What is claimed is:
1. An image sensor to be electrically connected to a printed circuit board, the image sensor comprising:
a plurality of metal sheets arranged in a matrix, each of the metal sheets having a first board and a second board, the second boards being electrically connected to the printed circuit board;
an insulation layer adhered to the first boards of the metal sheets to fix the first boards;
a glue layer for encapsulating the metal sheets with the first boards and second boards exposed from the glue layer, the glue layer being formed with a projection edge;
a photosensitive chip arranged on the first boards;
a plurality of wires for electrically connecting the photosensitive chip to the first boards; and
a transparent layer placed on the projection edge of the glue layer to cover the photosensitive chip.
2. The image sensor according to claim 1, wherein each of the metal sheets further has a third board, and the third boards connect the first boards to the second boards, respectively.
3. The image sensor according to claim 1, wherein the insulation layer is a double-faced tape, and the photosensitive chip is adhered to the double-faced tape.
4. The image sensor according to claim 1, wherein the glue layer is made of a plastic material by way of injection molding to encapsulate the plurality of metal sheets.
5. The image sensor according to claim 1, wherein the transparent layer is a piece of transparent glass.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A manufacturing method for a display device comprising:
a step for providing a source line around a pixel electrode provided on a substrate;
a step for forming an insulating film pattern having openings for a source and a drain;
a step for forming the source and the drain; and
a step for providing a semiconductor film on the source and the drain; and a step for providing a gate on the semiconductor film;
wherein the respective steps are implemented substantially under atmospheric pressure.
2. The manufacturing method according to claim 1, further comprising a step for electrolytically plating the source line.
3. The manufacturing method according to claim 1, further comprising a step for providing a film for protecting the gate and a step for applying electrophoretic ink after the film is provided.
4. The manufacturing method according to claim 3, wherein the film is provided by laminating in the step for providing the film for protecting the gate.
5. The manufacturing method according to claim 1, the semiconductor film being formed over the source and the drain.
6. A manufacturing method for a display device, the method comprising:
forming a source line on a substrate;
forming a source and a drain of a transistor on the substrate;
forming a semiconductor film contacting the source and the drain; and
providing a gate of the transistor;
wherein the source line, the source, the drain, the semiconductor film, and the gate are implemented substantially under atmospheric pressure.
7. The manufacturing method according to claim 6, the forming of source line is implemented by electrolytic plating.
8. The manufacturing method according to claim 6, further comprising:
forming a film covering the gate; and
applying an electrophoretic ink to the film.
9. The manufacturing method according to claim 8, the forming of the film is implemented by lamination coating.
10. The manufacturing method according to claim 6, the substrate is a resin film with the pixel electrode.