1. A carrier arrangement, comprising:
a carrier configured to fix a semiconductor chip;
contacts located on the carrier and configured to make contact with the semiconductor chip; and
an overvoltage protection in a form of a spark gap arrangement formed between the contacts.
2. A smart card module, comprising:
a smart card body;
a semiconductor chip having chip connection areas; and
a carrier arrangement comprising:
a carrier having a chip side on which the semiconductor chip is fixed;
contacts configured to at least partly connect electrically with the chip connection areas of the semiconductor chip; and
at least one overvoltage protection in a form of a spark gap arrangement formed between the contacts.
3. The smart card module according to claim 2, further comprising spark gap coverings covering the region of the spark gap arrangement.
4. The smart card module according to claim 2, wherein the contacts are formed as contact areas, and the carrier arrangement can be connected to a readwrite unit, wherein the spark gap arrangement is formed between the contact areas.
5. The smart card module according to claim 4, wherein the spark gap arrangement is formed as parts of the contact areas.
6. The smart card module according to claim 4, wherein the spark gap arrangement has spark gap elements which are arranged between the contact areas, have an electrical connection to the contact areas, and are formed in mechanically thinner fashion than the contact areas.
7. The smart card module according to claim 4, wherein the carrier comprises plated-through holes and a contact area side, which is opposite the chip side, and the contact areas are formed on the contact area side, and
wherein the smart card module further comprises conductor structures, which are located on the chip side, have an electrical connection to the contact areas via the plated-through holes, and have an electrical connection to the chip connection areas of the semiconductor chip.
8. The smart card module according to claim 7, wherein the conductor structures are formed such they form another spark gap arrangement.
9. The smart card module according to claim 8, wherein the semiconductor chip is fixed on the chip side of the carrier by an adhesive and the spark gap arrangement is embodied in a region free of the adhesive.
10. The smart card module according to claim 7, wherein at least two of the plated-through holes are shaped such that they form the spark gap arrangement.
11. The smart card module according to claim 10, wherein the at least two plated-through holes are inclined towards one another such that regions having high electric field strengths are directly opposite one another.
12. The smart card module according to claim 7, wherein the spark gap arrangement has spark gap elements connected to respective ones of the contact areas and of the conductor structures.
13. The smart card module according to claim 12, wherein a spark discharge of the spark gap arrangement takes place in a vertical direction.
14. The smart card module according to claim 8, wherein the carrier has spark gap elements, which in each case have an electrical connection to a contact area or a conductor structure and form another spark gap arrangement between a respective contact area and a respective conductor structure.
15. The smart card module according to claim 10, wherein the spark gap arrangement is embodied in a spark gap cavity.
16. The smart card module according to claim 15, wherein an ionized discharge medium is located in the spark gap cavity.
17. The smart card module according to claim 8, wherein the contacts for operating the semiconductor chip are formed as coupling element connections that form the spark gap arrangement.
18. The smart card module according to claim 17, wherein the coupling element connections are antenna connections.
19. The smart card module according to claim 2, wherein another spark gap arrangement is formed between the chip connection areas.
20. A smart card module comprising:
a carrier arrangement comprising:
a carrier having a chip side and a contact area side;
contact areas arranged on the contact area side; and
at least two plated-through holes; and
a semiconductor chip fixed on the chip side of the carrier and having chip connection contacts electrically connected to the contact areas via the at least two plated-through holes;
wherein the at least two plated-through holes are formed by spark gap arrangements.
21. The carrier arrangement according to claim 20, wherein the contact areas form a spark gap arrangement, and this spark gap arrangement has a spark gap covering.
22. The carrier arrangement according to claim 20, wherein the contact areas are formed such that portions of the contact areas are spark gap arrangements.
23. The carrier arrangement according to claim 22, wherein the spark gap arrangements have spark gap elements which are electrically connected to the contact areas.
24. The carrier arrangement according to claim 23, wherein the spark gap elements are thinner than the contact areas, and the spark gap arrangements are covered in the region of the spark gap elements.
25. The carrier arrangement according to claim 20, wherein the spark gap arrangements are embodied in spark gap cavities.
26. The carrier arrangement according to claim 25, wherein the spark gap cavities contain an ionized discharge medium.
27. A smart card module comprising:
a semiconductor chip; and
a carrier arrangement comprising:
a carrier having the semiconductor chip fixed on a first side;
contacts, which are located on a second side of the carrier, electrically connected to the semiconductor chip; and
at least one spark gap arrangement, which is provided between the contacts, and which protects the semiconductor chip against overvoltages.
28. A smart card module comprising:
a semiconductor chip; and
a carrier arrangement comprising:
a carrier having the semiconductor chip fixed on a first side;
contacts, which are located on a second side of the carrier, electrically connected to the semiconductor chip; and
a spark gap arrangement means for protecting the semiconductor chip against overvoltages.
29. A smart card module comprising:
a semiconductor chip; and
a chip carrier arrangement comprising:
a carrier having the semiconductor chip fixed on a first side;
contacts and conductor structures, which are located on the carrier, at least partly electrically connected to the semiconductor chip;
at least two plated-through holes connecting the first side and an opposite side of the carrier, and forming inside the carrier a spark gap arrangement means for protecting the semiconductor chip against overvoltages, wherein each plated-through hole is configured to be connected to at least one of the contacts or at least one of the conductor structures.
30. The smart card module according to claim 29, wherein the semiconductor chip is operated by chip connection areas, and wherein the chip connection areas andor the conductor structures form another spark gap arrangement.
31. The smart card module according to claim 30, wherein the spark gap arrangement comprises spark gap coverings andor spark gap cavities inside the carrier, and wherein the spark gap cavities are filled with air andor an ionizable discharge medium.
32. The smart card module according to claim 31, wherein the conductor structures are configured to be antenna connections.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A battery pack comprising:
a cylindrical rechargeable battery;
an electronic circuit board including a charging circuit to charge the battery, and being electrically connected to the battery;
a cylindrical case incorporating the battery and the electric circuit board, and having openings at both ends thereof, and having a positive terminal and a negative terminal in the openings to discharge the battery, and having a hole in a recess portion at the peripheral surface thereof; and
a connector port being disposed at the peripheral surface, and being fixed to the electrical circuit board, and an insertion opening of the connector ports being exposed through the hole at the peripheral surface of the case,
wherein the electrical circuit board is disposed perpendicularly to an axis of the cylindrical shape of the battery, and between one of the positive terminal and the negative terminal, and one end adjacent thereto of the battery.
2. The battery pack according to claim 1,
wherein the one of the positive terminal and the negative terminal is disposed on an outer surface of the electric circuit board, and the connector port is disposed on an inner surface of the electric circuit board.
3. The battery pack according to claim 1,
wherein a space is disposed between the inner surface of the electric circuit board and the adjacent one end of the battery.
4. The battery pack according to claim 1,
wherein the connector port has an approximate box shape, and a long side of a rectangular shape of the insertion opening of the metal connector port in a front view is fixed to the circuit board, short sides of the rectangular shape are parallel to the axis of the cylindrical shape of the battery.
5. The battery pack according to claim 1,
wherein the connector port is a micro USB port.
6. The battery pack according to claim 1,
wherein the electric circuit board has a shape of a flat circular plate.
7. The battery pack according to claim 1,
wherein the electric circuit board includes a protection circuit for the battery.
8. The battery pack according to claim 1,
wherein another electric circuit board is set between the outer electric circuit board and the bottom portion of the battery
9. A flashlight equipped with the battery pack according to claim 1,
the flashlight comprising:
a light portion; and
a cylindrical grip portion,
wherein the cylindrical grip portion incorporates the battery pack.