1. A method of manufacturing a semiconductor device comprising the steps of:
(a) providing a mold including a first mold having a cavity and an air vent communicated with the cavity, a second mold opposed to the first mold, a movable pin formed in the first mold such that the movable pin is protruded into the air vent, and a movable pin driving spring connected with the movable pin;
(b) disposing a wiring board, on which a semiconductor chip is mounted, including a plurality of wiring layers on a surface of the second mold;
(c) after the step (b), clamping the wiring board with the first and second molds; and
(d) after the step (c), injecting a sealing resin in the cavity,
wherein a groove is formed at an end face of the movable pin as a pathway of air; and
wherein in the step (c), contacting the end face of the movable pin with the wiring board by clamping the mold, and raising the movable pin by clamping the mold, and closing the mold.
2. A method of manufacturing a semiconductor device according to claim 1, wherein in the groove, a depth formed at a first part, which is located closer to the cavity side than the movable pin, is larger than a depth formed at a second part on an opposite side of the first part via the movable pin.
3. A method of manufacturing a semiconductor device according to claim 1, wherein before the step (b), a film is arranged between the first and second molds, sucked through a vacuum hole formed in the first mold, and attached to a surface of the first mold.
4. A method of manufacturing a semiconductor device according to claim 3, wherein the film follows the groove formed at the end face of the movable pin by sucking the film.
5. A method of manufacturing a semiconductor device according to claim 1, wherein a pusher rod is formed in the first mold; and
wherein in a state of opening the mold, the movable pin is pushed to the air vent side by the pusher rod.
6. A method of manufacturing a semiconductor device according to claim 1, wherein in the air vent, a width formed at a first part, which is located closer to the cavity than the movable pin, is smaller than a diameter of the movable pin.
7. A method of manufacturing a semiconductor device according to claim 1, wherein the wiring board includes a front surface, a chip mounting area, a plurality of leads formed on the front surface, a first insulating film formed over the front surface, a rear surface opposed to the front surface, and a second insulating film formed over the rear surface;
wherein the semiconductor chip is mounted on the chip mounting area of the wiring board; and
wherein a plurality of bonding electrodes of the semiconductor chip are connected with the plurality of leads of the wiring board via a plurality of wires.
8. A method of manufacturing a semiconductor device according to claim 7, wherein the mold is opened after the step (d);
wherein the wiring board is removed from the mold after opening the mold; and
wherein a plurality of external terminals are formed on the rear surface of the wiring board after removing the wiring board from the mold.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A shipping container comprising:
a rigid outer container having a base, a plurality of sidewalls and an upper opening configured to define a cavity;
an inner flexible liner assembly positioned within the cavity of the rigid outer container comprising,
a liner having a plurality of walls generally complementing the cavity of the rigid outer container, the liner defines an inner cavity, the walls of the liner include a spout surrounding region,
a spout positioned such that the spout surrounding region extends thereabout, the spout providing fluid communication with the inner cavity of the liner, the spout including a one way valve which facilitates the ingress of flowable material while precluding the egress of material.
whereupon filling of the liner with a flowable material, the spout surrounding region structurally configured for controllable stretching by the flowable material, to, in turn, facilitate flowable material in excess of a capacity of the cavity of the liner prior to filling.
2. The shipping container of claim 1 wherein the walls of the liner further include a sidewall abutting region extending from the spout surrounding region and a base abutting region extending from the sidewall abutting region, the sidewall abutting region corresponding to the sidewalls of the rigid outer container and the base abutting region corresponding to the base of the rigid outer container.
3. The shipping container of claim 1 wherein the spout further includes a base flange which is secured to the liner, the one way valve member includes a material flap which is attached to the spout by way of a weld, wherein a portion of the material flap is positionable in abutment with a lower surface of the base flange, to, in turn, seal the spout from egress of flowable material.
4. The shipping container of claim 1 wherein the spout surrounding region is structurally configured for stretching between 5% and 15% in any direction.
5. The shipping container of claim 1 wherein the spout surrounding region is substantially free of each of creases and folds upon the stretching thereof.
6. A liner assembly for a shipping container, wherein the liner is positionable within an outer rigid container and fillable with a flowable material, comprising:
a liner having a plurality of walls generally complementing the cavity of the rigid outer container, the liner defines an inner cavity, the walls of the liner include a spout surrounding region,
a spout positioned such that the spout surrounding region extends thereabout, the spout providing fluid communication with the inner cavity of the liner, the spout including a one way valve which facilitates the ingress of flowable material while precluding the egress of material.
whereupon filling of the liner with a flowable material, the spout surrounding region structurally configured for controllable stretching by the flowable material, to, in turn, facilitate flowable material in excess of a capacity of the cavity of the liner prior to filling.
7. The shipping container of claim 6 wherein the spout further includes a base flange which is secured to the liner, the one way valve member includes a material flap which is attached to the spout by way of a weld, wherein a portion of the material flap is positionable in abutment with a lower surface of the base flange, to, in turn, seal the spout from egress of flowable material.
8. The liner assembly of claim 6 wherein the spout surrounding region is structurally configured for stretching between 5% and 15% in any direction.
9. The liner assembly of claim 6 wherein the spout surrounding region is substantially free of each of creases and folds upon the stretching thereof.
10. The liner assembly of claim 6 further comprising means for controlling the stretching of at least one sub-region of the spout surrounding region.
11. A method of filling a shipping container comprising:
providing a rigid outer container;
placing a flexible liner assembly within a cavity defined by the rigid outer container, the liner including walls defining a spout surrounding region and a spout;
filling the flexible liner with a flowable material through the spout; and
stretching the spout surrounding region with the flowable material during filling thereof by a flowable material.
12. The method of claim 11 further comprising the step of precluding the egress of flowable material through the spout at least during the step of stretching the spout surrounding region.
13. The method of claim 11 further comprising the step of precluding the stretching of any regions other than the spout surrounding region of the liner.
14. The method of claim 11 wherein the step of stretching further comprises the step of stretching the spout surrounding region until the spout surrounding region is substantially free from creases and folds.
15. The method of claim 11 wherein the step of stretching further comprises the step of stretching the spout surrounding region between 5% and 15% in at least one direction.
16. The method of claim 13 wherein the step of stretching increases a volume of the liner by at least 5%.