1. The optical transmitting assembly comprising:
a semiconductor light-emitting device for emitting light by receiving a modulation signal;
a thermoelectric cooler for controlling a temperature of said semiconductor light-emitting device by receiving a control signal;
a box-shaped package for housing said semiconductor light-emitting device and said thermoelectric cooler, said package having a bottom providing a terrace and first to fourth side walls arranged on said bottom, said third wall including a first lead pin for supplying said modulation signal, said second side wall including a second lead pin for supplying said control signal; and
an optical coupling portion attached to said first side wall,
wherein said optical coupling portion, said semiconductor light-emitting device and said first lead pin are arranged in a line along a predetermined axis and said second lead pin extends to a direction intersecting said predetermined axis, and
wherein said second and third side walls include a first multi-layered ceramic substrate arranged on said bottom and a second multi-layered ceramic substrate arranged on said first multi-layered ceramic substrate, said first and second multi-layered ceramic substrates providing an opening through which said thermoelectric cooler is inserted.
2. The optical transmitting assembly according to claim 1,
wherein said modulation signal is supplied through said second multi-layered ceramic substrate, and said control signal is supplied through said first multi-layered ceramic substrate.
3. The optical transmitting assembly according to claim 1, further comprising
a semiconductor light-receiving device for monitoring light emitted from said semiconductor light-emitting device and generating a monitoring signal,
wherein said semiconductor light-receiving device is mounted on a top surface of said second multi-layered ceramic substrate, said modulation signal being supplied through an inner layer of said second multi-layered ceramic substrate, and said monitoring signal is output from a third lead pin provided in said second side wall of said box-shaped package.
4. The optical transmitting assembly according to claim 1,
wherein said thermoelectric cooler includes an upper plate, a lower plate and a thermoelectric element sandwiched by said upper plate and said lower plate, and
wherein a gap between said first multi-layered ceramic substrate and said upper plate is greater than a gap between said first multi-layered ceramic substrate and said lower plate.
5. The optical transmitting assembly according to claim 4,
further including an insulating carrier for mounting said semiconductor light-emitting device, said carrier being arranged on said upper plate of said thermoelectric cooler,
wherein a level of a top surface of said carrier from said bottom is greater than a level of a top surface of said second multi-layered ceramic substrate.
6. The optical transmitting assembly according to claim 4,
further including an insulating carrier for mounting said semiconductor light-emitting device, said carrier being arranged on said upper plate of said thermoelectric cooler,
wherein a gap between said carrier and said second multi-layered ceramic substrate is narrower than a gap between said upper plate of said thermoelectric cooler and said second multi-layered ceramic substrate.
7. The optical transmitting assembly according to claim 1,
wherein said semiconductor light-emitting device includes a semiconductor laser diode that emits continuous wave light by supplying a bias current and a semiconductor optical modulator, by supplying said modulation signal, for modulating said continuous wave light emitted from said semiconductor laser diode, and
wherein said bias current is supplied through a fourth another lead pin provided in said second side wall of said package.
8. An optical transmitting assembly, comprising:
a semiconductor light-emitting device including a semiconductor laser diode for emitting continuous wave light by supplying a bias current, and a semiconductor light-modulating device for modulating said continuous wave light emitted from said semiconductor laser diode by supplying a modulating signal,
a semiconductor photodiode for monitoring said continuous wave light emitted from said semiconductor laser diode, and for generating a monitoring signal;
a thermoelectric cooler for controlling a temperature of said semiconductor light-emitting device by supplying a control signal;
a box-shaped package for housing said semiconductor light-emitting device, said semiconductor photodiode and said thermoelectric cooler, said box-shaped package including a bottom having a terrace for mounting said thermoelectric cooler thereon and first to fourth side walls comprising a first multi-layered ceramic substrate arranged on said bottom and a second multi-layered ceramic substrate arranged on said first multi-layered ceramic substrate, said modulation signal being provided from a first lead pin arranged in said third side wall through an inner layer of said second multi-layered ceramic substrate, and said bias current, said control signal, and said monitoring signal being transmitted from a plurality of second lead pins arranged in said second side wall intersecting said first side wall through said first multi-layered ceramic substrate; and
an optical coupling portion attached to said first side wall substantially in parallel to said third side wall,
wherein said optical coupling portion, said semiconductor optical modulator, said semiconductor laser diode and said first lead pin are arranged along a predetermined axis, and said plurality of second lead pins extends along a direction intersecting said predetermined axis.
9. The optical transceiver comprising:
a substrate including a first portion and a second portion extending from said first portion, said substrate mounting a driver circuit;
an optical transmitting assembly including a semiconductor light-emitting device for emitting light by supplying a modulation signal from said driver circuit and a thermoelectric cooler for controlling a temperature of said light-emitting device by supplying a control signal, said optical transmitting assembly further including a first lead pin connected to said first portion of said substrate to supply said modulation signal and a second lead pin connected to said second portion of said substrate to supply said control signal; and
an optical receiving assembly connected to said second portion of said substrate,
wherein said driver circuit, said first lead pin and said semiconductor light-emitting device are arranged on a line substantially parallel to a predetermined axis and said second lead pin extends along a direction intersecting said predetermined axis,
wherein said optical transmitting assembly comprises a box-shaped package including first to fourth side walls, and an optical coupling portion attached to said first side wall, said first lead pin being arranged in said third side wall that is parallel to and opposite to said first side wall, and said second lead pin being arranged in said second side wall that intersects said first and third side walls,
wherein said box-shaped package further includes a metallic bottom having a terrace for mounting said thermoelectric cooler thereon, said first to fourth side walls being arranged on said metallic bottom, and
wherein said second to fourth side walls include a first multi-layered ceramic substrate arranged on said metallic bottom and a second multi-layered ceramic substrate arranged on said first multi-layered ceramic substrate, said first and second multi-layered ceramic substrates providing an opening to insert said thermoelectric cooler therethrough.
10. The optical transceiver according to claim 9,
wherein said modulation signal is supplied from said second multi-layered ceramic substrate, and said control signal is supplied from said first multi-layered ceramic substrate.
11. The optical transceiver according to claim 9,
wherein said optical transmitting assembly further comprises a semiconductor light-receiving device for monitoring light emitted from said semiconductor light-emitting device and outputting a monitoring signal, said semiconductor light-receiving device being mounted on a top surface of said second multi-layered ceramic substrate, and
wherein said modulation signal is supplied through an inner layer of said second multi-layered ceramic substrate, and said monitoring signal is output from said third lead pin arranged in said second side wall.
12. The optical transceiver according to claim 9,
wherein said thermoelectric cooler provides an upper plate, a lower plate wider than said upper plate, and a plurality of thermoelectric elements sandwiched by said upper and lower plates, and
wherein a gap between said upper plate and said first multi-layered ceramic substrate is wider than a gap between said lower plate and said first multi-layered ceramic substrate.
13. The optical transceiver according to claim 9,
further an insulating carrier mounting said semiconductor light-emitting device, said carrier being mounted on said upper plate of said thermoelectric cooler,
wherein a top level of said carrier from said bottom is higher than a top level of said second multi-layered ceramic substrate.
14. The optical transceiver according to claim 9,
further an insulating carrier for mounting said semiconductor light-emitting device, said carrier being mounted on said upper plate of said thermoelectric cooler,
wherein a gap between said carrier and said second multi-layered ceramic substrate is narrower than a gap between said upper plate and said second multi-layered ceramic substrate.
15. The optical transceiver according to claim 9,
wherein said semiconductor light-emitting device includes a semiconductor laser diode for emitting continuous wave light by supplying a bias current and a semiconductor optical modulator for modulating said continuous wave light emitted from said semiconductor laser diode by supplying a modulation signal, and
wherein said bias current is supplied from a fourth lead pin arranged in said second side wall of said box-shaped package, and said semiconductor laser diode is integrated with said semiconductor optical modulator.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. Apparatus comprising:
a body having a CPU therein;
a lid, wherein the apparatus is used by opening the lid for the body;
a sensor which senses that said lid is opened or closed;
a first circuit, coupled to said sensor, which stops a certain function that may be affected by a transfer of the apparatus without stopping the CPU in response to sensing that said lid is closed in a state in which a normal operation can be performed; and
a second circuit, coupled to said sensor, which clears the stoppage of the function in order to shift to the state in which the normal operation can be performed in response to sensing that said lid is opened.
2. Apparatus according to claim 1, further comprising a hard disk drive, wherein the function stopped by said first circuit is the functionality of the hard disk drive.
3. Apparatus according to claim 1, further comprising a display device, wherein said first circuit further turns off the display device.
4. Apparatus according to claim 1, further comprising a third circuit for saving a state of an operation performed to a predetermined memory to stop the CPU on condition that a predetermined time has elapsed since said first circuit stopped the function.
5. Apparatus according to claim 4, wherein
said second circuit allows a shift to the state in which the normal operation can be performed without requesting a user to input a password, and
in a case where a state in which the CPU is stopped by said third circuit shifts to the state in which the normal operation can be performed, the user is requested to input the password.
6. A method comprising:
a first step of setting a portable electronic apparatus in a normal operation mode corresponding to a normal use state; and
a second step of, in response to sensing that a lid of the electronic apparatus is closed in the normal operation mode, shifting the electronic apparatus to a transfer mode in which a function that may be affected while the electronic apparatus is being transferred is temporarily disabled with a CPU of the electronic apparatus remaining operative.
7. A method according to claim 6, further comprising a third step of shifting the electronic apparatus to the normal operation mode in response to opening of the lid in the transfer mode.
8. A method according to claim 7, wherein said third step shifts the transfer mode to the normal operation mode without requesting a user to input a password.
9. A method according to claim 6, further comprising a fourth step of saving an operation performed in the normal operation mode to a predetermined memory after a predetermined time has elapsed in the transfer mode, and shifting the electronic apparatus to a power saving mode in which a minimum amount of power required to retain data is used.
10. A product comprising:
a computer usable medium having computer readable program code stored therein for controlling a portable computer, the computer readable program code in said product being effective to:
(a) in response to closing of a lid of the computer in a normal operation mode corresponding to a normal use state, shift the computer to a transfer mode in which a function that may be affected while the computer is being transferred is temporarily disabled with a CPU of the computer remaining operative; and
(b) shift the computer to the normal operation mode in response to opening of the lid in the transfer mode.
11. A product according to claim 10, wherein the code is further effective to:
(c) save an operation performed in the normal operation mode to a predetermined memory after a predetermined time has elapsed in the transfer mode and shifting the computer to a power saving mode in which minimum power required to retain data.
12. A product according to claim 11, wherein the code is further effective to:
(d) shift the computer from the power saving mode to the normal operation mode, and
with step (b), a shift to the normal operation is executed without requesting a password from a user, and with step (d), a shift to the normal operation is executed by requesting the password from the user.