1. An apparatus comprising:
a medium having an information track;
an optical pickup, which is stationary relative to the medium;
an objective lens in said optical pickup, which is arranged to direct a beam to the information track;
first and second lens driver coils, which are configured to move said objective lens in first and second degrees of freedom;
a plurality of optical sensors in said optical pickup unit and arranged to receive a reflection of said beam from said medium, each optical sensor having one or more outputs; and
a signal manipulator, which receives the outputs from said plurality of optical sensors and combines the outputs to produce combined outputs that together simulate a rotation of said optical pickup unit relative to said medium.
2. The apparatus of claim 1 wherein said optical pickup unit comprises:
a light source;
and a surface;
wherein the beam is directed from said light source, through said objective lens, onto the information track of the medium, and said surface which directs the reflection of said beam to said plurality of optical sensors.
3. The apparatus of claim 1 wherein said medium is an optically recordable medium.
4. The apparatus of claim 1 wherein said medium is a three dimensional medium.
5. The apparatus of claim 4 wherein said three dimensional medium is a holographic medium.
6. An apparatus comprising:
an optical pickup unit having an array of photodetectors, wherein the optical pickup unit is arranged to direct a beam to an information track on a medium and the array of photodetectors is arranged to receive a reflection of said beam from said medium;
a photodetector signal manipulator;
a tracking servo; and
an angular position driver, wherein one or more outputs of said array is altered by said photodetector signal manipulator, said tracking servo, and said angular position driver to produce at least a first and a second drive signal that provide input to said optical pickup unit and simulate a rotation of said optical pickup unit, wherein the alteration of said outputs of said array of photodetectors further comprises the photodetectors signal manipulator receiving a first, a second, a third, and a fourth output, sending the first and fourth outputs through a first modification path and sending the second and third outputs through a second modification path.
7. The apparatus of claim 6 wherein said first modification path further comprises:
a first positive amplifier configured to receive said first output;
a first negative amplifier configured to receive said fourth output;
a first summing circuit configured to sum said first and fourth outputs; and
a first additional amplifier to receive an output of said first summing circuit and to output a first modified output signal.
8. The apparatus of claim 7 wherein said second modification path further comprises:
a second positive amplifier configured to receive said second output; a second negative amplifier configured to receive said third output;
a second summing circuit configured to sum said second and third outputs; and
a second additional amplifier to receive an output of said second summing circuit and to output a second modified output signal.
9. The apparatus of claim 8 wherein the alteration of said outputs of said array of photodetectors further comprises said tracking servo receiving said first and second modified output signals and performing a phase gain compensation process on said first and second modified output signals.
10. The apparatus of claim 9 wherein the alteration of said outputs of said array of photodetectors further comprises said angular position driver producing a POSsine and a POScosine signal wherein said first modified output signal is combined with said POSsine signal in a third amplifier to produce said first drive signal and said second modified output signal is combined with said POScosine signal in a fourth amplifier to produce said second drive signal.
11. The apparatus of claim 10 wherein said POSsine and said POScosine signals are generated by a radial ramp.
12. The apparatus of claim 10 wherein said POSsine and said POScosine signals are generated by an oscillator.
13. The apparatus of claim 11 wherein said optical pickup unit comprises an objective lens having a first, a second, and a third degree of freedom wherein said first and second degrees of freedom are controlled by first and second lens driver coils.
14. The apparatus of claim 13 wherein said first drive signal provides input to said first lens driver coil and said second drive signal provides input to said second lens driver coil.
15. The apparatus of claim 6 wherein said medium is an optically recordable medium.
16. The apparatus of claim 6 wherein said medium is a three dimensional medium.
17. The apparatus of claim 16 wherein said three dimensional medium is a holographic medium.
18. A method for recording and playback tracking control comprising:
generating a beam from a light source in an optical pickup unit, which is stationary relative to a medium comprising an information track;
passing said beam through an objective lens of the optical pickup unit, wherein the objective lens has a first, a second, and a third degree of freedom and directs said beam to a point on the information track of the medium;
sensing a reflection of said beam with a plurality of optical sensors in said optical pickup unit, each having one or more outputs; and
manipulating said outputs to simulate a rotation of said optical pickup unit relative to said medium.
19. The method of claim 18 wherein said sensing further comprises:
redirecting the reflection of said beam with a redirecting surface toward said plurality of optical sensors.
20. The method of claim 18 wherein said medium is an optically recordable medium.
21. The method of claim 18 wherein said medium is a three dimensional medium.
22. The method of claim 21 wherein said three dimensional medium is a holographic medium.
23. A method comprising:
directing a beam through an objective lens of an optical pickup unit to an information track on a medium, wherein the optical pickup unit is stationary relative to the medium and the objective lens is movable in first and second degrees of freedom;
receiving a reflection of said beam with an array of photodetectors in said optical pickup unit; altering one or more outputs of said array of photodetectors with a photodetector signal manipulator;
altering one or more outputs of said array of photodetectors with a tracking servo;
altering one or more outputs of said array of photodetectors with an angular position driver; and
producing at least a first and a second drive signal that provide input to said optical pickup unit and simulate a rotation of said optical pickup unit relative to said medium.
24. The method of claim 23 wherein said altering said outputs of said array of photodetectors further comprises:
receiving a first, a second, a third, and a fourth output in said photodetector signal manipulator;
sending said first and fourth outputs through a first modification path; and
sending said second and said third outputs are sent through a second modification path.
25. The method of claim 24 wherein said sending said first and fourth outputs through a first modification path further comprises:
receiving said first output with a first positive amplifier;
receiving said fourth output with a first negative amplifier;
summing said first and fourth outputs with a first summing circuit;
receiving an output of said first summing circuit with a first additional amplifier; and
outputting a first modified output signal with said first additional amplifier.
26. The method of claim 25 wherein said sending said second and third outputs through a second modification path further comprises:
receiving said second output with a second positive amplifier;
receiving said third output with a second negative amplifier;
summing said second and third outputs with a second summing circuit; receiving an output of said second summing circuit with a second additional amplifier; and
outputting a second modified output signal with said second additional amplifier.
27. The method of claim 26 wherein said altering one or more outputs of said array of photodetectors with a tracking servo further comprises:
receiving said first and second modified output signals with said tracking servo; and
performing a phase gain compensation process on said first and second modified output signals.
28. The method of claim 27 wherein said altering one or more outputs of said array of photodetectors with an angular position driver further comprises:
producing a POSsine and a POScosine signal with said angular position driver;
combining said first modified output signal with said POSsine signal in a third amplifier to produce said first drive signal; and
combining said second modified output signal with said POScosine signal in a fourth amplifier to produce said second drive signal.
29. The method of claim 28 wherein said POSsine and said POScosine signals are generated by a radial ramp.
30. The method of claim 28 wherein said POSsine and said POScosine signals are generated by an oscillator.
31. The method of claim 29 wherein said optical pickup unit comprises an objective lens having a first, a second, and a third degree of freedom, further comprising controlling said first and second degrees of freedom with first and second lens driver coils.
32. The method of claim 31, further comprising: providing input to said first lens driver coil with said first drive signal; and providing input to said second lens driver coil with said second drive signal.
33. The method of claim 23 wherein said medium is an optically recordable medium.
34. The method of claim 23 wherein said medium is a three dimensional medium.
35. The method of claim 34 wherein said three dimensional medium is a holographic medium.
36. A system comprising:
means for generating a beam from a light source in an optical pickup unit, which is stationary relative to a medium comprising an information track;
means in the optical pickup for directing the beam to a point on the information track of the medium, the means for directing having a first, a second, and third degree of freedom;
means for sensing a reflection of said beam with a plurality of optical sensors in said optical pickup unit, each having one or more outputs; and
means for manipulating said outputs to simulate a rotation of said optical pickup unit relative to said medium.
37. The system of claim 36 wherein:
said means for directing further comprises an objective lens having the first, second, and third degrees of freedom; and
said means for sensing comprises means for redirecting the reflection of said beam with a redirecting surface toward said plurality of optical sensors.
38. The system of claim 36 wherein said medium is an optically recordable medium.
39. The system of claim 36 wherein said medium is a three dimensional medium.
40. The system of claim 39 wherein said three dimensional medium is a holographic medium.
41. A system comprising:
means for directing a beam through an objective lens of an optical pickup unit to an information track on a medium, wherein the optical pickup unit is stationary relative to the medium and the objective lens is movable in first and second degrees of freedom;
means for receiving a reflection of said beam with an array of photodetectors in said optical pickup unit;
means for altering one or more outputs of said array of photodetectors with a photodetector signal manipulator;
means for altering one or more outputs of said array of photodetectors with a tracking servo;
means for altering one or more outputs of said array of photodetectors with an angular position driver; and
means for producing at least a first and a second drive signal that provide input to said optical pickup unit and simulate a rotation of said optical pickup unit relative to said medium.
42. The system of claim 41 wherein said means for altering said one or more outputs of said array of photodetectors further comprises:
means for receiving a first, a second, a third, and a fourth output in said photodetector signal manipulator;
means for sending said first and fourth outputs through a first modification path; and
means for sending said second and said third outputs are sent through a second modification path.
43. The system of claim 42 wherein said means for sending said first and fourth outputs through a first modification path further comprises:
means for receiving said first output with a first positive amplifier; means for receiving said fourth output with a first negative amplifier;
means for summing said first and fourth outputs with a first summing circuit;
means for receiving an output of said first summing circuit with a first additional amplifier; and
means for outputting a first modified output signal with said first additional amplifier.
44. The system of claim 43 wherein said means for sending said second and third outputs through a second modification path further comprises:
means for receiving said second output with a second positive amplifier;
means for receiving said third output with a second negative amplifier;
means for summing said second and third outputs with a second summing circuit;
means for receiving an output of said second summing circuit with a second additional amplifier; and
means for outputting a second modified output signal with said second additional amplifier.
45. The system of claim 44 wherein said means for altering one or more outputs of said array of photodetectors with a tracking servo further comprises:
means for receiving said first and second modified output signals with said tracking servo; and
means for performing a phase gain compensation process on said first and second modified output signals.
46. The system of claim 45 wherein said means for altering one or more outputs of said array of photodetectors with an angular position driver further comprises:
means for producing a POSsine and a POScosine signal with said angular position driver;
means for combining said first modified output signal with said POSsine signal in a third amplifier to produce said first drive signal; and
means for combining said second modified output signal with said POScosine signal in a fourth amplifier to produce said second drive signal.
47. The system of claim 46 wherein said POSsine and said POScosine signals are generated by a radial ramp.
48. The system of claim 46 wherein said POSsine and said POScosine signals are generated by an oscillator.
49. The system of claim 47 wherein said optical pickup unit comprises an objective lens having a first, a second, and a third degree of freedom, further comprising means for controlling said first and second degrees of freedom with first and second lens driver coils.
50. The system of claim 49, further comprising: means for providing input to said first lens driver coil with said first drive signal; and means for providing input to said second lens driver coil with said second drive signal.
51. The system of claim 41 wherein said medium is an optically recordable medium.
52. The system of claim 51 wherein said medium is a three dimensional medium.
53. The system of claim 52 wherein said three dimensional medium is a holographic medium.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate, comprising:
a substrate formed of glass and having a plurality of holes formed at predetermined positions;
bumps so formed as to be connected to an electrically conductive material filling each of said holes; and
wirings formed on a surface opposite to a surface on which said bumps are formed, for electrically connecting a plurality of connection terminals arranged with intervals different from intervals of said holes to said conductive material;
wherein a shape of said conductive material is porous.
2. A wiring glass substrate according to claim 1, which includes second glass having a lower softening point than that of the substrate of said glass inside pores of said porous conductive material or on a surface of said conductive material.
3. A wiring glass substrate according to claim 1 or 2, which includes a second conductive material having a smaller number of pores than said conductive material on the surface of said porous conductive material.
4. A wiring glass substrate interposed between a semiconductor chip and a printed wiring substrate, for connecting said semiconductor chip to said printed wiring substrate, comprising:
a substrate formed of glass and having a plurality of holes formed at predetermined positions;
bumps so formed as to be connected to an electrically conductive material filling each of said holes; and
wirings formed on a surface opposite to a surface on which said bumps are formed, for electrically connecting a plurality of connection terminals arranged with intervals different from intervals of said holes to said conductive material;
wherein a linear, rod-like or fibrous conductive material is disposed inside said holes, and a porous conductive material is disposed around said conductive material.
5. A wiring glass substrate interposed between a semiconductor chip and a printed wiring substrate, for connecting said semiconductor chip to said printed wiring substrate, comprising:
a substrate formed of glass and having a plurality of holes formed at predetermined positions;
bumps so formed as to be connected to an electrically conductive material filling each of said holes; and
wirings formed on a surface opposite to a surface on which said bumps are formed, for electrically connecting a plurality of connection terminals arranged with intervals different from intervals of said holes to said conductive material;
wherein one or a plurality of conductive particles having diameters smaller than a diameter of said holes is disposed, and a porous conductive material is disposed around said conductive particles.
6. A wiring glass substrate according to claim 5, wherein a part of said conductive partials protrude and forms said bumps.
7. A wiring glass substrate interposed between a semiconductor chip and a printed wiring substrate, for connecting said semiconductor chip to said printed wiring substrate, comprising:
a substrate formed of glass and having a plurality of holes formed at predetermined positions;
bumps so formed as to be connected to an electrically conductive material filling each of said holes; and
wirings formed on a surface opposite to a surface on which said bumps are formed, for electrically connecting a plurality of connection terminals arranged with intervals different from intervals of said holes to said conductive material;
wherein a convex grid pin is disposed inside each of said holes, and a porous conductive material is disposed around said grid pin.
8. A wiring glass substrate according to claim 1, wherein said porous conductive material, said porous conductive particle, said linear conductive material, said rod-like conductive material, said fibrous conductive material or said grid pin forms a heat radiation route.
9. A wiring glass substrate according to claim 1, wherein a section of said through-hole has a large number of substantially round or crater-like concave-convexities, and a porous electrode and an oxide layer or a glass layer are arranged inside said hole.
10. A wiring glass substrate according to claim 1, wherein an oxide film is formed on an entire surface of said substrate, wirings are formed on said oxide film, and a section of said through-holes connecting two opposing wiring surfaces is constituted by an oxide film, a glass layer and a porous electrode.
11. A conductive paste used for a wiring glass substrate, wherein a conductive material of said conductive paste contains at least a conductor, crystallized glass, low melting point glass and a nucleus formation material or a filler inhibiting grain growth of said conductor.
12. A conductive paste according to claim 11, wherein a softening point of said low melting point glass is equal to, or lower than, a softening point of a glass material forming a substrate.
13. A conductive paste according to claim 11 or 12, wherein a coefficient of thermal expansion of said crystallized glass or said low melting point glass is within the range of a coefficient of thermal expansion of said conductive material and a glass material constituting said substrate.
14. A conductive paste according to claim 11, wherein said low melting point glass does not contain a lead element as a component.
15. A conductive paste according to claim 11, wherein said conductive paste is a sol-mixed conductive paste containing a sol as an oxide coating solution.
16. A wiring glass substrate according to claim 1, which includes second glass having a softening point lower than a softening point of said wiring glass substrate on inner wall surfaces of said holes.
17. A wiring glass substrate according to claim 16, wherein an oxide exists on a surface of said through-holes.
18. A wiring glass substrate according to claim 16 or 17, which includes an oxide on inner wall surfaces of said holes and second glass having a softening point lower than a softening point of said wiring glass substrate on a surface of said oxide.
19. A wiring glass substrate according to claim 17, wherein a Na compound exists on surfaces of said through-holes.
20. A wiring glass substrate according to claim 19, which contains Na and wherein an oxide exists on surfaces or cracks of said through-holes.
21. A wiring glass substrate according to claim 16, wherein sizes of two open portions of said through-holes are different and have a taper angle on inner walls of said through-holes.
22. A method of manufacturing a wiring glass substrate according to claim 16, comprising using a sand blast process for forming said through-holes.
23. A method of manufacturing a wiring glass substrate for mounting a semiconductor chip, comprising the steps of:
forming a plurality of through-holes in said wiring glass substrate by a sand blast process; and
chemically etching inner walls of said through-holes.
24. A method of manufacturing a wiring glass substrate according to claim 23, which includes the step of forming a conductor in said through-holes after said chemical etching step.
25. A method of manufacturing a wiring glass substrate, comprising the steps of:
boring holes penetrating through a glass substrate at predetermined positions of said glass substrate by machining;
coating an oxide on surfaces of two opposing wiring surfaces of said glass substrate and on surfaces of said penetrating holes;
forming a power feeding layer on the wiring surfaces of said glass substrate and on inner walls of said holes by electroless plating;
growing said power feeding layer by electroless plating or electrolytic plating to precipitate a conductor film; and
patterning said conductor film to electrically connect wirings formed on the two opposing surfaces of said glass substrate through said conductor formed inside said through-holes.
26. A method of manufacturing a wiring glass substrate, comprising the steps of:
boring holes penetrating through a glass substrate at predetermined positions of said glass substrate by machining;
coating an oxide on surfaces of two opposing wiring surfaces of said glass substrate and on surfaces of said penetrating holes;
filling a conductive paste into said through-holes;
baking said conductor at a temperature within a range of 500 to 600 C. less than a deformation temperature of said glass substrate to form electrodes;
forming a power feeding layer on the wiring surfaces of said glass substrate by electroless plating;
growing said power feeding layer by electroless plating or electrolytic plating to precipitate a conductor film; and
patterning said conductor film to electrically connect wirings formed on the two opposing surfaces of said glass substrate through said conductor formed inside said through-holes.
27. A method of manufacturing a wiring glass substrate according claim 1, which comprises using a glass substrate chemically etched.
28. A method of manufacturing a wiring glass substrate according to claim 1, which comprises conducting coating by use of a sol-gel method.
29. A semiconductor module having a wiring glass substrate according to claim 1, wherein said wiring glass substrate having a semiconductor chip mounted thereto is connected to a printed wiring substrate.
30. A semiconductor module having a wiring glass substrate according to claim 1, which comprises:
an active component;
a chip component;
a chip with built-in passive elements incorporating therein a first wiring glass substrate and passive elements mounted to said wiring glass substrate; and
a mounting substrate to which said active component, said chip component and said chip with built-in passive elements are mounted, and which incorporates said second wiring glass substrate.
31. A semiconductor module having a wiring glass substrate according to claim 1, which comprises:
an active component;
a chip component;
a chip with built-in passive elements incorporating therein said first wiring glass substrate and passive elements mounted to said wiring glass substrate; and
a substrate with built-in passive elements to which said active component, said chip component and said chip with built-in passive elements are mounted, and which incorporates therein said second wiring glass substrate and passive elements mounted to said second wiring glass substrate.
32. A wiring substrate using a conductor filled into a plurality of through-holes formed in said substrate as via-portions, wherein said conductor protrudes from at least one of the surfaces of said substrate and a projection portion expands more than a size of open portion of said via-portion.
33. A wiring substrate according to claim 32, wherein said projection portion is used as a via-electrode or a bump.
34. A method of forming a conductor, comprising the steps of:
putting a mask on upper surfaces of a plurality of through-holes in a substrate having said through-holes;
arranging a vacuum tank below said substrate;
sucking a conductor paste applied onto said mask by use of a pump in such a manner as to cause said conductive paste to protrude from at least one of the substrate surfaces; and
shaping a projection portion into a form expanded more than a size of a via open portion.
35. A method of forming a conductor according to claim 34, which further comprises the steps of:
arranging further a processing tank on a surface on the coating side of said conductive paste;
pushing said conductive paste by use of a compressor in such a manner as to cause said conductive paste to protrude from at least one of the substrate surfaces; and
shaping a projection portion into a form expanded more than a size of a via open potion.
36. A semiconductor module comprising a wiring substrate according to claim 32 or 33, a semiconductor chip and a printed wiring board connected to one another.