iv. at least one LED pad affixed to said PCB substrate;
v. at least one resistor pad affixed to said PCB substrate;
vi. a plurality of electrical lead apertures extending from said PCB first side through said PCB substrate to said PCB second side, wherein said electrical lead apertures a coated with a plating; and
vii. a plurality of thermal vias extending from said PCB first side through said PCB substrate to said PCB second side, wherein said thermal vias are coated with a plating;
d. at least one resistor electrically connected to said at least one power conductive pathway and said at least one resistor pad through two electrical lead apertures of said plurality;
e. at least one LED electrically connected to said at least one LED pad and said at least one resistor pad through two electrical lead apertures of said plurality; and
f. at least one LED electrically connected to at least two adjacent LED pads through two electrical lead apertures of said plurality, wherein said plurality of thermal vias and said at least one LED are configured to dissipate heat through the PCB first side, PCB second side, and said plurality of thermal vias.
3. The LED light fixture according to claim 2 wherein said PCB is further defined as having three LED board sections, wherein each said LED board section is electrically connected to said power supply through a power conductive pathway and a ground conductive pathway.
4. The LED light fixture according to claim 3 wherein each said LED board section is further defined as including a plurality of LED circuits.
5. The LED light fixture according to claim 4 wherein each LED circuit comprises:
a. a first resistor pad on said PCB first side;
b. a second resistor pad on said PCB second side;
c. a first LED pad adjacent said first resistor pad;
d. a second LED pad adjacent said second resistor pad;
e. a resistor electrically connecting said first and second resistor pads to said power conductive pathway;
f. a first LED, wherein said first LED electrically connects said first and second resistor pads to said first and second LED pads; and
g. a plurality of intermediate LED pads, wherein each intermediate LED pad is electrically connected to either an adjacent intermediate LED pad or said ground conductive pathway by at least one intermediate LED.
6. The LED light fixture according to claim 5 wherein said LED circuit is further defined as comprising a total of seven LEDs.
7. The LED light fixture according to claim 6 wherein said plurality of thermal vias is further defined as including three thermal vias for each LED.
8. The LED light fixture according to claim 7 wherein said three thermal vias are positioned on the portion of LED pad having highest amount of thermal energy in the absence of said thermal vias.
9. The LED light fixture according to claim 2 wherein the arrangement of LEDs is non-linear.
10. The LED light fixture according to claim 2 wherein the diameter of said plurality of thermal vias varies from one thermal via to the next.
11. The LED light fixture according to claim 2 wherein said PCB substrate is further defined as being constructed of an epoxy glass.
12. The LED light system according to claim 2, wherein said PCB is further defined as being constructed from a group including glass fiber mat, nonwoven material, resin, FR-2 (Phenolic cotton paper), FR-3 (Cotton paper and epoxy), FR-4 (Woven glass and epoxy), FR-5 (Woven glass and epoxy), FR-6 (Matte glass and polyester), G-10 (Woven glass and epoxy), CEM-1 (Cotton paper and epoxy), CEM-2 (Cotton paper and epoxy), CEM-3 (Woven glass and epoxy), CEM-4 (Woven glass and epoxy), CEM-5 (Woven glass and polyester), polyimide, Teflon, ceramics, and combinations thereof.
13. A light emitting diode (LED) circuit comprising:
a. a printed circuit board (PCB), wherein said PCB has a first and a second side, said PCB comprising:
i. a PCB substrate;
ii. at least one power conductive pathway positioned on either said PCB first or second side configured for electrical connection to a power supply;
iii. at least one ground conductive pathway positioned on either said PCB first or second side configured for electrical connection to a power supply;
iv. at least one resistor pad positioned on either said PCB first or second side;
v. at least one LED pad positioned on either said PCB first or second side;
vi. a plurality of electrical lead apertures, wherein said lead apertures extend from said PCB first side through said PCB substrate to said PCB second side; and
vii. a plurality of thermal vias, wherein each said thermal via extends from said PCB first side through said PCB substrate to said PCB second side, wherein each said thermal via is positioned either in said at least one LED pad or said at least one resistor pad, wherein each said thermal via is coated with a plating, and wherein each said thermal via is in thermal communication with either said at least one LED pad or said at least one resistor pad;
b. at least one resistor, wherein said resistor electrically connects two lead apertures of said plurality of lead apertures;
c. at least one LED, wherein said at least one LED electrically connects two electrical lead apertures of said plurality of electrical lead apertures, wherein said at least one power conductive pathway, at least one ground conductive pathway, at least one resistor pad, at least one LED pad, plurality of electrical lead apertures, at least one resistor, and at least one LED are configured so that a plurality of LEDs may be electrically connected in series.
14. The LED circuit according to claim 12 wherein said LED circuit is further defined as including one resistor pad and twelve LED pads.
15. The LED circuit according to claim 13 wherein said LED circuit is further defined as including seven LEDs electrically connected in series.
16. A printed circuit board (PCB) for a light emitting diode (LED) light fixture, wherein said PCB has a first and second side, said printed circuit board comprising:
a. a PCB substrate;
b. at least one power conductive pathway positioned on at least said PCB first side, wherein said power conductive pathway is configured to be connected to an electrical energy source at a power connection;
c. at least one ground conductive pathway positioned on at least said PCB first side, wherein said power conductive pathway is configured to be connected to an electrical energy source at a ground connection;
d. a first and a second resistor pad, wherein said first resistor pad is positioned on said PCB first side, and wherein said second resistor pad is positioned on said PCB second side;
e. a first and a second LED pad, wherein said first LED pad is positioned on said printed circuit board first side adjacent said first resistor pad, and wherein said second LED pad is positioned on said PCB first side adjacent said second resistor pad;
f. a first, a second, a third, a fourth, a fifth, and a sixth electrical lead aperture, wherein said lead apertures extend from said PCB first side through said PCB substrate to said PCB second side, wherein said first electrical lead aperture is positioned in said power conductive pathway, wherein said second and third electrical lead apertures are positioned in said first and second resistor pads, wherein said fourth and fifth electrical lead apertures are positioned in said first and second LED pads, and wherein said sixth electrical lead aperture is positioned in said ground conductive pathway;
g. at least one resistor, wherein said resistor electrically connects said first electrical lead aperture to said second electrical lead aperture;
h. a first and a second LED, wherein said first and second LEDs have a first and a second LED lead, respectively, wherein said first LED lead of said first LED is positioned within said third electrical lead aperture, wherein said second LED lead of said first LED is positioned within said fourth electrical lead aperture, wherein said first LED lead of said second LED is positioned within said fifth electrical lead aperture, and wherein said second LED lead of said second LED is positioned within said sixth electrical lead aperture; and
i. a plurality of thermal vias, wherein each said thermal via extends from said PCB first side through said PCB substrate to said PCB second side, wherein each said thermal via is positioned either in said first and second LED pads or said first and second resistor pads, and wherein each said thermal via is in thermal communication with either said first and second LED pads or said first and second resistor pads.
17. The PCB according to claim 15 further comprising:
a. a plurality of intermediate LED pads positioned between said first LED pad and said ground conductive pathway on said PCB first side;
b. a plurality of intermediate LED pads positioned on said PCB second side mirroring the position of said plurality of intermediate LEDpas on said PCB first side;
c. a plurality of intermediate LEDs electrically connecting said plurality of intermediate LED pads in series.
18. A method of dissipating heat generated by a light emitting diode (LED) light fixture comprising:
a. placing a plurality of LED pads on a printed circuit board (PCB), wherein said PCB is configured to be connected to a power supply;
b. placing at least one resistor pad on said PCB;
c. attaching at least one resistor to said at least one resistor pad and said power supply;
d. attaching at least one LED to said at least one LED pad of said plurality and to said at least one resistor pad;
e. attaching at least one LED to two adjacent LED pads of said plurality; and
f. positioning at least one thermal via in at least one LED pad of said plurality adjacent said at least one LED such that said at least one thermal via is in thermal communication with said at least one LED pad of said plurality.
19. The method of dissipating heat generated by an LED light fixture according to claim 18 wherein said method further comprises analytically determining what area on said LED pad will possess the most thermal energy during use, and subsequently positioning said at least one thermal via adjacent that area.
20. The method of dissipating heat generated by an LED light fixture according to claim 18 wherein said method further comprises optimizing the number and diameter of said at least one thermal via for cost and heat dissipation efficiency.
21. The method of dissipating heat generated by an LED light fixture according to claim 18 further comprising determining the quantity and magnitude of ambient air flow required to dissipate sufficient heat so that said at least one LED performs optimally.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An optical communications wavelength device for use with wavelength range bands, said device comprising:
an input optical waveguide collimator, said input optical waveguide collimator collimating an input light beam out of an optical waveguide to provide an unguided input light beam including at least one reflective wavelength range band R and at least one wavelengths range band n,
a bulk internal Bragg grating, said bulk Bragg grating comprised of a transparent photosensitive bulk optical grating medium including an internal modulated refractive index grating with a grating pattern for reflecting said at least one wavelength range band R,
at least one output coupler, said output coupler for at least one output wavelength range band,
a substrate structure for securing said bulk Bragg grating relative to said input collimator and said output coupler, said bulk Bragg grating disposed in said unguided input light beam wherein said at least one wavelengths range band n is transmitted through said bulk Bragg grating and said at least one wavelength range band R is reflected by said bulk Bragg grating.
2. An optical wavelength device as claimed in claim 1, wherein said at least one output coupler comprises a reflected output wavelength range band output coupler for outputting said at least one reflective wavelength range band R, said reflected output wavelength range band output coupler disposed relative to said bulk Bragg grating wherein said at least one wavelength range band R is reflected by said bulk Bragg grating to said reflected wavelength band output coupler.
3. An optical wavelength device as claimed in claim 1, wherein said at least one output coupler comprises a transmitted output wavelength range band output coupler for outputting said at least one transmitted wavelength range band n, said transmitted output wavelength range band output coupler disposed relative to said bulk grating wherein said at least one wavelength range band n is transmitted from said bulk Bragg grating to said transmitted wavelength band output coupler.
4. An optical wavelength device as claimed in claim 2, wherein said at least one output coupler further comprises a transmitted output wavelength range band output coupler for outputting said at least one transmitted wavelength range band n said transmitted output wavelength range band output coupler disposed relative to said bulk grating wherein said at least one wavelength range band n is transmitted from said bulk Bragg grating to said transmitted wavelength band output coupler.
5. An optical wavelength device as claimed in claim 1, wherein said transparent photosensitive bulk optical grating medium comprises a photosensitive bulk glass.
6. An optical wavelength device as claimed in claim 5, wherein said photosensitive bulk glass has a 250 nm absorption less than 30 dBcm.
7. An optical wavelength device as claimed in claim 5, wherein said photosensitive bulk glass has a 250 nm absorption less than 20 dBcm.
8. An optical wavelength device as claimed in claim 5, wherein said photosensitive bulk glass has a 250 nm absorption less than 15 dBcm.
9. An optical wavelength device as claimed in claim 5, wherein said photosensitive bulk glass has a 250 nm absorption less than 10 dBcm.
10. An optical wavelength device as claimed in claim 5, wherein said photosensitive bulk glass has a 250 nm absorption less than 5 dBcm.
11. An optical wavelength device as claimed in claim 1, wherein bulk Bragg grating has a refractive index photosensitivity modulation level n>104.
12. An optical device as claimed in claim 11, wherein said index modulation n>2104.
13. An optical device as claimed in claim 5, wherein said glass is an alkali boro-alumino-silicate glass.
14. An optical device as claimed in claim 13, wherein said glass is a melted glass containing germanium.
15. An optical device as claimed in claim 5, wherein said bulk glass is a melted glass with a melting temperature 1650 C.
16. An optical device as claimed in claim 5, wherein said bulk glass is a hydrogen loadable glass.
17. An optical device as claimed in claim 5, wherein said bulk glass is a below 250 nm photosensitive alkali boro-alumino-silicate glass with 70 mole % SiO2,25 mole % B2O3, 2 mole % GeO2,<10 mole % Al2O3 and <10 mole % alkali.
18. An optical device as claimed in claim 17, wherein said glass has a composition of 42-67 mole % SiO2, 2-15 mole % GeO2, 25-36 mole % B2O3, 2-6 mole % Al2O3 and 2-6 mole % R2O, where R is an alkali.
19. An optical device as claimed in claim 1, said unguided input light beam having a collimated beam width BW and said internal modulated refractive index grating having a depth GD wherein GD>BW.
20. An optical device as claimed in claim 1, wherein said device includes a second bulk internal Bragg grating comprised of a transparent photosensitive bulk optical grating medium including a second internal modulated refractive index grating with a grating pattern for reflecting an at least one transmitted wavelength range band n1,
a second reflected output wavelength range band output coupler, said second reflected output coupler for outputting said wavelength range band n1,
said second bulk internal Bragg grating after said R reflecting bulk Bragg grating, said second bulk internal Bragg grating disposed in said unguided input light beam wherein at least one wavelength range band n is transmitted through said second bulk Bragg grating and said wavelength range band n1 is reflected by said second bulk Bragg grating to said second reflected output coupler.
21. An optical device as claimed in claim 20, wherein said device includes a third bulk internal Bragg grating comprised of a transparent photosensitive bulk optical grating medium including a third internal modulated refractive index grating with a grating pattern for reflecting an at least one transmitted wavelength range band n2,
a third reflected output wavelength range band output coupler, said third reflected output coupler for outputting said wavelength range band n2,
said third bulk internal Bragg grating after said second bulk Bragg grating, said third bulk internal Bragg grating disposed in said unguided input light beam wherein at least one wavelength range band is transmitted through said third bulk Bragg grating and said wavelength range band n2 is reflected by said third bulk Bragg grating to said third reflected output coupler.
22. An optical device as claimed in claim 21, wherein said device includes a fourth bulk internal Bragg grating comprised of a transparent photosensitive bulk optical grating medium including a fourth internal modulated refractive index grating with a grating pattern for reflecting an at least one transmitted wavelength range band n3,
a fourth reflected output wavelength range band output coupler, said fourth reflected output coupler for outputting said wavelength range band n3,
said fourth bulk internal Bragg grating after said third bulk Bragg grating, said fourth bulk internal Bragg grating disposed in said unguided input light beam wherein at least one wavelength range band is transmitted through said fourth bulk Bragg grating and said wavelength range band n3 is reflected by said fourth bulk Bragg grating to said fourth reflected output coupler.
23. An optical device as claimed in claim 1, said bulk grating medium having a first entranceexit side and an second entranceexit side, said internal modulated refractive index grating comprised of a plurality of photo-induced grating elements which have a progression from said first side to said second side.
24. An optical device as claimed in claim 23, said unguided input light beam having a beam width BW and said grating medium having a top surface and a bottom surface, said photo-induced grating elements having a grating depth length GD in a direction between the top surface and the bottom surface, with GD>BW.
25. An optical device as claimed in claim 24, wherein said top surface is normal to said first side and said second side.
26. An optical device as claimed in claim 25, wherein said first side is parallel to said second side.
27. An optical device as claimed in claim 23, wherein said first side is.
28. An optical device as claimed in claim 23, wherein said first side includes a curved surface.
29. An optical device as claimed in claim 1, said device including a thin film filter, said thin film filter comprised of a stack of alternating dielectric layers for reflectingtransmitting communications wavelengths.
30. An optical device as claimed in claim 29, said thin film filter positioned in said unguided input light beam after said bulk Bragg grating.
31. An optical device as claimed in claim 29, wherein said thin film filter is deposited on said bulk optical grating medium.
32. An optical device as claimed in claim 23, said device including a thin film filter alternating dielectric layer stack deposited on said first entranceexit side.
33. An optical device as claimed in claim 32, said thin film filter deposited on a portion of said first side.
34. An optical device as claimed in claim 32, said thin film filter covering said first side.
35. An optical device as claimed in claim 23, said device including a thin film filter alternating dielectric layer stack deposited on said second entranceexit side.
36. An optical device as claimed in claim 35, said thin film filter deposited on a portion of said second side.
37. An optical device as claimed in claim 3 5, said thin film filter covering said second side.
38. An optical device as claimed in claim 32, said device including a second thin film filter deposited on said second entranceexit side.
39. an optical device as claimed in claim 16, said glass having a diffusion lowered hydrogen level <1018 H2 moleculescm3.
40. A method of making an optical communications wavelength device, said method comprising:
providing an input optical waveguide collimator for producing a collimated unguided input light beam path,
providing a bulk internal Bragg grating in a transparent photosensitive bulk optical grating medium,
providing a reflected wavelength output coupler and a transmitted wavelength output coupler,
securely disposing said provided bulk internal Bragg grating relative to said input optical waveguide collimator, said reflected wavelength output coupler, said transmitted wavelength output coupler, and in the collimated unguided input light beam path wherein a reflected wavelength is reflected by said bulk internal Bragg grating to said reflected wavelength output coupler and a transmitted wavelength is transmitted through said bulk internal Bragg grating and to said transmitted wavelength output coupler.
41. A method as claimed in claim 40, wherein providing a bulk internal Bragg grating in a transparent photosensitive bulk optical grating medium includes forming a modulated refractive index grating inside the photosensitive bulk optical grating medium with a grating radiation pattern.
42. A method as claimed in claim 40, wherein providing a bulk internal Bragg grating in a transparent photosensitive bulk optical grating medium includes providing a photosensitive bulk glass.
43. A method as claimed in claim 42, wherein providing a photosensitive bulk glass comprises providing a bulk glass with a 250 nm absorption less than 30 dBcm.
44. An optical wavelength device as claimed in claim 41, wherein said photosensitive bulk glass has a 250 nm absorption less than 20 dBcm.
45. An optical wavelength device as claimed in claim 41, wherein said photosensitive bulk glass has a 250 nm absorption less than 15 dBcm.
46. An optical wavelength device as claimed in claim 41, wherein said photosensitive bulk glass has a 250 nm absorption less than 10 dBcm.
47. An optical wavelength device as claimed in claim 41, wherein said photosensitive bulk glass has a 250 nm absorption less than 5 dBcm.
48. A method as claimed in claim 42, wherein providing a glass comprises providing an alkali boro-alumino-silicate glass.
49. A method as claimed in claim 48, wherein providing a glass comprises providing a melted glass containing germanium.
50. A method as claimed in claim 42, wherein providing said bulk glass comprises providing a melted glass with a melting temperature <1650 C.
51. A method as claimed in claim 42, wherein providing said bulk glass comprises providing a hydrogen loaded glass.
52. A method as claimed in claim 41, said method including forming said grating radiation pattern with a below 250 nm light.
53. A method as claimed in claim 41, wherein forming said modulated refractive index grating inside said bulk optical grating medium with a grating radiation pattern includes producing a coherent light beam having a coherence length >50 microns and forming said grating radiation pattern with said coherent light beam.
54. A method as claimed in claim 53, wherein producing said coherent light beam comprises producing a coherent light beam comprises producing a coherent light beam with a coherence length 100 microns.
55. A method as claimed in claim 53, wherein producing said coherent light beam comprises producing a coherent light beam comprises producing a coherent light beam with a coherence length 200 microns.
56. A method as claimed in claim 53, wherein producing said coherent light beam comprises producing a coherent light beam comprises producing a coherent light beam with a coherence length 300 microns.
57. A method as claimed in claim 53, wherein producing said coherent light beam comprises producing a coherent light beam comprises producing a coherent light beam with a coherence length 400 microns.
58. A method as claimed in claim 41, wherein providing said bulk internal Bragg grating in a transparent photosensitive bulk optical grating medium includes providing a bulk optical grating medium with a first entranceexit side and an opposing second entranceexit side with said first entranceexit side proximate said input collimator and said second entranceexit side proximate said transmitted wavelength output coupler, said collimated unguided input light beam path having a beam width BW, said first side having a first side depth height FSH and said second side having a second side depth height SSH, with FSH>BW and SSH>BW.
59. A method as claimed in claim 58, said bulk internal Bragg grating having a grating depth height GD, wherein forming the grating includes producing coherent light beam having a coherence length CL with CL>GD.
60. A method as claimed in claim 58, said bulk internal Bragg grating having a grating depth height GD, wherein forming the grating includes producing a coherent light beam having a coherence length CL with CL2.
61. A method as claimed in claim 59, said bulk optical grating medium including a grating formation coherent light entrance surface normal to said first entranceexit side, said method including providing a grating mask, positioning said mask proximate said grating formation coherent light entrance surface, and transmitting said coherent light beam through said mask and into said bulk optical grating medium.
62. A method as claimed in claim 41, wherein providing said bulk internal Bragg grating includes providing a bulk optical grating medium with a first entranceexit side and an opposing second entranceexit side, a first grating formation coherent light entrance surface and an opposing second grating formation coherent light entrance surface said first and second grating formation coherent light entrance surfaces normal to said first entranceexit side,
providing a multi-mask grating former which includes a first grating phase mask and an opposing second grating phase mask aligned with said first phase mask,
positioning said first grating phase mask proximate said first grating formation coherent light entrance surface and said second grating phase mask proximate said second grating formation coherent light entrance surface,
producing a first coherent light beam and transmitting said first coherent light beam through said first mask and into said bulk optical grating medium and producing a second coherent light beam and transmitting said second coherent light beam through said second mask and into said bulk optical grating medium.
63. A method as claimed in claim 40, said method including:
providing a second bulk internal Bragg grating in a transparent photosensitive bulk optical grating medium for reflecting a second reflect wavelength,
providing a second reflected wavelength output coupler,
securely disposing said provided second bulk internal Bragg grating between said bulk internal Bragg grating and said transmitted wavelength output coupler and in said collimated unguided input light beam path, and relative to said provided second reflected wavelength output coupler wherein said second reflect wavelength is reflected by said second bulk internal Bragg grating to said second reflected wavelength output coupler and a transmitted wavelength is transmitted through said second bulk internal Bragg grating and towards said transmitted wavelength output coupler.
64. A method as claimed in claim 63, said method including:
providing a third bulk internal Bragg grating in a transparent photosensitive bulk optical grating medium for reflecting a third reflect wavelength,
providing a third reflected wavelength output coupler,
securely disposing said provided third bulk internal Bragg grating between said second bulk internal Bragg grating and said transmitted wavelength output coupler and in said collimated unguided input light beam path, and relative to said provided third reflected wavelength output coupler wherein said third reflect wavelength is reflected by said third bulk internal Bragg grating to said third reflected wavelength output coupler and a transmitted wavelength is transmitted through said third bulk internal Bragg grating and towards said transmitted wavelength output coupler.
65. A method as claimed in claim 64, said method including:
providing a fourth bulk internal Bragg grating in a transparent photosensitive bulk optical grating medium for reflecting a fourth reflect wavelength,
providing a fourth reflected wavelength output coupler,
securely disposing said provided fourth bulk internal Bragg grating between said third bulk internal Bragg grating and said transmitted wavelength output coupler and in said collimated unguided input light beam path, and relative to said provided fourth reflected wavelength output coupler wherein said fourth reflect wavelength is reflected by said fourth bulk internal Bragg grating to said fourth reflected wavelength output coupler and a transmitted wavelength is transmitted through said fourth bulk internal Bragg grating and towards said transmitted wavelength output coupler.
66. A method as claimed in claim 40, said method including:
providing a thin film filter, said thin film filter comprised of a stack of alternating dielectric layers,
disposing said thin film filter in said collimated unguided input light beam.
67. A method as claimed in claim 40, said method further comprising depositing a thin film filter alternating dielectric layers stack on said transparent bulk optical grating medium.
68. A method as claimed in claim 42, said method including:
loading said bulk glass with molecular hydrogen,
inhibiting the diffusion of loaded molecular hydrogen out of said bulk glass,
forming a modulated refractive index grating inside the molecular hydrogen bulk glass with a grating radiation pattern.
69. A method as claimed in claim 68, said method including diffusing loaded molecular hydrogen out of the bulk glass after forming said modulated refractive index grating.
70. An optical communications planar integrated waveguide circuit device for operating on communications wavelengths including at least one reflectable wavelength, said device comprising a planar waveguide substrate supporting a waveguiding integrated circuit core and a waveguiding integrated circuit cladding covering said core, said planar waveguide substrate comprised of a transparent photosensitive bulk optical grating medium, said transparent photosensitive bulk optical grating medium containing within it a bulk internal modulated refractive index grating with a grating pattern for reflecting at least one reflectable wavelength, said refractive index grating proximate said core wherein a reflectable wavelength guided by said core is reflected by said refractive index grating.
71. A device as claimed in claim 70, wherein said transparent photosensitive bulk optical grating medium planar substrate comprises a photosensitive bulk glass.
72. A device as claimed in claim 70, wherein said bulk glass planar substrate comprises an alkali boro-alumino-silicate glass.
73. A device as claimed in claim 70, wherein said grating pattern is in a selected portion of said substrate.
74. A device as claimed in claim 70, wherein said substrate includes at least a second grating pattern for reflecting at least a second reflectable wavelength guided by said core.
75. A method of making an optical planar integrated waveguide circuit, said method comprising:
providing a transparent photosensitive bulk optical grating medium planar waveguide substrate having a near core side,
forming a waveguiding integrated circuit core, cladding said core,
forming a bulk internal modulated refractive index grating in said transparent photosensitive bulk optical grating medium planar waveguide substrate proximate said near core side wherein a waveguided wavelength guided by said core is manipulated by said refractive index grating.
76. A method as claimed in claim 75, wherein said bulk optical grating medium planar waveguide substrate comprises providing a photosensitive bulk glass.
77. A method as claimed in claim 76, wherein providing said photosensitive bulk glass comprises providing a alkali boro-alumino-silicate glass.
78. An optical waveguide semiconductor laser device for an optical waveguide communications system, said device comprising:
an optical waveguide system semiconductor laser for producing a reflectable wavelength R utilized in an optical waveguide system,
a bulk internal Bragg laser grating, said bulk Bragg laser grating comprised of a transparent photosensitive bulk optical grating medium including an internal modulated refractive index grating with a grating period for reflecting said wavelength R,
a substrate structure for securing said bulk Bragg laser grating relative to said semiconductor laser wherein said wavelength R produced by said semiconductor laser is reflected by said bulk internal Bragg laser grating back into said semiconductor laser.
79. A device as claimed in claim 78, wherein said transparent photosensitive bulk optical grating medium comprises a photosensitive bulk glass.
80. A device as claimed in claim 79, wherein said bulk glass comprises an alkali boro-alumino-silicate glass.
81. A method of making an optical waveguide semiconductor laser device, said method comprising:
providing a bulk internal Bragg laser grating in a transparent photosensitive bulk optical grating medium,
providing an optical waveguide system semiconductor laser,
securely disposing said bulk optical grating medium relative to said semiconductor laser wherein a wavelength produced by said semiconductor laser is reflected by said bulk internal Bragg laser grating back into said semiconductor laser.
82. A method as claimed in claim 75, wherein providing said bulk internal Bragg laser grating in a transparent photosensitive bulk optical grating medium comprises providing a photosensitive bulk glass.
83. A method as claimed in claim 82, wherein providing said photosensitive bulk glass comprises providing an alkali boro-alumino-silicate glass.
84. An optical communications wavelength optical element for operating on light range bands, said optical element comprised of a transparent photosensitive bulk optical grating medium photosensitive bulk glass, said optical element having at least one optical element optical surface for manipulating light, said bulk glass including an internal modulated refractive index Bragg grating pattern for reflecting at least one wavelength range band.
85. An optical element as claimed in claim 84, said optical element optical surface comprising a curved surface.
86. An optical element as claimed in claim 84, said optical element optical surface comprising a total interal reflecting surface.
87. An optical element as claimed in claim 84, said optical element comprising a lens.
88. An optical element as claimed in claim 84, said optical element comprising a prism.
89. An optical element as claimed in claim 84, said optical element optical surface formed from said bulk glass.
90. An optical element as claimed in claim 84, said optical element optical surface comprised of a transparent optical material attached to said glass.
91. A multi-mask grating former, said grating former comprised of a first grating phase mask and an opposing second grating phase mask and a phase mask spacing structure, said phase mask spacing structure securing said first phase mask away from said second phase mask to provide a photosensitive optical grating medium receiver space for reception of a photosensitive optical grating medium between said first and second masks with said first phase mask in alignment with said second phase mask.
92. A method of making an optical waveguide communications wavelength device, said method comprising:
providing an input optical waveguide collimator for producing a collimated unguided input light beam path from an optical waveguide,
providing a bulk internal Bragg grating in a transparent photosensitive bulk optical grating medium,
providing a wavelength output waveguide coupler,
securely disposing said provided bulk internal Bragg grating relative to said input optical waveguide collimator, said output coupler, and in the collimated unguided input light beam path wherein a reflected wavelength is reflected by said bulk internal Bragg grating and a transmitted wavelength is transmitted through said bulk internal Bragg grating.