1. A deployable plug system, comprising:
an elongated handle assembly having a hollow conduit, a distal end with a conduit connector in fluid communication with said conduit and a hinge assembly having a handle mounting body, and a proximal end, wherein a gas control valve is affixed to the handle assembly at the proximal end, and wherein the gas control valve is configured to receive pressurized gas from a source of pressurized gas, said gas control valve further including a valve trigger which selectively applies pressurized gas from said source of pressurized gas to said conduit; and
a bladder assembly having a bladder mounting body removably connectable to said handle mounting body, a bladder attached to said bladder mounting body, a check valve assembly for allowing pressurized gas from said conduit to enter said bladder, and a check valve assembly connector that selectively connects said check valve assembly to said conduit connector.
2. The deployable plug system of claim 1, wherein said conduit connector is a junction block comprising a block.
3. The deployable plug system of claim 2, wherein said block has a slot that extends along said block from a front opening, and wherein said handle assembly includes a gas aperture that passes from said conduit into said slot.
4. The deployable plug system of claim 3, wherein said check valve assembly connector includes a hose that selectively connects said check valve to said junction block to communicate pressurized gas from said conduit to said bladder.
5. The deployable plug system of claim 4, wherein said hose selectively connects to said junction block using a disc-shaped sealing ring which slides into said slot, and wherein said hose connects to said sealing ring and forms a seal with said junction block when said hose fits over said gas aperture.
6. (canceled)
7. The deployable plug system of claim 5, further including a release rod slidingly affixed to said handle assembly which extends into said junction block, wherein said release rod can push said sealing ring out of said slot.
8-9. (canceled)
10. The deployable plug system of claim 1, wherein said source of pressurized gas is a removable compressed-gas canister that can be retained by the gas control valve.
11-13. (canceled)
14. The deployable plug system of claim 1, wherein said check valve assembly includes a one way check valve that allows gas to enter but not leave said bladder, and a relief valve to enable pressurized gas to escape said bladder.
15. (canceled)
16. The deployable plug system of claim 1, wherein said hinge assembly includes a fastener assembly that locks said hinge assembly relative to said handle assembly.
17. The deployable plug system of claim 1, wherein said handle mounting body and said bladder mounting body include interlocking features.
18. The deployable plug system of claim 1, wherein said handle mounting body is a handle mounting plate and said bladder mounting body is a bladder mounting plate.
19. The deployable plug system of claim 18, wherein said handle mounting plate includes a male feature, wherein said bladder mounting plate includes a female feature, and wherein said handle mounting plate can be locked into said bladder mounting plate by moving up and released by moving down.
20. The deployable plug system of claim 19, wherein said male feature has a \u201cT\u201d cross-sectioned.
21. The deployable plug system of claim 1, wherein said handle assembly has a handle on said proximal end of said handle assembly.
22. The deployable plug system of claim 1, wherein said valve trigger is disposed adjacent said handle.
23. The deployable plug system of claim 21, wherein said handle includes grip features.
24. The deployable plug system of claim 1, wherein said bladder expands in length and width when filled with pressurized gas.
25. The deployable plug system of claim 1, wherein said bladder includes ribs.
26. (canceled)
27. The deployable plug system of claim 1, wherein the handle mounting body and the bladder mounting body are configured to permit the handle assembly to be attached to and detached from the bladder assembly by sliding the distal end of the handle assembly relative to the bladder assembly.
28. The deployable plug system of claim 1, wherein the conduit connector and the check valve assembly connector are configured to permit the conduit to be attached to and detached from the check valve assembly by sliding the distal end of the handle assembly relative to the bladder assembly.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method of testing a semiconductor wafer having a test structure comprising:
placing the semiconductor wafer in an electron-beam (\u201cE-beam\u201d) system;
performing an E-beam stress scan of at least the test structure to electrically stress the test structure to produce a stress defect in the test structure; and
performing an E-beam post-stress inspection scan of the test structure in the E-beam system to identify the stress defect.
2. The method of claim 1 further comprising a step, after placing the semiconductor wafer in the E-beam system and before performing the E-beam stress scan, of performing an E-beam pre-stress inspection scan to identify an intrinsic defect of the semiconductor wafer.
3. The method of claim 2 further comprising a step of comparing the E-beam pre-stress inspection scan with the E-beam post-stress inspection scan.
4. The method of claim 2 wherein the E-beam post-stress scan further identifies an intrinsic defect and the stress defects are identified by comparing the E-beam pre-stress inspection scan and the E-beam post-stress inspection scan.
5. The method of claim 1 wherein the E-beam post-stress inspection scan further identifies an intrinsic defect.
6. The method of claim 1 wherein the test structure includes floating polysilicon structures and quasi-grounded polysilicon structures each separated from a semiconductor substrate by a gate dielectric layer.
7. The method of claim 6 wherein the E-beam stress scan induces breakdown of extrinsic defects in the gate dielectric layer.
8. The method of claim 1 wherein the test structure includes a floating metal structure and a grounded metal structure, the floating metal structure being separated from the grounded metal structure by an inter-metal dielectric.
9. The method of claim 1 wherein the test structure includes a floating metal structure and a grounded metal structure, the floating metal structure being separated from the grounded metal structure by an inter-layer dielectric.
10. The method of claim 1 wherein the E-beam stress scan is performed at a voltage at least twice the voltage of the E-beam pre-stress inspection scan.
11. The method of claim 1 wherein the E-beam stress scan is performed at a voltage at least twice the voltage of the E-beam post-stress inspection scan.
12. The method of claim 1 wherein the E-beam stress scan is performed at a wafer temperature higher than the wafer temperature of the E-beam pre-stress inspection scan.
13. The method of claim 1 wherein the E-beam stress scan is performed at a wafer temperature higher than the wafer temperature of the E-beam post-stress inspection scan.
14. The method of claim 1 wherein the semiconductor wafer includes partially processed field-programmable gate arrays (\u201cFPGA\u201d).
15. The method of claim 14 wherein the E-beam pre-stress inspection scan is performed over at least one partially processed FPGA.
16. The method of claim 14 wherein the E-beam post-stress inspection scan is performed over at least one partially processed FPGA.
17. The method of claim 14 wherein the E-beam stress scan is performed over at least one partially processed FPGA.
18. The method of claim 1 wherein the test structure is defined in an alley of the semiconductor wafer.
19. The method of claim 1 wherein the semiconductor wafer further has a second test structure and the E-beam stress scan is performed under first stress scan conditions, and further comprising:
performing a second E-beam stress scan under second stress scan conditions to electrically stress at least the second test structure to produce a second stress defect in the second stress structure.
20. The method of claim 19 wherein the step of performing the second E-beam stress scan occurs after performing the E-beam inspection scan.