1. A composition comprising about 2 M to about 6 M D-beta-hydroxybutyrate or a pharmaceutically acceptable salt thereof, about 25 mM to about 80 mM melatonin or a metabolite, precursor, or analog thereof, and at least one solvent.
2. The composition of claim 1, wherein the D-beta-hydroxybutyrate or a pharmaceutically acceptable salt thereof is Na-D-beta hydroxybutyrate.
3. The composition of claim 1, wherein the melatonin or a metabolite, precursor, or analog thereof is 5-methyoxy-N-acetyltryptamine.
4. The composition of claim 1, wherein the melatonin or a metabolite, precursor, or analog thereof is selected from the group consisting of 6-hydroxy-melatonin (6-HMEL), 6-sulphatoxy-melatonin (aMT6s), N1-acetyl-N2-formyl-5-methoxy kynuramine (AFMK), N1-acetyl-5-methoxy kynuramine (AMK), and 3-hydroxymelatonin (3-HMEL).
5. The composition of claim 1, wherein the melatonin or a metabolite, precursor, or analog thereof is selected from the group consisting of N-acetylserotonin, 5-hydroxytryptamine, 5-hydroxytryptophan, and L-tryptophan.
6. The composition of claim 1, wherein the melatonin or a metabolite, precursor, or analog thereof is selected from the group consisting of 2-chloromelatonin, 6-fluoromelatonin, 6-chloromelatonin, 6-hydroxymelatonin, N-isobutanoyl 5-methoxytryptamine, N-valeroyl 5-methoxytryptamine, 6-methoxymelatonin, 5-methyl N-acetyltryptamine, 5-benzoyl N-acetyltryptamine, O-acetyl 5-methoxytryptamine, N-acetyltryptamine, N-acetyl 5-hydroxytryptamine, and 5-methoxytryptamine.
7. The composition of claim 1, wherein the solvent is water.
8. The composition of claim 1, wherein the composition comprises about 3 M to about 5 M D-beta-hydroxybutyrate or a pharmaceutically acceptable salt thereof and about 30 mM to about 50 mM melatonin or a metabolite, precursor, or analog thereof.
9. The composition of claim 1, wherein the composition comprises about 3.5 M to about 4.5 M D-beta-hydroxybutyrate or a pharmaceutically acceptable salt thereof and about 40 mM to about 45 mM melatonin or a metabolite, precursor, or analog thereof.
10. The composition of claim 1, wherein the composition comprises about 4 M Na-D-beta-hydroxybutyrate and about 43 mM melatonin.
11. The composition of claim 1, wherein the composition is substantially free of inorganic anions.
12. The composition of claim 1, wherein the composition is substantially free of Cl\u2212.
13. The composition of claim 1, further comprising an antioxidant.
14. The composition of claim 13, wherein the antioxidant is selected from the group consisting of resveratrol, vitamin A, ascorbic acid (vitamin C), alpha-tocopherol (vitamin E), glutathione, beta-carotene, lycopene, 4-hydroxy-2,2,6,6-tetramethylpiperidine-N-oxyl, (R)-2-acetamido-3-mercaptopropanoic acid (N-acetyl-cysteine), and 2-(2-methyl-2-sulfanylpropanoyl)amino-3-sulfanylpropanoic acid.
15. The composition of claim 1, further comprising a solubilizer.
16. The composition of claim 15, wherein the solubilizer is selected from the group consisting of DMSO, ethanol, methylsulfonylmethane (MSM or dimethylsulfone) and dimethylformamide (DMF).
17. The composition of claim 1, further comprising a stabilizer.
18. The composition of claim 17, wherein the stabilizer is selected from the group consisting of organic sugars, sugar alcohols, saccharides, amino acids, serum albumin, and immunoglobulins.
19. The composition of claim 17, wherein the stabilizer comprises short, amphiphilic oligomers covalently bound to the D-beta-hydroxybutyrate or a pharmaceutically acceptable salt thereof andor the melatonin or a metabolite, precursor, or analog thereof.
20. The composition of claim 19, wherein the short, amphiphilic oligomer is selected from the group consisting of polyethylene glycol (PEG) and short chain fatty acid polymers.
21. The composition of claim 1, further comprising a therapeutic compound.
22. The composition of claim 21, wherein the therapeutic compound is selected from the group consisting of a polypeptide, an antisense RNA molecule, a siRNA molecule, a drug, and a small molecule.
23. The composition of claim 21, wherein the therapeutic compound is selected from the group consisting of an antibiotic, an antibacterial, an analgesic, a free fatty acid, a hormone, a metabolite, and a metabolic pathway intermediate.
24. The composition of claim 1, wherein the pH of the composition is from about 7.2 to about 7.6.
25. The composition of claim 1, wherein the pH of the composition is about 7.4.
26. The composition of claim 1, further comprising glucose, acetate, pyruvate, or combinations thereof.
27. An article of manufacture comprising the composition of claim 1.
28. The article of manufacture of claim 27, wherein the composition is comprised within an IV bag or a syringe barrel.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
What is claimed is:
1. An integrated circuit system comprising:
a substrate;
an IC piece mounted to the substrate; and
a plurality of power supply chips mounted to the substrate and electrically coupled to the IC piece for supplying power to the IC piece.
2. The integrated circuit system of claim 1, the IC piece having a plurality of circuits, wherein selected ones of the power supply chips are coupled to at least one of the plurality of circuits.
3. The integrated circuit system of claim 2 wherein each power supply chip is coupled to at least one of the plurality of circuits.
4. The integrated circuit system of claim 2 wherein at least one of the plurality of circuits defines a functional block.
5. The integrated circuit system of claim 2 wherein the plurality of circuits define a plurality of functional blocks, each of the selected ones of the power supply chips being coupled to separate ones of the functional blocks.
6. The integrated circuit system of claim 1 wherein at least one of the power supply chips includes voltage control circuitry.
7. The integrated circuit system of claim 1 wherein at least one of the power supply chips includes current control circuitry.
8. The integrated circuit system of claim 1 further comprising conductors for coupling the power supply chips to the IC piece.
9. The integrated circuit system of claim 1 wherein the substrate defines mounting areas for the power supply chips.
10. The integrated circuit system of claim 9 wherein the mounting areas include recesses in the substrate.
11. An integrated circuit system package, comprising:
a substrate comprising a plurality of conductors;
an IC piece mounted to the substrate, the IC piece including a plurality of circuits having corresponding power supply inputs; and
at least one power supply mounted to the substrate and electrically coupled to at least one of the power supply inputs via the conductors.
12. The integrated circuit system package of claim 11 further comprising a heat dissipation device connected in thermally conductive relation to the substrate.
13. The integrated circuit system package of claim 11 wherein the power supplies are formed on a single silicon substrate.
14. An integrated circuit package comprising:
a plurality of power supply circuits on a substrate;
an integrated circuit comprising a plurality of circuits, wherein selected ones of the circuits are coupled to selected ones of the power supply circuits via conductors.
15. The integrated circuit package of claim 14 wherein the selected ones of the circuits comprise functional blocks of the integrated circuit.
16. The integrated circuit package of claim 15 wherein at least one of the power supply circuits couples to a separate functional block.
17. The integrated circuit package of claim 14 wherein the substrate comprises mounting areas for the power supply circuits.
18. The integrated circuit package of claim 14 wherein the selected ones of the circuits couple to the conductors via terminal bumps.
19. The integrated circuit package of claim 14 wherein the selected ones of the power supply circuits are designed for the corresponding selected ones of the circuits.
20. The integrated circuit package of claim 16 wherein the at least one of the power supply circuits is optimized for the separate functional block.
21. The integrated circuit package of claim 14 wherein the substrate comprises silicon.
22. The integrated circuit package of claim 21 wherein the integrated circuit is on the substrate.
23. An integrated circuit package comprising:
a silicon substrate including an integrated circuit and a plurality of power supply circuits electrically coupled to the integrated circuit.
24. The integrated circuit package of claim 23, the integrated circuit having a plurality of circuits, wherein selected ones of the power supply circuits are coupled to at least one of the plurality of circuits.