1. A method for communicating a pixel prediction mode to a decoder, said method comprising:
a) preparing a set of pixel prediction modes at an encoder and a decoder;
b) determining an estimated pixel prediction mode at said encoder and said decoder, said estimated mode being a member of said set;
c) determining an actual prediction mode at said encoder, said actual prediction mode being a member of said set;
d) comparing said estimated mode to said actual mode;
e) transmitting a first instruction, from said encoder to said decoder, to signify whether said estimated mode to be used; and
f) transmitting a second instruction when said estimated mode is different from said actual prediction mode, from said encoder to said decoder, to use another mode in said set other than said estimated mode.
2. A method for identifying a pixel prediction mode at a decoder, said method comprising:
a) preparing a set of pixel prediction modes;
b) identifying an estimated pixel prediction mode, said estimated mode being a member of said set;
c) identifying an actual prediction mode, said actual prediction mode being a member of said set;
d) being signaled with a first instruction to signify whether said estimated mode to be used; and
e) being signaled with a second instruction when said estimated mode is different from said actual prediction mode to use another mode in said set other than said estimated mode.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An alicyclic epoxy resin containing no ester bonds, manufactured through a reaction between an alicylic epoxy compound represented by general formula (I) and a phenol compound, wherein the general formula (I) is as follows:
wherein, each of R1to R18 is identical to or different from each other, and is a hydrogen atom, a halogen atom except a chlorine atom, a hydrocarbon group which optionally contains an oxygen atom or a halogen atom except a chlorine atom, or an alkoxy group which optionally contains a substituted group.
2. An alicyclic epoxy resin containing no ester bonds according to claim 1, Wherein the phenol compound has a hydroxyl group bonded through an aliphatic chain.
3. An alicyclic epoxy resin containing no ester bonds according to claim 2, wherein the phenol compound having a hydroxyl group bonded through an aliphatic chain is at least one of bisphenol and bisphenol and contains a 1:2 adduct with the alicyclic epoxy compound.
4. A resin composition, comprising:
an alicyclic epoxy resin containing no ester bonds according to any one of claims 1, 2 and 3, and
at least one of a photo-acid generator (photo-cationic polymerization initiator) andor a thermal cationic polymerization initiator.
5. A resin composition according claim 4, which is one of a coating agent and an encapsulate or a transparent encapsulate for an electronics device.
6. A resin composition according claim 4, which is any one of a molding material and a material for a printed circuit board.
7. A resin composition according to claim 4, which is an adhesive.