1. An adhesive film for semiconductor used in a semiconductor packaging, comprising an adhesive layer;
wherein the adhesive layer has surface tension of 19 to 52 ergcm2 at 60\xb0 C.
2. The adhesive film for semiconductor according to the claim 1, wherein the adhesive layer has tackiness of 50 to 400 gf\xd85.0 mm at 60\xb0 C.
3. The adhesive film for semiconductor according to the claim 1, wherein the adhesive layer has adhesive force of at least 5 gfcm2.
4. The adhesive film for semiconductor according to claim 1,
wherein the adhesive layer includes at least one material selected from the group consisting of an epoxy-based resin, an organic filler, an inorganic filler and a curing agent.
5. The adhesive film for semiconductor according to the claim 4, wherein the adhesive layer further includes at least one modifier selected from the group consisting of a amino-based compound, a silane-based compound, an acrylic compound, metal organic salt, silicon oxide and titanium oxide.
6. The adhesive film for semiconductor according to claim 2, wherein the adhesive layer includes at least one material selected from the group consisting of an epoxy-based resin, an organic filler, an inorganic filler and a curing agent.
7. The adhesive film for semiconductor according to claim 3, wherein the adhesive layer includes at least one material selected from the group consisting of an epoxy-based resin, an organic filler, an inorganic filler and a curing agent.
8. The adhesive film for semiconductor according to the claim 6, wherein the adhesive layer further includes at least one modifier selected from the group consisting of a amino-based compound, a silane-based compound, an acrylic compound, metal organic salt, silicon oxide and titanium oxide.
9. The adhesive film for semiconductor according to the claim 7, wherein the adhesive layer further includes at least one modifier selected from the group consisting of a amino-based compound, a silane-based compound, an acrylic compound, metal organic salt, silicon oxide and titanium oxide.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A cover for an electrical receptacle comprising:
a faceplate;
a first transmission tab configured to be electrically connected to a first power line of the electrical receptacle;
a second transmission tab configured to be electrically connected to a second power line of the electrical receptacle; and
a device in communication with the first transmission tab and the second transmission tab;
wherein at least one of the first and the second transmission tabs is configured as an elongated, rigid or semi-flexible tab extending from a back side of the faceplate; and
wherein the at least one transmission tab comprises one or more conductive surface structures configured to face a conductive portion of the electrical receptacle.
2. The cover of claim 1, wherein the electrical receptacle is one of a power outlet or a switch receptacle.
3. The cover of claim 1, wherein the first transmission tab and the second transmission tab are removable from the faceplate.
4. The cover of claim 1, wherein the device is a light source.
5. The cover of claim 4, wherein the light source is a light emitting diode.
6. The cover of claim 1, further comprising a sensor in communication with the device.
7. The cover of claim 1, wherein the faceplate defines an connector aperture that exposes at least a portion of the electrical receptacle.
8. The cover of claim 1, wherein the device is a universal serial bus port.
9. A cover configured to be received around a portion of an electric receptacle, comprising:
a faceplate;
a set of transmission tabs extending, from a rear surface of the face plate;
a sensor in communication with the transmission tabs; and
a light source in communication with the sensor and the transmission tabs;
wherein at least one of the transmission tabs is configured as an elongated, rigid or semi-flexible tab extending from a back side of the faceplate; and
wherein the at least one transmission tab comprises one or more conductive surface structures configured to face a conductive portion of the electrical receptacle.
10. The cover of claim 9, wherein the sensor is a photodetector or a photosensor.
11. The cover of claim 9, wherein the light source is at least one light emitting diode.
12. A cover for an electrical receptacle comprising:
a faceplate;
a first transmission tab configured to be electrically connected to a first power line of the electrical receptacle;
a second transmission tab configured to be electrically connected to a second power line of the electrical receptacle; and
a device in communication with the first transmission tab and the second transmission tab;
wherein the faceplate is configured to be received between the electrical receptacle and a decorative receptacle plate.
13. The cover of claim 12, wherein at least one of the first and the second transmission tabs is configured as an elongated, rigid or semi-flexible tab extending from a back side of the faceplate.
14. The cover of claim 12, wherein the at least one transmission tab comprises one or more conductive surface structures configured to face a conductive portion of the electrical receptacle.
15. The cover of claim 12, wherein the device is a light source.
16. The cover of claim 15, wherein the light source is a light emitting diode.
17. The cover of claim 12, further comprising a sensor in communication with the device.
18. The cover of claim 12, wherein the faceplate defines an connector aperture that exposes at least a portion of the electrical receptacle.
19. The cover of claim 12, wherein the device is a universal serial bus port.
20. The cover of claim 12, wherein at least one of the transmission tabs is removable from the faceplate.