1. A structure including a semiconductor material comprising:
a target portion and a second portion different from the target portion, the target portion having a first feature when at least one of the following occurs: an external force is received by the second portion of the structure and an internal condition occurs in the target portion; and
an interferogram located to produce a first optical interference pattern when the target portion and the interferogram are exposed to non-invasive illumination and when the target portion has the first feature.
2. The structure of claim 1 wherein the interferogram is located to produce a second optical interference pattern when the target portion and the interferogram are exposed to non-invasive illumination without the first feature occurring, the first optical interference pattern having a first magnitude and the second optical interference pattern having a second magnitude smaller than the first magnitude.
3. The structure of claim 1 wherein the interferogram is shaped and located to produce the first optical interference pattern as one of the following: one dimensional, two dimensional, and three dimensional.
4. The structure of claim 1 wherein the interferogram is shaped according to an Fast Fourier Transform of the first feature of the target portion.
5. The structure of claim 1 wherein the interferogram is shaped and located to receive the non-invasive illumination as one of the following: a laser beam, a coherent infrared transmission, a uniform transmission.
6. The structure of claim 1 wherein the interferogram is shaped and located to receive the non-invasive illumination as a coherent ultraviolet light and wherein the interferogram and target portion comprise a free metal.
7. The structure of claim 1 wherein the second portion is the target portion.
8. The structure of claim 1 wherein the interferogram is shaped and located to receive the non-invasive illumination as one of the following: transmitted illumination and reflected illumination.
9. The structure of claim 1 wherein the target portion and the second portion are configured such that the external force initiates the internal condition.
10. The structure of claim 9 wherein the target portion and the second portion are configured such that the second portion receives the external force as at least one of the following:
a radio wave, an electromagnetic field, an electromagnetic signal, a magnetic field, an x-ray radiation, a gravity wave, a sub-atomic particle radiation, a pressure, a temperature, a photo-generated carrier, an incident electron, an incident ion-beam, a bioelectric field, a chemical substance, an ultraviolet light, and a substance placed adjacent to surface.
11. The structure of claim 9 wherein the target portion and the second portion are configured such that the internal condition occurs in the target portion as at least one of the following:
a voltage pattern, a photo-current pattern, an pattern of change in electrical resistance, a signal transmitted through a circuit, a temporal voltage wave form, an analog operation of a circuit, a digital operation of a circuit, a digital word, a digital matrix, an analog waveform, and a symbolic character.
12. The structure of claim 1 wherein the target portion includes at least one of the following: a metalized layer and a semiconductor layer.
13. The structure of claim 1 wherein the second portion is configured such that the second portion receives the external force as at least one of the following:
a radio wave, an electromagnetic field, an electromagnetic signal, a magnetic field, an x-ray radiation, a gravity wave, a sub-atomic particle radiation, a pressure, a temperature, a photo-generated carrier, an incident electron, an incident ion-beam, a bioelectric field, a chemical substance, an ultraviolet light, and a substance placed adjacent to surface.
14. The structure of claim 1 wherein the target portion is configured such that the internal condition occurs in the target portion as at least one of the following:
a voltage pattern, a photo-current pattern, an pattern of change in electrical resistance, a signal transmitted through a circuit, a temporal voltage wave form, an analog operation of a circuit, a digital operation of a circuit, a digital word, a digital matrix, an analog waveform, and a symbolic character.
15. The structure of claim 1 wherein the target portion is configured such that the first feature is at least one of the following: a refractive index, a polarization, a birefringence, an amplitude, and a phase.
16. The structure of claim 1 wherein the interferogram is shaped to generate wavefronts of a desired amplitude and phase distribution for the first optical interference pattern.
17. The structure of claim 1 wherein the target portion includes an optical surface.
18. The structure of claim 1 wherein the interferogram is shaped so that the first optical interference pattern is based upon optical spatial-filtering of the first feature.
19. The structure of claim 1 wherein the structure includes a substrate portion having voltage waveforms, the semiconductor material being mounted on the substrate portion, and wherein the first optical interference pattern is based upon pattern recognition of the first feature and the voltage waveforms in the substrate portion of the structure.
20. The structure of claim 1 wherein the interferogram is shaped and positioned such that the first optical interference pattern is at least one of the following: constructive, destructive, in phase, and out of phase.
21. The structure of claim 1 wherein the interferogram is shaped by at least one of the following: by direct recording of a sample image and by computer generation of the grating pattern.
22. The structure of claim 1 further comprising a holographic lens element positioned to receive the first optical interference pattern.
23. The structure of claim 1 wherein the target portion includes at least one of the following:
a surface of the structure, a printed image, wherein the structure further includes circuitry and the target portion is integrated with the circuitry, a portion of the structure that is on a backside of the structure, a portion of the structure that is adjacent a metalized layer, a portion of the structure that is incorporated into a metalized layer, a portion of the structure that is on a frontside of the structure, wherein the structure further has a circuitry layer and the target portion further includes a portion of the structure that is adjacent the circuitry layer, wherein the structure further has a circuitry layer and the target portion is at least partially incorporated into the circuitry layer.
24. A structure including a semiconductor material, the structure having a thickness, the structure comprising:
a target portion and a second portion, the target portion having a first feature when at least one of the following occurs:
an external force is received by the second portion of the structure and an internal condition occurs in the target portion;
a first interferogram; and
a second interferogram spaced apart through the thickness of the structure from the first grating, the first interferogram and the second interferogram shaped and located to produce a first optical interference pattern when the target portion and the interferograms are exposed to non-invasive illumination and when the target portion has the first feature.
25. A system comprising:
a structure including a semiconductor material, the structure including a target portion and a second portion, the target portion having a first feature when at least one of the following occurs:
an external force is received by the second portion of the structure and an internal condition occurs in the target portion; and
an interferogram positioned apart from the structure, the interferogram shaped and located to produce a first optical interference pattern when the target portion and the interferogram are exposed to non-invasive illumination and when the target portion has the first feature.
26. A system comprising:
a structure including a semiconductor material, the structure including a target portion, a second portion, and a first interferogram, the target portion having a first feature when at least one of the following occurs:
an external force is received by the second portion of the structure and an internal condition occurs in the target portion; and
a second interferogram positioned apart from the structure, the first interferogram and the second interferogram shaped and located to produce a first optical interference pattern when the target portion and the interferograms are exposed to non-invasive illumination and when the target portion has the first feature.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
We claim:
1. A device for adjusting a register element in a printing machine, comprising:
a guide;
an upper clamping rail and a register element fixed to said upper clamping rail, wherein said upper clamping rail is movably disposed in said guide and fixable in position for adjusting said register element; and
a clamping element co-operating with said upper clamping rail.
2. The device according to claim 1, wherein said guide is a sliding guide, and the position of said upper clamping rail is adjustable with an adjusting device in a sliding direction corresponding to an adjustment direction of said register element.
3. The device according to claim 1, which comprises an adjusting device including at least one mechanical adjusting element for generating an adjusting force acting on said upper clamping rail.
4. The device according to claim 1, which comprises an adjusting device having at least one electrical adjusting element for generating an adjusting force acting on said upper clamping rail.
5. The device according to claim 1, which comprises clamping means for fixing the position of said upper clamping rail.
6. The device according to claim 1, which comprises tensioning means for fixing the position of said upper clamping rail.
7. The device according to claim 1, which comprises a central control unit operatively connected to said upper clamping rail.
8. The device according to claim 1, wherein said upper clamping rail is formed of a plurality of part segments movable disposed relative to one another and each containing at least one register element.
9. A method of adjusting at least one register element in a printing machine, which comprises providing an upper clamping rail having fixed thereto the register element, and moving the upper clamping rail in a guide and fixing the clamping rail in position in order to adjust the register element.
10. The method according to claim 9, which comprises adjusting a position of the upper clamping rail in a sliding guide by way of an adjusting device in an adjustment direction of the register element.
11. The method according to claim 9, which comprises mechanically generating an adjusting force acting on the upper clamping rail.
12. The method according to claim 9, which comprises electrically generating an adjusting force acting on the upper clamping rail.
13. The method according to claim 9, which comprises fixing the upper clamping rail in position at a point and, at defined adjustment regions, wherein the register element is guided in an adjustment direction, elastically deforming and firmly clamping the upper clamping rail in a stable position.
14. The method according to claim 9, which comprises moving and positionally fixing the upper clamping rail in the guide in an automated manner.
15. The method according to claim 9, which comprises providing the upper clamping rail as a plurality of part segments each having at least one register element, and moving and fixing in position the part segments independently of one another.