1. A method for image-based status determination, comprising:
capturing, via a mobile device, at least one image of a moving path;
analyzing, via the mobile device, at least one feature within the at least one image;
based on analysis of the at least one feature, determining, via the mobile device, a direction of movement of the moving path; and
displaying, on a display of the mobile device, an advertisement along the moving path within a representation of the captured image based on the determined direction of movement of the moving path.
2. The method of claim 1 wherein the at least one feature comprises a body part of a person on the moving path.
3. The method of claim 1 wherein the at least one feature comprises an object adjacent to the moving path.
4. The method of claim 1 further comprising tracking and comparing the at least one feature between a plurality of the images.
5. The method of claim 1 further comprising displaying navigation directions on the mobile device based on the determined direction of movement of the moving path.
6. An apparatus for image-based status determination, comprising:
an image capture device configured to capture at least one image of a moving path;
a processor and a display device coupled to the image capture device;
the processor configured to:
analyze at least one feature within the at least one image;
determine a direction of movement of the moving path based on analysis of the at least one feature; and
command display, on the display device, of an advertisement along the moving path within a representation of the captured image based on the determined direction of movement of the moving path.
7. The apparatus of claim 6 wherein the at least one feature comprises a body part of a person on the moving path.
8. The apparatus of claim 6 wherein the at least one feature comprises an object adjacent to the moving path.
9. The apparatus of claim 6 wherein the processor is further configured to track and compare the at least one feature between a plurality of the images.
10. The apparatus of claim 6 wherein the processor is further configured to display navigation directions on the mobile device based on the determined direction of movement of the moving path.
11. An apparatus for image-based status determination, comprising:
means for capturing at least one image of a moving path;
means for analyzing at least one feature within the at least one image;
means for, based on analysis of the at least one feature, determining a direction of movement of the moving path; and
means for displaying an advertisement along the inclined path within a representation of the captured image based on the determined position from where the image was captured.
12. A processor-readable medium comprising processor-readable instructions configured to cause a processor to:
capture at least one image of a moving path;
analyze at least one feature within the at least one image;
based on analysis of the at least one feature, determine a direction of movement of the moving path; and
command display, on a display device, of an advertisement along the inclined path within a representation of the captured image based on the determined position from where the image was captured.
13. A method for image-based status determination, comprising:
capturing, via a mobile device, an image of an inclined path;
analyzing, via the mobile device, at least one feature within the image;
based on analysis of the at least one feature, determining, via the mobile device, whether the image was captured from a top position relative to the inclined path or bottom position relative to the inclined path; and
displaying, on a display of the mobile device, an advertisement along the inclined path within a representation of the captured image based on the determined position from where the image was captured.
14. The method of claim 13 wherein the determining step comprises detecting an object adjacent to the inclined path and determining an angle of the object with respect to a horizon line.
15. The method of claim 13 further comprising determining a tilt angle of a device used to capture the image, and wherein determination of whether the image was from a top position or bottom position is further based on the tilt angle.
16. The method of claim 13 further comprising displaying navigation directions on the mobile device based on the determined position from where the image was captured.
17. An apparatus for image-based status determination, comprising:
an image capture device configured to capture at least one image of an inclined path;
a processor and a display device coupled to the image capture device;
the processor configured to:
analyze at least one feature within the image; and
determine whether the image was captured from a top position relative to the inclined path or bottom position relative to the inclined path based on analysis of the at least one feature; and
command display, on the display device, of an advertisement along the inclined path within a representation of the captured image based on the determined position from where the image was captured.
18. The apparatus of claim 17 wherein the determining step comprises detecting an object adjacent to the inclined path and determining an angle of the object with respect to a horizon line.
19. The apparatus of claim 17 wherein the processor is further configured to determine a tilt angle of a device used to capture the image, and wherein determination of whether the image was from a top position or bottom position is further based on the tilt angle.
20. The apparatus of claim 17 wherein the processor is further configured to display navigation directions on the mobile device based on the determined position from where the image was captured.
21. An apparatus for image-based status determination, comprising:
means for capturing an image of an inclined path;
means for analyzing at least one feature within the image;
means for, based on analysis of the at least one feature, determining whether the image was captured from a top position relative to the inclined path or bottom position relative to the inclined path; and
means for displaying an advertisement along the inclined path within a representation of the captured image based on the determined position from where the image was captured.
22. A processor-readable medium comprising processor-readable instructions configured to cause a processor to:
capture an image of an inclined path;
analyze at least one feature within the image;
based on analysis of the at least one feature, determine whether the image was captured from a top position relative to the inclined path or bottom position relative to the inclined path; and
command display, on a display device, of an advertisement along the inclined path within a representation of the captured image based on the determined position from where the image was captured.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A semiconductor device comprising:
a semiconductor chip which comprises a semiconductor substrate and a multilayer interconnection structure formed thereon, the multilayer interconnection structure including an interlayer insulating film smaller in relative dielectric constant than an SiO2 film;
an encapsulating resin layer which covers a first major surface of the semiconductor chip on a side of the multilayer interconnection structure and covers a side surface of the semiconductor chip; and
a stress relaxing resin layer which is interposed between the semiconductor chip and the encapsulating resin layer, covers at least a part of an edge of the semiconductor chip on the side of the multilayer interconnection structure, and is smaller in Young’s modulus than the encapsulating resin layer.
2. The device according to claim 1, wherein a part of the stress relaxing resin layer which covers the side surface of the semiconductor chip extends across a boundary between the multilayer interconnection structure and the semiconductor substrate.
3. The device according to claim 2, further comprising:
a wiring substrate facing a second major surface of the semiconductor chip which is opposite to the first major surface; and
a mounting material which is interposed between the semiconductor chip and the wiring substrate and fixes the semiconductor chip on the wiring substrate,
wherein the mounting material covers a part of the side surface of the semiconductor chip on a side of the wiring substrate, and
wherein the part of the stress relaxing resin layer which covers the side surface of the semiconductor chip is in contact with a part of the mounting material which covers the side surface of the semiconductor chip.
4. The device according to claim 1, wherein the stress relaxing resin layer covers the first major surface only at a periphery thereof.
5. The device according to claim 1, wherein the stress relaxing resin layer covers a center and a periphery of the first major surface.
6. The device according to claim 1, wherein the semiconductor chip further comprises a buffer coating layer which contains a resin and covers a major surface of the multilayer interconnection structure.
7. The device according to claim 1, wherein the stress relaxing resin layer entirely covers the edge of the semiconductor chip on the side of the multilayer interconnection structure.
8. The device according to claim 1, wherein the stress relaxing resin layer covers a corner of the semiconductor chip on the side of the multilayer interconnection structure.
9. The device according to claim 1, wherein Young’s modulus of the stress relaxing resin layer at room temperature is 2 GPa or less.
10. The device according to claim 1, further comprising a wiring substrate which supports the semiconductor chip.
11. The device according to claim 10, wherein a second major surface of the semiconductor chip which is opposite to the first major surface faces the wiring substrate.
12. The device according to claim 10, wherein the wiring substrate is an interposer.
13. A semiconductor assembly comprising:
a wiring substrate;
a semiconductor chip which comprises a semiconductor substrate and a multilayer interconnection structure formed thereon and is disposed such that the semiconductor substrate is interposed between the multilayer interconnection structure and the wiring substrate, the multilayer interconnection structure including an interlayer insulating film smaller in relative dielectric constant than an SiO2 film;
a mounting material which is interposed between the semiconductor chip and the wiring substrate and fixes the semiconductor chip on the wiring substrate;
an encapsulating resin layer which covers the semiconductor chip fixed on the wiring substrate; and
a stress relaxing resin layer which is interposed between the semiconductor chip and the encapsulating resin layer, covers at least a part of an edge of the semiconductor chip on a side of the multilayer interconnection structure, and is smaller in Young’s modulus than the encapsulating resin layer.
14. The assembly according to claim 13, wherein a part of the stress relaxing resin layer which covers a side surface of the semiconductor chip extends across a boundary between the multilayer interconnection structure and the semiconductor substrate.
15. The assembly according to claim 14, wherein the mounting material covers a part of the side surface of the semiconductor chip on a side of the wiring substrate, and
wherein the part of the stress relaxing resin layer which covers the side surface of the semiconductor chip is in contact with a part of the mounting material which covers the side surface of the semiconductor chip.
16. The assembly according to claim 13, wherein the stress relaxing resin layer covers a major surface of the semiconductor chip on the side of the multilayer interconnection structure only at a periphery of the major surface.
17. The assembly according to claim 13, wherein the stress relaxing resin layer covers a center and a periphery of a major surface of the semiconductor chip on the side of the multilayer interconnection structure.
18. The assembly according to claim 13, wherein the semiconductor chip further comprises a buffer coating layer which contains a resin and covers a major surface of the multilayer interconnection structure.
19. The assembly according to claim 13, wherein the stress relaxing resin layer entirely covers the edge of the semiconductor chip on the side of the multilayer interconnection structure.
20. The assembly according to claim 13, wherein the stress relaxing resin layer covers a corner of the semiconductor chip on the side of the multilayer interconnection structure.