1. An apparatus for optimizing performance of a multiple core processor, the apparatus comprising:
a testing device that identifies a voltage value for each component of a multiple core processor die, wherein the multiple core processor die comprises a plurality of components; and
a bond and assembly device that sets a switch in a package for each component of the multiple core processor die based on the identified voltage value for each component, wherein each switch connects a component of the multiple core processor die to one of a plurality of voltage planes formed in the package and wherein the number of voltage planes in the plurality of voltage planes is less than the number of components in the plurality of components, and bonds the multiple core processor die to the package.
2. The apparatus of claim 1, wherein the plurality of components comprises a plurality of processor cores.
3. The apparatus of claim 2, wherein the plurality of processor cores comprises a heterogeneous multiple core processor architecture.
4. The apparatus of claim 2, wherein the plurality of components further comprises a memory component, an inputoutput logic component, or a pervasive logic component.
5. The apparatus of claim 1, further comprising:
a database that stores the identified voltage values for the plurality of components in association with a chip identifier of the multiple core processor die.
6. The apparatus of claim 5, wherein the testing device stores the chip identifier on the multiple core processor die.
7. The apparatus of claim 1, wherein the testing device determines a voltage value for each of a plurality of voltage regulator modules, wherein each voltage regulator module in the plurality of voltage regulator modules is configured to supply a voltage to one of the plurality of voltage planes in the package.
8. The apparatus of claim 7, wherein the testing device stores the voltage value for each of the plurality of voltage regulator modules as a voltage identifier on the multiple core processor die.
9. A package for optimizing performance of a multiple core processor, the package comprising:
a plurality of voltage planes; and
a plurality of switches, wherein each switch is configured to be set for each component of a multiple core processor die, wherein the multiple core processor die comprises a plurality of components, wherein each switch is configured to connect a component of the multiple core processor die to one of the plurality of voltage planes, and wherein the number of voltage planes in the plurality of voltage planes is less than the number of components in the plurality of components.
10. The package of claim 9, wherein the package is bonded to the multiple core processor die.
11. The package of claim 9, further comprising:
wherein each voltage plane of the plurality of voltage planes is coupled to a corresponding one of a plurality of voltage regulator modules, and wherein a number of voltage regulator modules in the plurality of voltage regulator modules is equal to the number of voltage planes in the plurality of voltage planes.
12. The package of claim 11, further comprising:
wherein each of a plurality of voltage identifiers stored on the multiple core processor die is coupled to a corresponding voltage regulator module in the plurality of voltage regulator modules.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. Connection module for telecommunication and data technique, entailing a base plate, onto which connecting modules for optical waveguides or electrical cores can be arranged, with the connecting modules and the base plate manifesting fitting agents corresponding to one another, wherein at least one connecting module for optical waveguides and at least one connecting module for electrical cores have been arranged on a base plate.
2. Connection module according to claim 1, wherein the connecting modules are detachably connected with the base plate.
3. Connection module according to claim 1, wherein the base plate is equipped with connecting elements to form a carrier system.
4. Connection module according to claim 1, wherein the base plate is made of plastic.
5. Connection module according to claim 1, wherein the connecting module for the electrical cores is designed as a connection block.
6. Connection module according to claim 1, wherein the connecting module for the electrical cores possesses contacts for the connection of the cores, the contacts being insulation displacement contacts.
7. Connection module according to claim 1, wherein the connecting module for the optical waveguides is made of plastic.
8. Connection module according to claim 1, wherein the connecting module for the optical waveguides has been provided with fibre guidance structures.
9. Connection module according to claim 8, wherein the fibre guidance structures are transient bores.
10. Connection module according to claim 8, wherein the connecting module is made in two parts, V-shaped grooves have been worked into the lower part and the top part has been designed in such a way that an inserted optical waveguide is pushed into the V-shaped groove when the bottom and the top part are pushed together.
11. Connection module according to claim 10, wherein at least one cutting device has been arranged in the top part, by means of which an optical waveguide can be cut off vertical to the axes.
12. Connection module according to claim 1, wherein a reservoir with an immersion fluid has been arranged in the connecting module for the optical waveguides.
13. Connection module according to claim 12, wherein the reservoir has been arranged in the top part.
14. Connecting module for optical waveguides, entailing a housing and fibre guidance structures, with at least two waveguides being able to be brought into contact in pairs in the housing, wherein the connecting module manifests fitting agents for a base plate.
15. Connecting module according to claim 14, wherein the housing is made of plastic.
16. Connecting module according to claim 14, wherein the fibre guidance structures are transient bores.
17. Connecting module according to claim 14, wherein the housing comprises at least two parts, with V-shaped grooves having been worked into a lower part and a top part being designed in such a way that an inserted optical waveguide is pushed into the V-shaped groove when the bottom and the top part are pushed together.
18. Connecting module according to claim 17, wherein at least one cutting device has been arranged in the top part, by means of which an optical waveguide can be cut off vertical to the axes.
19. Connecting module according to claim 14, wherein a reservoir with an immersion fluid has been arranged in the connecting module.
20. Connecting module according to claim 19, wherein the reservoir has been arranged in the top part.
21. Connecting module according to claim 14, wherein the connecting module has been provided with means for the centring of fibre end sleeves or ferrules.
22. Connecting module according to claim 14, wherein the optical waveguide is designed as an optical plastic fibre.
23. Connecting module according to claim 14, wherein the optical waveguide is designed as an HCS fibre or as a glass fibre.
24. Method for the connection of two optical waveguides, in particular of optical plastic fibres, by means of a connecting module according to claim 14, entailing the following procedural steps:
a) removal of the outer casing of the two optical waveguides;
b) cutting off the two fibre ends which are to be connected with one another vertical to the axes and
c) insertion of the two fibre ends from different sides of a fibre guidance element until they are opposite one another and in contact.
25. Method according to claim 24, wherein the joint position is filled with an immersion fluid.