1. A method for producing a blank (1) from a fiber layup (5) having an edge (3) forming a chamfer (2), wherein the fiber layup (5), which is suctioned onto a cutting support (6) of a cutting table (7), is cut through using a contour cut (17), which extends into the cutting support (6), along the intended contour (4) of the blank (1) and is provided with the chamfer (2) using a chamfer cut (16) running at a flat chamfer angle (\u03b1) along the intended contour (4), wherein the fiber layup (5) is firstly precut by two cuts, which end above the cutting support (6) and run outside the intended cross section of the edge (3), namely a preliminary cut (10) running transversely to the fiber layup (5) along the contour region and a relief cut (11), which determines a processing allowance (15) to the chamfer (2), and then the chamfer (2) is cut using the chamfer cut (16), which ends outside the intended contour (4) in the fiber layup (5), before the intended contour (4) of the blank (1) is produced by the contour cut (17).
2. The method according to claim 1, wherein the preliminary cut (10) is carried out before the relief cut (11).
3. The method according to claim 1, wherein the cut surfaces of the preliminary cut (10) and the relief cut (11) intersect.
4. The method according to claim 2, wherein the fiber layup (5) is divided before the relief cut (11) in the region of the chamfer (2) by a notch, which runs at a distance from the preliminary cut (10), and which ends in the processing allowance (15) determined by the relief cut (11).
5. The method according to claim 1, wherein the preliminary cut (10) is carried out in a surface corresponding to the cut surface of the contour cut (17).
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A heat dissipation device adapted for removing heat from LED chips, comprising:
a heat sink comprising a base plate which defines a first surface and a second surface opposite to the first surface, and a plurality of fins formed on the second surface of the base plate;
a plurality of heat pipes of unidirectional heat transfer being embedded in the first surface of the heat sink, each of the heat pipes defining a first wall and a second wall coupled to the heat sink, the heat pipes only transferring heat from the first walls to the second walls and restrict a heat transfer in a reversed direction; and
a plurality of substrates in contact with first walls of the heat pipes, and the LED chips being mounted on the substrates;
wherein when the LED chips generate heat, the heat is transferred to the fins via the unidirectional heat pipes to lower a temperature of the LED chips.
2. The heat dissipation device as claimed in claim 1, wherein each of the heat pipes is provided with a capillary wick which has one of the following structures: a plurality of fine grooves defined in a lengthwise direction of the casing, a fine-mesh wick, or a layer of sintered metalceramic powders only formed on an inner side of the first wall and away from the second wall.
3. The heat dissipation device as claimed in claim 2, wherein the heat pipes each are half filled with working liquid which is just enough to submerge the capillary wick adjacent to the first wall when the first wall faces downwardly toward the ground.
4. The heat dissipation device as claimed in claim 1, wherein each of the substrates is a flat plate and defines a first surface on which the LED chips are mounted and a second surface opposite to the first surface.
5. The heat dissipation device as claimed in claim 4, wherein the second surfaces of the substrates are coupled to the first surface of the heat sink and the first walls of the heat pipes.
6. The heat dissipation device as claimed in claim 1, wherein the heat pipes each can be one of various shapes: straight, L-shaped, U-shaped and S-shaped, and the first surface of the heat sink defines corresponding receiving grooves accommodating the heat pipes therein.
7. The heat dissipation device as claimed in claim 6, wherein the heat pipes each are straight and are juxtaposed closely to each other and respectively received in the corresponding straight receiving grooves.
8. The heat dissipation device as claimed in claim 1, wherein the fins extend from the second surface of the base plate and can be constructed in various configurations to maximize a heat-exchanging area of the heat sink.
9. A heat dissipation device adapted for removing heat from LED chips, comprising:
a finned heat sink comprising a base plate;
a plurality of heat pipes embedded in the base plate, each heat pipe comprising a casing which is half filled with working liquid and has a first wall and a second wall in contact with the base plate of the heat sink; and
a plurality of heat conductive substrates each defining a first surface on which the LED chips are mounted and a second surface in contact with the heat pipes;
wherein each of the heat pipes is provided with a capillary wick which has one of following structures: a plurality of fine grooves defined in a lengthwise direction of the casing, a fine-mesh wick, or a layer of sintered metalceramic powders only formed on an inner side of the first wall and away from the second wall, and working liquid which is just enough to submerge the capillary wick adjacent to the first wall when the first wall faces downwardly toward the ground.
10. The heat dissipation device as claimed in claim 9, wherein the substrates each are a flat plate, the second surfaces of the substrates are coupled to the base plate of the heat sink and the first walls of the heat pipes, a major part of the second surfaces of the substrates being in contact with the first walls of the heat pipes.
11. The heat dissipation device as claimed in claim 10, wherein the heat pipes each can be one of various shapes: straight, L-shaped, U-shaped and S-shaped, and the first surface of the heat sink defines corresponding receiving grooves accommodating the heat pipes therein.
12. The heat dissipation as claimed in claim 10, wherein the heat pipes are straight and divided into two groups, and each group of the heat pipes are connected with at least two substrates.
13. The heat dissipation device as claimed in claim 12, wherein the heat pipes of each group are juxtaposed closely to each other and respectively received in the corresponding straight receiving grooves.
14. The heat dissipation as claimed in claim 9, wherein the base plate defines a first surface coupled with the second surfaces of the substrates and a second surface opposite to the first surface, and a plurality of fins are formed on the second surface of the base plate.
15. An LED assembly comprising:
a heat sink having a plurality of fins thereon;
a plurality of heat pipes embedded in the heat sink;
a plurality of heat conductive substrates coupled to the heat pipes; and
a plurality of LED chips mounted on the substrates;
wherein the heat pipes allow heat generated by the LED chips to be transferred to the heat sink via the substrates and the heat pipes, and inhibit heat in the heat sink to be transferred to the substrates via the heat pipes.