1-17. (canceled)
18. A method for manufacturing a monolithic ink-jet printhead, comprising:
(a) preparing a substrate;
(b) stacking a plurality of passivation layers on the substrate and forming a heater and a conductor connected to the heater between adjacent passivation layers of the plurality of passiviation layers;
(c) forming a connection hole to penetrate the plurality of passivation layers;
(d) forming a metal layer on the plurality of passivation layers and forming an upper ink chamber in communication with the connection hole on a bottom surface of the metal layer so as to be disposed above the heater, and forming a nozzle on an upper surface of the metal layer in communication with the upper ink chamber;
(e) forming a lower ink chamber in the substrate, the lower ink chamber being in communication with the connection hole and disposed under the heater;
(f) forming a manifold for supplying ink in a bottom surface of the substrate; and
(g) forming an ink channel between the manifold and the lower ink chamber.
19. The method as claimed in claim 18, wherein the substrate is made of a silicon wafer.
20. The method as claimed in claim 18, wherein forming the heater and the conductor connected to the heater while sequentially stacking the plurality of passivation layers on the substrate comprises:
forming a first passivation layer on an upper surface of the substrate;
forming the heater by depositing a resistive heating material on an entire surface of the first passivation layer and patterning the same;
forming a second passivation layer on the first passivation layer and the heater;
forming a contact hole exposing a portion of the heater by partially etching the second passivation layer;
forming the conductor connected to the heater through the contact hole by depositing a metal having electrical conductivity on the second passivation layer and patterning the same; and
forming a third passivation layer on the second passivation layer and the conductor.
21. The method as claimed in claim 18, wherein the connection hole is formed by anisotropically dry-etching the plurality of passivation layers using reactive ion etching.
22. The method as claimed in claim 18, wherein forming the metal layer on the plurality of passivation layers and forming the upper ink chamber in communication with the connection hole on the bottom surface of the metal layer so as to be disposed above the heater, and forming the nozzle on the upper surface of the metal layer in communication with the upper ink chamber comprises:
forming a seed layer for electroplating on the passivation layers;
forming a sacrificial layer for forming the upper ink chamber and the nozzle on the seed layer;
forming the metal layer on the seed layer by electroplating; and
forming the upper ink chamber and the nozzle by removing the sacrificial layer and the seed layer formed under the sacrificial layer.
23. The method as claimed in claim 22, wherein the seed layer is formed by depositing at least one of copper, chromium, titanium, gold and nickel on the passivation layers.
24. The method as claimed in claim 22, wherein forming the sacrificial layer comprises:
coating photoresist on the seed layer to a predetermined thickness;
forming the sacrificial layer shaped of the nozzle by initially patterning an upper portion of the photoresist; and
forming the sacrificial layer shaped of the upper ink chamber under the nozzle-shaped sacrificial layer by subsequently patterning a lower portion of the photoresist.
25. The method as claimed in claim 22, wherein the initial patterning is performed on the nozzle-shaped sacrificial layer by a proximity exposure process for exposing the photoresist PR using a photomask which is separated from an upper surface of the photoresist by a predetermined distance, in a tapered shape in which a cross-sectional area of the sacrificial layer increases gradually downward.
26. The method as claimed in claim 25, wherein an inclination of the nozzle-shaped sacrificial layer is adjusted by varying a distance between the photomask and the photoresist and an exposure energy.
27. The method as claimed in claim 22, wherein the metal layer is made of a material selected from the group consisting of nickel, copper and gold.
28. The method as claimed in claim 22, further comprising:
planarizing an upper surface of the metal layer by chemical mechanical polishing, after forming the metal layer.
29. The method as claimed in claim 18, wherein forming the lower ink chamber comprises isotropically dry-etching the substrate exposed through the connection hole.
30. The method as claimed in claim 18, wherein forming the ink channel comprises anisotropically dry-etching the substrate from a bottom surface of the substrate having the manifold.
31. The method as claimed in claim 18, wherein the connection hole comprises a single connection hole formed at a location corresponding to a center of the upper ink chamber.
32. The method as claimed in claim 31, wherein the heater surrounds the connection hole.
33. The method as claimed in claim 31, wherein forming the ink channel comprises anisotropically dry-etching an upper surface of the substrate on a bottom of the lower ink chamber through the connection hole.
34. The method as claimed in claim 18, wherein the connection hole comprises a plurality of connection holes formed adjacent an edge of the ink chamber.
35. The method as claimed in claim 34, wherein the heater has a rectangular shape.
36. The method as claimed in claim 34, wherein the plurality of connection holes are formed around the heater and spaced apart a predetermined distance from the heater.
37. The method as claimed in claim 34, wherein the heater is patterned to define a plurality of apertures, each of the plurality of apertures exposes one of the plurality of connection holes formed within or across the boundary of the heater.
38. The printhead as claimed in claim 37, wherein each of the plurality of apertures is either a hole surrounding an entire one of the plurality of connection holes or a groove surrounding a portion of one of the plurality of connection holes.
39. The method as claimed in claim 34, wherein forming the lower ink chamber comprises providing communication between a plurality of hemispherical cavities in a circumferential direction below the plurality of connection holes.
40. The method as claimed in claim 39, wherein the ink channel comprises a single ink channel formed at a central portion of the ink chamber and the plurality of hemispherical cavities are in communication in a radial direction due to the ink channel.
41. The method as claimed in claim 39, wherein the ink channel is formed at a central portion of a bottom of each of the plurality of hemispherical cavities.
42. A method for manufacturing a monolithic ink-jet printhead, comrprising:
forming an ink chamber including a lower ink chamber and an upper ink chamber, the lower ink chamber and the upper ink chamber being in communication with each other;
forming a nozzle in communication with the upper ink chamber;
forming an ink channel in communication with the lower ink chamber; and
forming a heater within the ink chamber.
43. The method as claimed in claim 42, wherein forming the heater comprises forming the heater between the upper and lower ink chambers.
44. The method as claimed in claim 42, further comprising forming a nozzle plate on a substrate, the upper ink chamber being on the nozzle plate, the lower ink chamber being on the nozzle plate, and the nozzle being on a top surface of the nozzle plate.
45. The method as claimed in claim 44, further comprising providing a plurality of passivation layers between the substrate and the nozzle plate.
46. The method as claimed in claim 45, wherein forming the heater comprises forming the heater between adjacent passivation layers of the plurality of passivation layers.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A computer housing shock absorber device for a vibration source frame, comprising:
a computer housing provided with a U-shaped holding space;
an inner fixing frame transversally fixed within the U-shaped holding space, and at least more than one connecting hole is defined in a horizontal upper surface of the inner fixing frame;
an outer fixing frame, on outer sides of which are fixedly clamped at least more than one heat dissipating fan, a top portion of the outer fixing frame is configured with a horizontal upper surface, and connecting posts are evenly disposed on a bottom surface of the horizontal upper surface;
at least more than one shock absorber element formed as cylindrical bodies, in the center of each of which is defined a through hole, and a recessed circular groove is defined in the circumference of each of the shock absorber elements; the recessed circular grooves are respectively mounted on circumferential edge walls of the connecting holes of the inner fixing frame, and the connecting posts respectively penetrate the through holes; upper and lower portions of each of the recessed circular grooves of the shock absorber elements are respectively provided with a cylindrical body, and one of the cylindrical bodies of each of the shock absorber elements lies between the upper surface of the outer fixing frame and the upper surface of the inner fixing frame, whereby the vibratory moment on the outer fixing frame produced by rotation of the fans is absorbed by the shock absorber elements.
2. The computer housing shock absorber device for a vibration source frame according to claim 1, wherein connecting posts protrude from a housing bottom surface of the U-shaped holding space;
at least more than one lower connecting hole is defined in a horizontal lower surface of the outer fixing frame;
the recessed circular grooves of the shock absorber elements are respectively mounted on the circumferential edges of the lower connecting holes, and the connecting posts respectively penetrate the through holes of the shock absorber elements; one of the cylindrical bodies of each of the shock absorber elements lies between the lower surface of the outer fixing frame and the housing bottom surface of the U-shaped holding space, whereby the vibratory moment on the outer fixing frame produced by rotation of the fans is absorbed by the shock absorber elements.
3. The computer housing shock absorber device for a vibration source frame according to claim 1, wherein the shock absorber elements are made from rubber material, and provided with flexibility and shock absorbing characteristics.
4. The computer housing shock absorber device for a vibration source frame according to claim 1, wherein connecting holes are respectively defined in left and right sides of the inner fixing frame, and fixing elements are screwed into left and right side housing wall surfaces of the U-shaped holding space and the connecting holes, thereby fixing the inner fixing frame within the U-shaped holding space.
5. The computer housing shock absorber device for a vibration source frame according to claim 1, wherein protruding connecting tubes are configured on vertical plates of the outer fixing frame, and a screw hole is defined in a tube opening of each of the connecting tubes; connecting holes are defined in vertical plates of the inner fixing frame; the recessed circular grooves of the shock absorber elements are mounted in the connecting holes; bolts respectively penetrate the through holes of the shock absorber elements and further screw into the screw holes of the connecting tubes, thereby enabling the cylindrical bodies of the shock absorber elements to lie between the edges of the screw holes and the vertical plates.
6. The computer housing shock absorber device for a vibration source frame according to claim 1, wherein a plurality of air vents are defined in mutually adjacent sides of the vertical plates of the outer fixing frame and the vertical plates of the inner fixing frame respectively; the two sets of air vents mutually correspond, and the heat dissipating fans correspond to the two sets of air vents.
7. The computer housing shock absorber device for a vibration source frame according to claim 1, wherein
connecting holes are defined in a horizontal lower surface of the inner fixing frame;
rivets protrude from the housing bottom surface of the U-shaped holding space and are fixedly riveted into the connecting holes.