1. A singulated semiconductor apparatus, comprising:
a plurality of singulated integrated circuits disposed on a dicing tape; and
one or more portions of a semiconductor wafer disposed on the dicing tape, among the singulated integrated circuits, and corresponding to dicing streets of the semiconductor wafer.
2. The singulated semiconductor apparatus of claim 1, wherein the one or more portions of the semiconductor wafer are portions of a single crystalline silicon semiconductor wafer.
3. The singulated semiconductor apparatus of claim 1, wherein the one or more portions of the semiconductor wafer comprise a residual mask layer thereon.
4. The singulated semiconductor apparatus of claim 1, wherein the one or more portions of the semiconductor wafer comprise one or more metallization layers thereon.
5. The singulated semiconductor apparatus of claim 1, wherein each of the one or more portions of the semiconductor wafer is spaced approximately in the range of 10-15 microns from a nearest of the singulated integrated circuits.
6. The singulated semiconductor apparatus of claim 1, wherein neighboring ones of the singulated integrated circuits are spaced apart by a distance approximately in the range of 50-85 microns.
7. A singulated semiconductor apparatus, comprising:
a plurality of singulated integrated circuits disposed on a dicing tape;
one or more portions of a single crystalline silicon wafer disposed on the dicing tape, among the singulated integrated circuits, and corresponding to dicing streets of the single crystalline silicon wafer;
one or more metallization layers disposed above the one or more portions of the single crystalline silicon wafer; and
a residual mask layer disposed above the one or more metallization layers of the one or more portions of the single crystalline silicon wafer.
8. The singulated semiconductor apparatus of claim 7, wherein each of the one or more portions of the semiconductor wafer is spaced approximately in the range of 10-15 microns from a nearest of the singulated integrated circuits.
9. The singulated semiconductor apparatus of claim 7, wherein neighboring ones of the singulated integrated circuits are spaced apart by a distance approximately in the range of 50-85 microns.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An apparatus for rotationally locking a drillstring swivel having two halves, while permitting monitoring of torque between the halves of the swivel, comprising:
a first member attached to the exterior of one half of the swivel;
a second member releasably attached to the exterior of the other half of the swivel;
a means for connecting first and second members; and
means for measuring force imposed between said first and second members, and for determining torque between said first and second members.
2. The apparatus of claim 1, wherein:
said first member comprises a collar encircling said swivel, a means for connecting said collar to said swivel, and a main plate extending outwardly from said swivel;
said second member comprises a releasable gripping means; and
said apparatus further comprises a means for controlling said releasable gripping means.
3. The apparatus of claim 2, wherein:
said means for connecting said first and second members comprises a pair of spaced apart, downwardly extending stop plates connected to said first member, forming an opening therebetween, wherein a portion of said second member is disposed within said opening between said pair of stop plates.
4. The apparatus of claim 3, wherein said means for monitoring force imposed between said first and second members, and for determining torque between said first and second members, comprises a load cell disposed between said pair of stop plates and said second member.
5. An apparatus for rotationally locking the two halves of a drillstring swivel, while permitting monitoring of torque between the two halves of the swivel, comprising:
a first member comprising a cylindrical collar adapted to fit around a non-rotating half of a drillstring swivel, a means for attaching said collar to said swivel, and a main plate attached to said collar and extending outwardly away from a central axis of said collar;
a second member comprising a set of jaws which releasably grip the other half of said drillstring swivel, said second member suspended from said first member;
stop plates which substantially lock said first and second members rotationally together;
a means for measuring force between said first and second members arising from torque on said drillstring swivel;
a means for determining torque between said halves of said drillstring swivel.
6. The apparatus of claim 5, wherein:
said stop plates comprise a pair of spaced apart plates extending from said main plate, forming an opening therebetween, into which a portion of said second member is disposed.
7. The apparatus of claim 6, wherein said means for monitoring torque between said halves of said drilling swivel comprises a load cell and microprocessor.
8. The apparatus of claim 5, further comprising a control panel for selectively controlling said jaws of said second member, to enable gripping and releasing a rotatable side of said swivel.
9. The apparatus of claim 8, wherein said second member comprises hydraulic cylinders which move said jaws.
10. The apparatus of claim 5, wherein said means for attaching said collar to said swivel comprises a plurality of threaded fasteners.