1. A method for forming an interconnect in a workpiece, the method comprising:
(a) obtaining a workpiece substrate including a feature;
(b) depositing a metal conductive layer in the feature to partially or fully fill the feature;
(c) depositing a metal fill to complete the filling of the feature if the feature is partially filled by the metal conducting layer;
(d) applying a copper overburden;
(e) annealing the workpiece; and
(f) using CMP to remove the overburden and reduce the height of the workpiece to expose the workpiece substrate and the metalized feature.
2. (canceled)
3. The method of claim 1, wherein the metal conductive layer is deposited by a method selected from the group including electrochemical deposition, chemical vapor deposition, and atomic layer deposition.
4. The method of claim 1, wherein the metal conductive layer is deposited using a chemistry including at least one copper complex selected from the group consisting of copper, ethylenediamine, citrate, tartrate, and urea.
5. The method of claim 1:
wherein the metal conductive layer partially fills the feature; and
further comprising depositing a metal alloy layer to further partially fill or completely fill the feature before the metal fill andor copper overburden is applied.
6-8. (canceled)
9. The method of claim 5, wherein the metal alloy is selected from the group consisting of a copper alloy, a cobalt alloy, a nickel alloy, a gold alloy, a silver alloy, a manganese alloy, a tin alloy, and an aluminum alloy, on etch stop material, an alloy of the conductive layer, a transition metal, a noble metal.
10-11. (canceled)
12. The method of claim 5, wherein the annealing of the workpiece is carried out in a controlled manner to limit the diffusion of the alloying element of the metal alloy to an upper portion of the feature.
13. The method of claim 5, wherein the annealing of the workpiece is carried out to cause the alloying element of the metal layer to uniformly diffuse throughout the feature.
14. The method of claim 1, further comprising thermally treating the workpiece to induce reflow of the metal conductive layer into the feature to create a first conformal conductive layer.
15. The method of claim 14, further comprising depositing at least one additional conductive layer after the first conductive conformal layer, and thermally treating the workpiece to induce reflow of each additional conductive layer.
16. The method of claim 1, further comprising depositing a conductive seed layer in the feature before the metal conductive layer is deposited.
17-18. (canceled)
19. The method of claim 1, further comprising depositing a barrier layer in the feature before the metal conductive layer is deposited.
20. (canceled)
21. A method for filling a feature in a workpiece, the method comprising:
(a) obtaining a workpiece substrate including a feature for an interconnect;
(b) depositing a metal conductive layer in the feature to partially or fully fill the feature;
(c) depositing a metal fill if the feature is partially filled by the metal conductive layer;
(d) applying a metal overburden to the workpiece, including to overlie the feature;
(e) thermally treating the workpiece under conditions to anneal the workpiece; and
(f) using CMP to remove the metal overburden and expose an upper surface of the workpiece substrate.
22. The method of claim 21, wherein the metal for the metal conductive layer is selected from the group consisting of copper, cobalt, nickel, gold, silver, manganese, tin, aluminum, and alloys thereof.
23. The method of claim 21:
wherein the metal conductive layer partially fills the feature; and
further comprising depositing a metal alloy layer to further partially fill or completely fill the feature before the metal fill andor the metal overburden is applied.
24-25. (canceled)
26. The method of claim 23, wherein the metal alloy is selected from the group consisting of a copper alloy, a cobalt alloy, a nickel alloy, a gold alloy, a silver alloy, a manganese alloy, a tin alloy, an aluminum alloy, an etch stop material, an alloy of the conductive layer, a transition metal, a noble metal.
27-28. (canceled)
29. The method of claim 23, wherein the thermal treating of the workpiece is carried out in a controlled manner to limit the diffusion of the alloying element to the upper portion of the feature.
30. The method of claim 23, wherein the thermal treating of the workpiece is carried out to cause the alloying element of the metal layer to uniformly diffuse throughout the feature.
31. (canceled)
32. The method of claim 21, further comprising thermally treating the workpiece to induce reflow of the metal conductive layer into the feature.
33. The method of claim 21, further comprising depositing a barrier layer in the feature before the metal conductive layer is deposited.
34. The method of claim 21, further comprising depositing a conductive seed layer in the feature before the metal conductive layer is deposited.
35. (canceled)
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A packaged microphone comprising:
a base having a top face;
a lid coupled to the base and forming an interior;
a MEMS microphone secured to the top face of the base within the interior;
a circuit chip secured to the top face of the base within the interior, the circuit chip having a top surface with a top pad, a bottom surface with a bottom pad, and a via, the bottom pad being electrically connected to the base, the via electrically connecting the top pad with the bottom pad; and
a wire bond connected between the MEMS microphone and the top pad on the circuit chip, the MEMS microphone being electrically connected to the bottom pad and the base through the via,
wherein circuitry is positioned on the top surface of the circuit chip.
2. The packaged microphone as defined by claim 1 wherein the lid and base form an interior area on the top face of the base, the circuit chip forming a circuit chip area of the interior area underneath the circuit chip and a remaining area, the remaining area being the rest of the interior area other than the circuit chip area, the remaining area being substantially free of traces.
3. The packaged microchip as defined by claim 1 wherein the lid and base form an interior area on the top face of the base, the microphone and circuit chip covering more than about 70 percent of the interior area.
4. The packaged microphone as defined by claim 1 wherein no wire bonds extend directly from the top face of the base and the MEMS microphone.
5. The packaged microphone as defined by claim 1 wherein the MEMS microphone electrically connects to the base through the wire bond only.
6. The packaged microphone as defined by claim 1 wherein the circuit chip comprises a plurality of additional vias extending between the top surface and bottom surface of the circuit chip.
7. The packaged microphone as defined by claim 1 wherein the circuit chip and MEMS microphone form a plan region that is generally parallel to the base, the plan region including a space between the circuit chip and MEMS microphone, the wire bond being within the plan region only.
8. A packaged microphone comprising:
a base having a top face;
a lid coupled to the base and forming an interior;
a MEMS microphone secured to the top face of the base within the interior;
a circuit chip having a via and a pad and being within the interior, the via being electrically connected to the base and the pad; and
a wire bond connected between the MEMS microphone and the pad on the circuit chip, the MEMS microphone being electrically connected to the base through the via of the circuit chip,
wherein the circuit chip has a top surface and a bottom surface, circuitry being positioned on the top surface.
9. The packaged microphone as defined by claim 8 wherein the circuit chip is surface mounted to the base.
10. The packaged microphone as defined by claim 8 wherein the base comprises printed circuit board material.
11. The packaged microphone as defined by claim 8 wherein the lid and base form at least a partial electromagnetic shield about the interior.
12. The packaged microphone as defined by claim 8 wherein the circuit chip is an integrated circuit with a top surface, the pad being on the top surface of the circuit chip and being connected to the wire bond.
13. The packaged microphone as defined by claim 8 wherein one or both the lid and base form an aperture for receiving an input audio signal.
14. The packaged microphone as defined by claim 8 wherein the MEMS microphone electrically connects to the base through the wire bond only.
15. The packaged microphone as defined by claim 8 wherein the lid and base form an interior area on the top face of the base, the circuit chip forming a circuit chip area of the interior area underneath the circuit chip and a remaining area, the remaining area being the rest of the interior area other than the circuit chip area, the remaining area being substantially free of traces.
16. A method comprising:
mounting a MEMS microphone onto the top face of a base formed from circuit board material;
surface mounting an integrated circuit chip onto the top face of the base, the integrated circuit having a top surface with a top pad, a bottom surface with a bottom pad, and a via extending between the top and bottom surfaces, the via being electrically connected to the base through the bottom pad with a surface mount connection, the integrated circuit chip including a circuit chip with circuitry, the circuit chip having a top surface;
mounting the circuitry on the top surface of the circuit chip;
connecting a wire bond between the MEMS microphone and the top pad on the top surface of the integrated circuit chip; and
securing a lid to the base.
17. The method as defined by claim 16 wherein the integrated circuit chip and MEMS microphone form a plan region that is generally parallel to the base, the plan region including a space between the integrated circuit chip and MEMS microphone, the wire bond being within the plan region only.
18. The method as defined by claim 16 wherein securing the lid to the base comprises forming an electromagnetic shield about the MEMS microphone.
19. A packaged microphone comprising:
a base having a top face;
a lid coupled to the base and forming an interior;
a MEMS microphone secured to the top face of the base within the interior;
a circuit chip secured to the top face of the base within the interior, the circuit chip having a top surface with a top pad, a bottom surface with a bottom pad, and a via, the bottom pad being electrically connected to the base, the via electrically connecting the top pad with the bottom pad; and
a wire bond connected between the MEMS microphone and the top pad on the circuit chip, the MEMS microphone being electrically connected to the bottom pad and the base through the via,
wherein circuitry is positioned, at least in part, on the bottom surface of the circuit chip.
20. The packaged microphone as defined by claim 19 wherein the lid and base form an interior area on the top face of the base, the circuit chip forming a circuit chip area of the interior area underneath the circuit chip and a remaining area, the remaining area being the rest of the interior area other than the circuit chip area, the remaining area being substantially free of traces.
21. The packaged microchip as defined by claim 19 wherein the lid and base form an interior area on the top face of the base, the microphone and circuit chip covering more than about 70 percent of the interior area.
22. The packaged microphone as defined by claim 19 wherein no wire bonds extend directly from the top face of the base and the MEMS microphone.
23. The packaged microphone as defined by claim 19 wherein the MEMS microphone electrically connects to the base through the wire bond only.
24. The packaged microphone as defined by claim 19 wherein the circuit chip comprises a plurality of additional vias extending between the top surface and bottom surface of the circuit chip.
25. The packaged microphone as defined by claim 19 wherein the circuit chip and MEMS microphone form a plan region that is generally parallel to the base, the plan region including a space between the circuit chip and MEMS microphone, the wire bond being within the plan region only.
26. A packaged microphone comprising:
a base having a top face;
a lid coupled to the base and forming an interior;
a MEMS microphone secured to the top face of the base within the interior;
a circuit chip having a via and a pad and being within the interior, the via being electrically connected to the base and the pad; and
a wire bond connected between the MEMS microphone and the pad on the circuit chip, the MEMS microphone being electrically connected to the base through the via of the circuit chip,
wherein the circuit chip has a top surface and a bottom surface, circuitry being positioned, at least in part, on the bottom surface of the circuit chip.
27. The packaged microphone as defined by claim 26 wherein the circuit chip is surface mounted to the base.
28. The packaged microphone as defined by claim 26 wherein the base comprises printed circuit board material.
29. The packaged microphone as defined by claim 26 wherein the lid and base form at least a partial electromagnetic shield about the interior.
30. The packaged microphone as defined by claim 26 wherein the circuit chip is an integrated circuit with a top surface, the pad being on the top surface of the circuit chip and being connected to the wire bond.
31. The packaged microphone as defined by claim 26 wherein one or both the lid and base form an aperture for receiving an input audio signal.
32. The packaged microphone as defined by claim 26 wherein the MEMS microphone electrically connects to the base through the wire bond only.
33. The packaged microphone as defined by claim 26 wherein the lid and base form an interior area on the top face of the base, the circuit chip forming a circuit chip area of the interior area underneath the circuit chip and a remaining area, the remaining area being the rest of the interior area other than the circuit chip area, the remaining area being substantially free of traces.
34. A method comprising:
mounting a MEMS microphone onto the top face of a base formed from circuit board material;
surface mounting an integrated circuit chip onto the top face of the base, the integrated circuit having a top surface with a top pad, a bottom surface with a bottom pad, and a via extending between the top and bottom surfaces, the via being electrically connected to the base through the bottom pad with a surface mount connection, the integrated circuit chip including a circuit chip with circuitry, the circuit chip having a bottom surface;
mounting the circuitry, at least in part, on the bottom surface of the circuit chip;
connecting a wire bond between the MEMS microphone and the top pad on the top surface of the integrated circuit chip; and
securing a lid to the base.
35. The method as defined by claim 34 wherein the integrated circuit chip and MEMS microphone form a plan region that is generally parallel to the base, the plan region including a space between the integrated circuit chip and MEMS microphone, the wire bond being within the plan region only.
36. The method as defined by claim 34 wherein securing the lid to the base comprises forming an electromagnetic shield about the MEMS microphone.