1. A compound of the general formula (1)
where
R1 is H, Cl or CH3,
R2 is H or Cl,
M2+ is Mg2+Mn2+ or Sr2+,
Y1=COO\u2212 or SO3\u2212, and
Y2=SO3\u2212, Y3=Y4=Y5=H; or Y3=SO3\u2212, Y2=Y4=Y5=H; or
Y4=SO3\u2212, Y2=Y3=Y5=H; or Y5=SO3\u2212, Y2=Y3=Y4=H.
2. A compound as claimed in claim 1, wherein
R1=Cl, R2=H, M2+=Sr2+, Y1=COO\u2212 and Y2=Y3=Y5=H, Y4=SO3\u2212.
3. A compound as claimed in claim 1, wherein R1=Cl, R2=H, M2+=Mn2+, Y1=COO\u2212 and Y2=Y3=Y4=H, Y5=SO331 .
4. A compound as claimed in claim 1, wherein
R1=H, R2=H, M2+=Sr2+, Y1=COO\u2212 and Y3=Y4=Y5=H, Y2=SO3\u2212.
5. A compound as claimed in claim 1, wherein R1=CH3, R2=Cl, M2+=Mg2+, Y1=SO3\u2212 and Y2=Y4=Y5=H, Y3=SO3\u2212.
6. A process for preparing a compound as claimed in claim 1, comprising the steps of diazotizing an amine o the general formula (2), coupling the resultant diazonium salt with a naphtholsulfonic acid of the general formula (3) and laking the resultant monoazo compound with a magnesium, strontium or manganese salt.
7. A pigmented composition comprising a compound as claimed in claim 1, wherein the composition is selected from the group consisting of macromolecular organic materials, varnishes, paints, printing inks, electrophotographic toners, electrophotographic developers, powders, powder coatings and inks.
8. A colored seed comprising a compound as claimed in claim 1.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1-12. (canceled)
13. An optical module, comprising:
a circuit carrier;
a semiconductor element disposed on said circuit carrier, said semiconductor element having an optically sensitive surface; and
a lens unit for projecting electromagnetic radiation onto said semiconductor element;
said lens unit being supported directly on said sensitive surface of said semiconductor element.
14. The optical module according to claim 13, wherein said lens unit includes a lens holder supported on said sensitive surface of said semiconductor element.
15. The optical module according to claim 13, which further comprises a frame-shaped area formed on said lens holder, wherein said semiconductor element rests on said frame-shaped area with said optically sensitive surface.
16. The optical module according to claim 13, which further comprises a frame-type support formed on said lens holder, wherein said semiconductor element rests on said support with said optically sensitive surface.
17. The optical module according to claim 13, wherein said lens unit includes a support lens disposed on said sensitive surface of said semiconductor element.
18. The optical module according to claim 17, wherein said support lens is formed with a flat surface resting on said sensitive surface of said semiconductor element.
19. The optical module according to claim 18, which comprises an amount of optical gel between the flat surface of said support lens and said sensitive surface of said semiconductor element.
20. The optical module according to claim 17, which further comprises a frame-type support formed on said support lens at least in sections thereof, and wherein said sensitive area of said semiconductor element rests on said support.
21. The optical module according to claim 13, wherein:
said lens unit is disposed on one side of said circuit carrier and said semiconductor element is disposed on an opposite side thereof; and
said circuit carrier is formed with an opening allowing electromagnetic radiation to be projected by a lens assembly of said lens unit onto said semiconductor element.
22. The optical module according to claim 20, wherein said frame-type support of said support lens is:
at least as large as said sensitive surface of said semiconductor element; and
slightly smaller than an opening formed in said circuit carrier through which electromagnetic radiation is projected onto said semiconductor element.
23. The optical module according to claim 15, wherein said frame-shaped area of said lens holder is:
at least as large as said sensitive surface of said semiconductor element; and
slightly smaller than an opening formed in said circuit carrier through which electromagnetic radiation is projected onto said semiconductor element.
24. The optical module according to claim 16, wherein:
said semiconductor element is flip-chip mounted on said circuit carrier;
said lens holder or a support lens is formed with a closed frame formed to function as a flow barrier against an underfill material introduced between said semiconductor element and said circuit carrier during a mounting operation of said semiconductor element on said circuit carrier.
25. The optical module according to claim 16, wherein said lens unit or a lens holder are connected to said circuit carrier away from an opening formed in said circuit carrier.
26. The optical module according to claim 25, wherein said lens unit or said lens holder are connected to said circuit carrier by gluing, laser-welding, andor screwing.
27. An optical system, comprising an optical module according to claim 13.