1. A method, comprising:
a) providing, a device, comprising,
i) a meltable material;
ii) an inlet port linked to a gas source, wherein said inlet port is associated with a first heater element;
iii) a stem microchannel comprising a second heater element, wherein said stem microchannel is in fluidic communication with said inlet port;
iv) a main microchannel intersecting said stem microchannel, said main microchannel comprising a third heater element, wherein said intersecting forms a junction;
b) firing said first heater element to load said meltable material into said stem microchannel through said inlet port;
c) firing at least two of said heater elements under conditions such that said meltable material at least partially melts to create a melted plug; and
d) applying pressure with said gas source under conditions such that said melted plug is moved.
2. The method of claim 1, wherein said junction is configured as a \u201cT\u201d junction.
3. The method of claim 1, wherein said junction is configured as a \u201cY\u201d junction.
4. The method of claim 1, wherein said meltable material is selected from a group consisting of solder, plastic, polymer, electrorheological fluid and wax.
5. The method of claim 1, wherein said substrate is selected from the group consisting of glass and silicon.
6. The method of claim 1, wherein said firing of at least two of said heater elements comprise said second and third heater elements.
7. The method of claim 1, wherein said applying of said gas source comprises a vacuum source, thereby retracting said melted plug out of said junction.
8. The method of claim 1, wherein said stem microchannel and said main microchannel are disposed in a substrate.
9. The method of claim 1, wherein said firing of at least two of said heater elements comprise said first and second heater elements and said applying pressure of said gas source comprises generating a positive pressure, thereby moving said melted plug into said junction.
10. The method of claim 9, wherein said pressure source is an air source.
11. The method of claim 9, wherein after said melted material moves to said junction, said melted plug is allowed to cool.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A drive film for an organic light emitting diode display, the drive film comprising:
a base film including an input terminal and an output terminal;
a plurality of first signal lines formed on the base film; and
a plurality of second signal lines formed on the base film and disposed between the first signal lines at the output terminal.
2. The drive film of claim 1, wherein the second signal lines are alternatingly disposed between the first signal lines, respectively, at the output terminal.
3. The drive film of claim 1, wherein a first set of the second signal lines at the input terminal are electrically connected to a second set of the second signal lines at the output terminal via a conductive layer disposed over the base film and the first and second signal lines.
4. The drive film of claim 1, wherein the second signal lines are evenly distributed across the output terminal.
5. The drive film of claim 1, further comprising:
an insulating film formed on the first signal lines and the second signal lines and exposing portions of the first and second signal lines at the input terminal and the output terminal of the base film;
a conductive layer formed on the insulating film; and
a plurality of connecting members connecting the second signal lines and the conductive layer near the input terminal and the output terminal.
6. The drive film of claim 5, wherein the connecting members comprise penetrating holes passing through the insulating film.
7. The drive film of claim 6, wherein each connecting member comprises a conductive portion.
8. The drive film of claim 1, wherein the base film comprises polyimide.
9. The drive film of claim 1, wherein the first signal lines transmit signals having varying values.
10. The drive film of claim 1, wherein the second signal lines transmit signals having fixed values.
11. A drive package for an organic light emitting diode display, the drive package comprising:
a base film including an input terminal and an output terminal;
a conductive layer formed on the base film and exposing portions of the input terminal and the output terminal of the base film;
a drive circuit chip mounted on the base film and exposed over the conductive layer;
a plurality of first signal lines formed on the base film and connected to the drive circuit chip;
a plurality of second signal lines formed near the input terminal and a plurality of second signal lines formed near the output terminal of the base film, the plurality of second signal lines formed near the output terminal disposed between the first signal lines at the output terminal;
an insulating film interposed between the first and second signal lines and the conductive layer; and
a plurality of connecting members connecting the second signal lines and the conductive layer near the input terminal and the output terminal.
12. The drive package of claim 11, wherein the connecting members comprise penetrating holes passing through the insulating film.
13. The drive package of claim 11, wherein the base film comprises polyimide.
14. The drive package of claim 11, wherein the first signal lines transmit data voltages.
15. The drive package of claim 11, wherein the first signal lines transmit scanning voltages.
16. The drive package of claim 11, wherein the second signal lines transmit a drive voltage.
17. The drive package of claim 11, wherein the second signal lines transmit a common voltage.
18. The drive package of claim 11, wherein the drive circuit chip comprises a data drive integrated circuit chip.
19. The drive package of claim 11, wherein the drive circuit chip comprises a scanning drive integrated circuit chip.
20. The drive package of claim 11, wherein the second signal lines are evenly distributed across the output terminal.
21. An organic light emitting diode display comprising
a substrate,
a display region formed on the substrate, and
a first drive package successively attached to at least one of upper and lower edges of the substrate,
wherein the first drive package comprises:
a first base film including an input terminal and an output terminal;
a first conductive layer formed on the first base film and exposing portions of the input terminal and the output terminal of the first base film;
a first drive circuit chip mounted on the first base film and exposed over the first conductive layer;
a plurality of first signal lines formed on the first base film and connected to the first drive circuit chip;
a plurality of second signal lines formed near the input terminal and a plurality of second signal lines formed near the output terminal of the first base film, and the plurality of second signal lines formed near the output terminal disposed between the first signal lines at the output terminal;
a first insulating film interposed between the first and the second signal lines and the first conductive layer; and
a plurality of first connecting members connecting the second signal lines and the first conductive layer near the input terminal and the output terminal.
22. The organic light emitting diode display of claim 21, wherein the first signal lines transmit data voltages, and the first drive circuit chip comprises a data drive integrated circuit chip.
23. The organic light emitting diode display of claim 21, wherein the second signal lines transmit a common voltage or a drive voltage.
24. The organic light emitting diode display of claim 21, further comprising a second drive package attached to at least one of left and right edges of the substrate,
wherein the second drive package comprises:
a second base film including an input terminal and an output terminal;
a second conductive layer formed on the second base film and exposing portions of the input terminal and the output terminal of the second base film;
a second drive circuit chip mounted on the second base film and exposed over the second conductive layer;
a plurality of third signal lines formed on the second base film and connected to the second drive circuit chip;
a plurality of fourth signal lines formed near the input terminal and a plurality of fourth signal lines formed near the output terminal of the second base film, and the plurality of fourth signal lines formed near the output terminal disposed between the third signal lines at the output terminal;
a second insulating film interposed between the third and fourth signal lines and the second conductive layer; and
a plurality of second connecting members connecting the fourth signal lines and the second conductive layer near the input terminal and the output terminal.
25. The organic light emitting diode display of claim 24, wherein the fourth signal lines transmit a common voltage or a drive voltage.
26. The organic light emitting diode display of claim 24, wherein the third signal lines transmit scanning voltages, and the second drive circuit chip comprises a scanning drive integrated circuit chip.
27. A method of enhancing uniformity of a display of an organic light emitting diode display, the method comprising:
providing a drive package having an input terminal on a first edge, an output terminal on a second edge opposite the first edge, and having third and fourth opposing edges connected between the first and second edges;
attaching the output terminal of the drive package to a display panel of the organic light emitting diode display; and,
substantially evenly delivering a fixed voltage from the output terminal of the drive package along a length of the output terminal extending from the third edge to the fourth edge of the drive package.
28. The method of claim 27, wherein providing a drive package includes:
arranging a plurality of first signal lines on a base film of the drive package;
arranging a first set of second signal lines adjacent the input terminal, and a second set of second signal lines adjacent the output terminal;
and uniformly distributing the second set of signal lines from the third edge to the fourth edge of the drive package, wherein the fixed voltage is delivered from the second set of signal lines to the display panel.
29. The method of claim 28, wherein arranging the plurality of first signal lines comprises alternatingly arranging the first signal lines with the second set of second signal lines adjacent the output terminal.
30. The method of claim 27, further comprising substantially evenly delivering a variable voltage from the output terminal of the drive package along a length of the output terminal extending from the third edge to the fourth edge of the drive package.
31. The method of claim 30, wherein substantially evenly delivering the fixed voltage and the variable voltage from the output terminal includes alternatingly arranging signal lines delivering the fixed voltage with signal lines delivering the variable voltage.