1. A method comprising:
obtaining network distance information including a compilation of network distance information provided by a plurality of service providers;
storing the network distance information in a network distance table;
receiving a request from a client for an identity of a peer providing content;
identifying a first peer and a second peer providing the content;
determining a first network distance between the first peer and the client and a second network distance between the second peer and the client;
determining that the first peer and the second peer are both distant potential peers to the client based on the first network distance and the second network distance not being included in the network distance table, wherein the distant potential peers have a network distance above a threshold;
utilizing the distant potential peers when no non-distant potential peers are identified; and
providing the identity of the first peer to the client.
2. The method of claim 1 wherein the network distance information is selected from a group consisting of network cost, bandwidth, number of hops, roundtrip time, and any combination thereof.
3. The method of claim 1 wherein providing includes providing a list of peers based on the network distance between the peers and the client.
4. The method of claim 3 wherein the list of peers is sorted by network distance for each peer.
5. The method of claim 1 further comprising:
obtaining policy information for first and second autonomous systems; and
storing the policy information for the first and second autonomous systems in the network distance table.
6. The method of claim 5 wherein the policy information includes a scaling factor for combining the compilation of network distance information provided by the service providers.
7. The method of claim 5 wherein the policy information indicates preferred routes between the autonomous systems.
8. A system comprising:
a memory including a network distance table having network distance information including a compilation of network distance information provided by a plurality of service providers; and
a processor configured to:
receive a request from a client for an identity of a peer providing content;
identify a first peer and a second peer providing the content;
determine a first network distance between the first peer and the client and a second network distance between the second peer and the client;
determine that the first peer and the second peer are both distant potential peers to the client based on the first network distance and the second network distance not being included in the network distance table, wherein the distant potential peers have a network distance above a threshold;
utilize the distant potential peers when no non-distant potential peers are identified; and
provide the identity of the first peer to the client.
9. The system of claim 8 wherein the network distance information is selected from a group consisting of network cost, bandwidth, number of hops, roundtrip time, and any combination thereof.
10. The system of claim 8 wherein the processor is configured to provide the identity by providing a list of peers based on the network distance between the peers and the client.
11. The system of claim 10 wherein the list of peers is sorted by network distance of each peer.
12. The system of claim 8 wherein the memory further includes policy information for first and second autonomous systems.
13. The system of claim 12 wherein the policy information includes a scaling factor for combining the compilation of network distance information provided by the service providers.
14. The system of claim 12 wherein the policy information indicating preferred routes between the autonomous systems.
15. An apparatus comprising:
a processor; and
a memory having instructions to manipulate the processor, the instructions comprising:
instructions to obtain network distance information including a compilation of network distance information provided by a plurality of service providers;
instructions to store the network distance information in a network distance table;
instructions to identify a first peer and a second peer providing content;
instructions to determine a first network distance between the first peer and the client and a second network distance between the second peer and the client;
instructions to determine that the first peer and the second peer are both distant potential peers to the client based on the first network distance and the second network distance not being included in the network distance table, wherein the distant potential peers have a network distance above a threshold;
instructions to utilize the distant potential peers when no non-distant potential peers are identified;
instructions to send a request for content from the device to the first peer; and
instructions to receive the content at the device from the first peer.
16. The apparatus of claim 15 wherein the network distance information is selected from a group consisting of network cost, bandwidth, number of hops, roundtrip time, and any combination thereof.
17. The apparatus claim 16 wherein the network distance information includes the network distance from the first and second peers to the device.
18. The apparatus of claim 15 wherein the network distance information includes the network distance to the first and second peers from the device.
19. The apparatus of claim 15 wherein the plurality of instructions further comprise:
instructions to obtain policy information for first and second autonomous systems; and
instructions to store the policy information for the first and second autonomous systems in the network distance table.
20. The apparatus of claim 19 wherein the policy information includes a scaling factor for combining the compilation of network distance information provided by the service providers.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
What is claimed is:
1. A method of fabricating a semiconductor die on a wafer having a device layer, an etch-stop layer, and a primary handle layer, wherein the etch-stop layer is sandwiched between the device layer and the primary handle layer, the method comprising the steps of:
(a) etching a die release trench in the primary handle layer;
(b) etching a moving parts trench and die release trench in the device layer where the die trench in the device layer is aligned with the die release trench formed in the primary handle layer;
(c) affixing an additional handle layer to the primary handle layer;
(d) removing the etch-stop layer located between the die release trenches on the device and primary handle layers; and
(e) removing the additional handle layer to release the die.
2. The method of claim 1 wherein step (a) further comprises a step of etching a vacuum hole in the primary handle layer.
3. The method of claim 1 wherein step (c) further comprises applying a thermal release material to a surface of the additional handle layer that will come into contact with the primary handle layer.
4. The method of claim 3 wherein step (e) comprises heating the wafer.
5. The method of claim 1 wherein step (d) comprises exposing the wafer to hydrofluoric acid.
6. The method of claim 1 wherein step (a) further comprises a step of etching a stiction relief trench directly underneath the moving parts trench.
7. The method of claim 1, wherein step (b) comprises performing Deep Reactive Ion Etching (DRIE).
8. The method of claim 1 wherein step (a) is performed before step (b).
9. The method of claim 1 wherein step (c) is performed before step (d).
10. The method of claim 3 wherein the thermal release material is Revalpha.
11. A MEMS device formed in a wafer having a device layer, an etch-stop layer and a primary handle layer wherein the etch-stop layer is sandwiched between the device layer and the primary handle layer by the process of claim 1.
12. The MEMS device of claim 11 wherein the device layer and primary handle layer are silicon.
13. A method of fabricating a semiconductor die on a wafer having a device layer, an etch-stop layer, and a primary handle layer, wherein the etch-stop layer is sandwiched between the device layer and the primary handle layer, the method comprising the steps of:
(a) creating a die release trench in the primary handle layer;
(b) creating a die release trench in the device layer where the die trench in the device layer is aligned with the die release trench formed in the primary handle layer;
(c) affixing an additional handle layer to the primary handle layer;
(d) removing the etch-stop layer located between the die release trenches on the device and primary handle layers; and
(e) removing the additional handle layer to release the die.
14. The method of claim 13 wherein step (a) further comprises a step of etching a vacuum hole in the primary handle layer and step (b) further comprises a step of creating a moving parts trench in the device layer.
15. The method of claim 13 wherein step (c) further comprises applying a thermal release material to a surface of the additional handle layer that will come into contact with the primary handle layer.
16. The method of claim 13 wherein step (e) comprises heating the wafer.
17. The method of claim 13 wherein step (d) comprises exposing the wafer to hydrofluoric acid.
18. The method of claim 13 wherein step (a) further comprises a step of creating a stiction relief trench directly underneath the moving parts trench.
19. A MEMS device formed in a wafer having a device layer, an etch-stop layer and a primary handle layer wherein the etch-stop layer is sandwiched between the device layer and the primary handle layer by the process of claim 13.
20. The MEMS device of claim 19 wherein the device layer and primary handle layer are silicon.