1. A fixing device, comprising:
a main body, comprising a bolting structure for bolting with a component element;
at least two sliding location elements, disposed on one side of the main body opposite the bolting structure, each sliding location element comprising a connecting portion and an extending portion, the connecting portion being connected to the main body, the extending portion being connected to the connecting portion and to being substantially parallel to the main body, and a spacing being kept between the main body and the extending portion for clamping and fixing a printed circuit board; and
at least one location element, extended from the main body and being substantially parallel to the extending portion, the at least one location element being disposed between the at least two sliding location elements and the bolting structure for fixing the printed circuit board.
2. The fixing device as claimed in claim 1, wherein the extending portions and the at least one location element extend substantially towards a same direction.
3. The fixing device as claimed in claim 1, wherein the extending portions and the at least one location element extend substantially along opposite directions.
4. The fixing device as claimed in claim 1, wherein the main body further comprises a set of elastic manipulator structures disposed between the at least two sliding location elements and the bolting structure.
5. The fixing device as claimed in claim 1, wherein the main body further comprises a conductive and elastic element for providing a grounding function.
6. The fixing device as claimed in claim 1, wherein a width of the spacing is not less than a thickness of the printed circuit board.
7. An electronic apparatus, comprising:
an component element;
a printed circuit board; and
at least one fixing device, fixed to the printed circuit board, each fixing device comprising:
a main body, comprising a bolting structure for bolting with the component element;
is at least two sliding location elements, disposed on one side of the main body opposite the bolting structure, each sliding location elements comprising a connecting portion and an extending portion, the connecting portion being connected to the main body, the extending portion extending from the connecting portion and being substantially parallel to the main body, and a spacing being kept between the main body and the extending portion for clamping and fixing the printed circuit board; and
at least one location element, extended from the main body and being substantially parallel to the extending portion, the at least one location element being disposed between the at least two sliding location elements and the bolting structure for fixing the printed circuit board.
8. The electronic apparatus as claimed in claim 7, wherein the extending portions and the at least one location element extend substantially towards a same direction.
9. The electronic apparatus as claimed in claim 7, wherein the extending portion and the at least one location element extend substantially along opposite directions.
10. The electronic apparatus as claimed in claim 7, wherein the main body further comprises a set of elastic arm structures disposed between the at least two sliding location elements and the bolting structure.
11. The electronic apparatus as claimed in claim 7, wherein the main body further comprises a conductive and elastic element for providing a grounding function.
12. The electronic apparatus as claimed in claim 7, wherein a width of the spacing is not less than a thickness of the printed circuit board.
13. The electronic apparatus as claimed in claim 7, wherein the printed circuit board comprises at least one set of slots, and each set of slots comprises at least two sliding slots corresponding to the at least two sliding location elements and at least one location slot corresponding to the at least one location element.
14. The electronic apparatus as claimed in claim 13, wherein a length of each sliding slot is not less than a length of the extending portion.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method of crystallising a semiconductor film deposited on a supporting substrate comprising the steps of:
(a) with a laser, exposing each of a series of discrete regions of the semiconductor film to one or more laser beam pulses (an exposure);
(b) monitoring the energy output of the laser; and
(c) if the energy output of the laser during an exposure of a discrete region exceeds a predetermined threshold (an over-exposure), reexposing that discrete region to one or more laser beam pulses (a re-exposure).
2. A method according to claim 1 wherein each exposure is intended to heat a discrete region to a near-melt-through condition.
3. A method according to claim 1 or claim 2 wherein the predetermined threshold is set at between 105% and 115% of the energy intended for an exposure.
4. A method according to claim 3 wherein the predetermined threshold is set at between 107% and 110% of the energy intended for an exposure.
5. A method according to any claim 1 or claim 2 wherein the predetermined threshold is set at or above the energy output required to heat a discrete region to a near full-melt-through condition.
6. A method according to claim 5 wherein in the event of an over-exposure of a discrete region, that discrete region is allowed to completely solidify prior to re-exposure.
7. A method according to any preceding claim wherein at least some of the discrete regions of the semiconductor film overlap.
8. A method according to any preceding claim wherein the laser produces a long thin laser beam capable of being scanned over the semiconductor film in a stepped fashion, thereby defining the discrete regions of the semiconductor film.
9. A method according to claim 8 wherein the laser beam is stepped over the semiconductor film, sequential exposing discrete regions of the semiconductor film wherein in the event of an over-exposure of a discrete region, that discrete region is re-exposed prior to stepping to an adjacent discrete region.
10. A method according to claim 8 wherein the laser beam is stepped over the semiconductor film, sequentially exposing discrete regions of the semiconductor film wherein in the event of an over-exposure of a discrete region, that discrete region is re-exposed prior to exposing an adjacent discrete region.
11. A method of crystallising a semiconductor film as hereinbefore described with reference to accompanying FIGS. 1A to 1C.
12. A semiconductor film crystallised by a method according to any preceding claim.
13. A method of manufacturing a thin film transistor (TFT) comprising source and drain electrodes joined by a semiconductor channel, a gate insulating layer and a gate electrode, wherein the semiconductor channel was formed from a semiconductor film crystallised by a method according to claims 1 to 11.
14. A method of manufacturing a thin film transistor (TFT) substantially as hereinbefore described with reference to the accompanying figures.
15. A TFT manufactured by a method according to claim 13 or claim 14.
16. An active matrix device comprising a row and column array of active elements wherein each element is associated with a switching TFT according to claim 15 connected to corresponding row and column conductors.
17. Apparatus for crystallising a semiconductor film comprising a supporting substrate for receiving a semiconductor film; a laser for exposing each of a series of discrete regions of the semiconductor film to one or more laser beam pulses; and a control unit for monitoring the energy output of the laser apparatus.
18. Apparatus for crystallising a semiconductor film by a method according to claims 1 to 11 comprising a supporting substrate for receiving a semiconductor film; a laser for exposing each of a series of discrete regions of the semiconductor film to one or more laser beam pulses; and a control unit for monitoring the energy output of the laser apparatus.