1. A solid micro components separation device comprising a stage,
a well having a certain specific volume on the stage,
a base fixed on the stage, and
an actuator connecting the base and the well; wherein
the well can contain at least two kinds of different components.
2. The components separation device of claim 1; wherein
the well has a cavity of a certain specific volume, the cavity contains a mixture of a plurality of components, the mixture is separated into respective components when the well is vibrated by the actuator.
3. The components separation device of claim 1; wherein
the well is driven by the actuator to move on a plane parallel to the stage in a rotating direction.
4. The components separation device of claim 3; wherein
the actuator is formed by a fixed comb-teeth electrode connected to the base and an opposing electrode consisting of movable comb-teeth electrode connected to the well.
5. The components separation device of claim 3; wherein
the movable comb-teeth electrode is led to the stage through a common electrode which is formed of one of the metals among gold, chromium, titanium and platinum.
6. The components separation device of claim 3; wherein
the stage is further provided with a central axis connecting the well and the stage, and a plurality of the opposing electrodes.
7. The components separation device of claim 6; wherein
one of the opposing electrodes and the other opposing electrode are applied respectively with different voltages cyclically so that the actuator vibrates the well in the rotating direction with the central axis as the center of revolution.
8. The components separation device of claim 1; wherein
the well is driven by the actuator to move on a plane parallel to the stage in the crosswise directions.
9. The components separation device of claim 1; wherein
the actuator comprises a piezoelectric element layer.
10. The components separation device of claim 9; wherein
the actuator is formed in a laminated structure having a silicon substrate and the piezoelectric element layer, the piezoelectric element layer has a piezoelectric layer provided at the respective surfaces with an upper electrode and a lower electrode.
11. The components separation device of claim 10; wherein
the lower electrode is formed of platinum or titanium,
the piezoelectric layer is formed of lead zirconate titanate, and
the upper electrode is formed of gold, platinum, titanium or chromium.
12. The components separation device of claim 1; wherein
the actuator has a meander shape.
13. The components separation device of claim 1; wherein
the well is made of silicon material, the stage is made of glass material.
14. A method for manufacturing components separation device comprising the steps of
etching a glass substrate to form a glass cavity, a glass base and a central axis,
forming a common electrode of a certain specific pattern on the central axis and the glass cavity, which common electrode being made of one of the metals among a group consisting of gold, chromium, titanium and platinum,
bonding a silicon substrate on the glass substrate by the direct bonding method, and
etching the bonded silicon substrate; wherein
the process of etching the silicon substrate is for providing a well having a silicon cavity of a certain specific volume and a movable comb-teeth electrode on the glass cavity, and a fixed comb-teeth electrode on the glass base.
15. A method for manufacturing components separation device comprising the steps of
etching a glass substrate to form a glass cavity and a glass base,
bonding a silicon substrate on the glass substrate by the direct bonding method,
forming a lower electrode, a piezoelectric layer and an upper electrode, in the order, on the bonded silicon substrate,
patterning the upper electrode, piezoelectric layer and lower electrode by an etching process, and
providing the well and a supporting member on glass cavity by etching the silicon substrate.
16. A method of separating solid micro components, using a components separation device comprising a stage, a well having a certain specific volume on the stage, a glass base fixed on the stage, and an actuator connecting the glass base and the well, the well having a silicon cavity of a certain specific volume; wherein
a sample consisting of solid components and liquid components contained in the well is vibrated by the actuator, and different components contained in the sample contained in the well are brought to uneven distribution and separated into respective components.
17. The method of separating solid micro components recited in claim 16, wherein the liquid component of sample is blood plasma, while the solid component is cells.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A connector for digital bands, comprising:
a plurality of connect pins spaced apart from each other in a direction, passing through the digital band made of a plurality of digital yarns to fix the digital bands, and electrically connected with the digital bands;
a lower housing that fixes the digital bands and the connect pins to a lower part with one end of each of the connect pins exposed through a lower surface;
an upper housing coupled with an upper part of the lower housing to fix the digital bands and the connect pins; and
wherein the lower housing comprises an exposed planar bottom surface, and wherein the connect pins comprise a bottommost surface coplanar with the bottom surface of the lower housing.
2. The connector of claim 1, wherein the connect pins correspond to the digital yarns to be connected to the digital yarns and are electrically connected to metal units formed in the digital yarns.
3. The connector of claim 1, wherein the connect pins further comprise piercing units fixing the digital yarns and extending units connected to the piercing units to be extended to the outside of the lower housing.
4. The connector of claim 3, wherein each of the piercing units comprises two vertical columns such that the digital yarns are inserted there between to fix the digital yarns.
5. The connector of claim 4, wherein a distance between the columns is shorter than a cross-sectional diameter of the metal units of the digital yarns.
6. The connector of claim 1, wherein the connect pins are arranged in zigzag fashion.
7. The connector of claim 1, wherein each of the digital bands is made by taping upper and lower ends of the plurality of digital yarns or by combining the same with fabrics.
8. The connector of claim 1, wherein one of the lower housing and the upper housing further comprises at least one protrusion formed on a surface of the lower housing or the upper housing to be coupled with the digital bands.
9. The connector of claim 1, wherein the lower housing comprises through holes in a lower part thereof so that the connect pins penetrate the through holes and are exposed to a lower surface of the lower housing through the through holes.
10. The connector of claim 1, wherein the lower housing comprises an exposed planar rearward surface, and wherein the connect pins comprise a terminal end aligned with the rearward surface of the lower housing.
11. A receptacle, comprising:
a plurality of conductive patterns, each one end of which is connected to an external circuit, and an entirety of a structure for each conductive pattern comprising a single and continuous structure with each one end exposed and spaced from the receptacle;
a lower housing including a plurality of through holes penetrated by the other ends of the conductive patterns to support the other ends of the conductive patterns from a lower part of the lower housing;
an upper housing coupled with an upper part of the lower housing to define a space between the upper housing and the lower housing;
wherein a digital band connector connected to digital bands is inserted into the space so that the digital band connector is electrically connected to the conductive patterns; and
wherein the lower housing comprises a bottommost surface and wherein the conductive patterns comprise a bottommost surface coplanar with the bottommost surface of the lower housing.
12. The receptacle of claim 11, wherein each of the lower housing and the upper housing comprises a step such that the digital band connector is fixed to the step.
13. The receptacle of claim 12, further comprising rubber rings provided along the steps of the lower housing and the upper housing.
14. The receptacle of claim 11, wherein each of the conductive patterns extends horizontally outside of the lower housing.
15. A connector assembly, comprising:
a digital band connector including:
a plurality of connect pins spaced apart from each other in a direction to fix digital bands made of a plurality of digital yarns and to be electrically connected with the digital bands;
a lower housing that fixes the digital bands and the connect pins in a lower part with one end of each of the pins exposed through a lower surface; and
an upper housing coupled with an upper part of the lower housing to fix the digital bands and the connect pins; and
a receptacle including:
a plurality of conductive patterns, each one end of which is connected to an external circuit and the other ends of which are electrically connected to the connect pins;
a lower housing having a plurality of through holes penetrated by the other ends of the conductive patterns to support the other ends of the conductive patterns from a lower part; and
an upper housing coupled with an upper part of the lower housing to define a space, in which the digital band connector is positioned, between the upper housing and the lower housing.
16. The connector assembly of claim 15, wherein the connect pins of the digital band connector are connected to the digital yarns to correspond to the digital yarns and are electrically connected to metal units formed in the digital yarns.
17. The connector assembly of claim 15, wherein one of the upper housing or the lower housing of the digital band connector comprises at least one protrusion formed on a surface of the lower housing or the upper housing that contacts the digital bands.
18. The connector assembly of claim 15, wherein the digital band connector further comprises coupling jaws formed in the lower housing and the upper housing, and the receptacle comprises steps formed in the lower housing and the upper housing so that the coupling jaws are fixed to the steps.
19. The connector assembly of claim 18, wherein the receptacle further comprises rubber rings provided along the steps.
20. The connector assembly of claim 15, wherein each one of the conductive patterns comprises an arcuate portion in direct contact with each one of the connect pins.