1. A computer-readable storage medium storing computer-executable instructions for causing a computer system programmed thereby to perform a method of generating a multi-chart geometry image, the method comprising:
partitioning a mesh into a plurality of charts with geometrically natural boundaries; and
packing the plurality of charts into a single geometry image as irregular polygons having arbitrary shapes based on the geometrically natural boundaries;
wherein the partitioning comprises iteratively:
growing the plurality of charts from seeds by assigning mesh faces on the mesh to one of the plurality of charts; and
updating the seeds for the plurality of charts.
2. The computer-readable storage medium of claim 1 wherein the single geometry image is a rectangle with adjustable dimensions.
3. The computer-readable storage medium of claim 2 wherein the packing comprises:
determining a scaling factor for the plurality of charts;
selecting dimensions for the single geometry image; and
determining placement for each of the plurality of charts in the single geometry image.
4. The computer-readable storage medium of claim 1 wherein defined samples for the plurality of charts packed in the single geometry image are separated by undefined samples.
5. The computer-readable storage medium of claim 1 wherein the method further comprises:
repeating the growing and the updating until the seeds converge.
6. The computer-readable storage medium of claim 1 wherein the method further comprises:
adding a last face assigned during a chart growth phase as a new seed.
7. The computer-readable storage medium of claim 1 wherein updating the seeds comprises:
updating a seed to be a most interior face within a chart.
8. The computer-readable storage medium of claim 1 wherein the mesh represents a real object.
9. The computer-readable storage medium of claim 1 wherein the partitioning comprises considering a chart normal.
10. A method comprising:
partitioning, by a computer, a three-dimensional mesh object model into a plurality of charts with geometrically natural boundaries; and
packing, by the computer, the plurality of charts into a single geometry image as irregular polygons having arbitrary shapes based on the geometrically natural boundaries;
wherein the partitioning comprises:
(a) growing the plurality of charts from seeds by assigning mesh faces on the three-dimensional mesh object model to one of the plurality of charts wherein the growing comprises, for a graph with edges connecting pairs of adjacent mesh faces of the three-dimensional mesh object model, assigning an edge cost between a face F on a chart C and an adjacent face F\u2032 that is a candidate to join the chart C as a geometric distance between face F and the adjacent face F\u2032 and a difference in normal between F\u2032 and a normal of the chart C;
(b) updating the seeds for the plurality of charts; and
(c) repeating (a) and (b) until the seeds converge or cycle.
11. The method of claim 10 wherein the three-dimensional mesh object model represents a physical object.
12. A computing device comprising:
a processor;
memory storing computer-executable instructions comprising:
instructions configured to partition a three-dimensional mesh object model into a plurality of charts with geometrically natural boundaries; and
instructions configured to pack the plurality of charts into a single geometry image as irregular polygons having arbitrary shapes based on the geometrically natural boundaries;
wherein the instructions configured to partition comprise instructions configured to iteratively:
grow the plurality of charts from seeds by assigning mesh faces on the three-dimensional mesh object model to one of the plurality of charts; and
update the seeds for the plurality of charts.
13. The computing device of claim 12 wherein the instructions configured to partition further comprise instructions to, for a graph with edges connecting pairs of adjacent mesh faces of the three-dimensional mesh object model, assigning an edge cost between a face F on a chart C and an adjacent face F\u2032 that is a candidate to join the chart C as a geometric distance between the face F and the adjacent face F\u2032 and a difference in normal between F\u2032 and a normal of the chart C.
14. A method of transforming a three-dimensional mesh object model into a two-dimensional geometry image representing the three-dimensional mesh object model, the method comprising:
partitioning, by a computing device, the three-dimensional mesh object model into a plurality of charts with irregular boundaries, wherein the partitioning comprises (a)-(d):
(a) for a graph with edges connecting pairs of adjacent mesh faces of the three-dimensional mesh object model, assigning an edge cost between a face F on a chart C and an adjacent face F\u2032 that is a candidate to join the chart C as a geometric distance between the face F and the adjacent face F\u2032 and a difference in normal between F\u2032 and a normal of the chart C;
(b) growing the plurality of charts from seeds for respective of the charts, wherein the growing comprises searching the graph according to edge cost; and
(c) recomputing the seeds; and
(d) repeating (a)-(c) until the seeds converge or cycle; and
packing the plurality of charts with irregular boundaries into the two-dimensional geometry image as irregular polygons.
15. The method of claim 14 wherein the three-dimensional mesh object model models a physical object.
16. The method of claim 14 wherein the three-dimensional mesh object model models a virtual object.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method of operating a substrate processing device comprising a substrate support tray, a substrate transfer chamber for storing said substrate support tray, a substrate processing chamber for implementing processing on a substrate supported by said substrate support tray, and a plurality of load lock chambers for performing carry-in and carry-out of the substrate between an ambient atmosphere and a vacuum atmosphere, in which said substrate support tray is moved between said substrate processing chamber and said load lock chamber via said substrate transfer chamber,
said method being characterized in that when a defect occurs in a part of said substrate processing device, said substrate support tray continues to be moved between said chambers using the remaining part which operates normally.
2. The method of operating a substrate processing device according to claim 1, characterized in that a plurality of load lock chambers is provided such that when a defect occurs in a part of the load lock chambers, said substrate support tray continues to be moved using the remaining normal load lock chambers.
3. The method of operating a substrate processing device according to claim 1, characterized in that a plurality of substrate processing chambers is provided such that when a defect occurs in a part of the substrate processing chambers, said substrate support tray continues to be moved using the remaining normal substrate processing chambers.
4. The method of operating a substrate processing device according to claim 1, characterized in that a plurality of substrate processing means is provided in the substrate processing chamber such that when a defect occurs in a part of the substrate processing means, the remaining normal substrate processing means are used, and only substrates corresponding to said remaining normal substrate processing means are supported on said substrate support tray.
5. A method of operating a substrate processing device comprising a substrate support tray, a substrate transfer chamber provided with a horizontal movement mechanism for moving said substrate support tray horizontally, a substrate processing chamber for implementing processing on a substrate supported by said substrate support tray, and a load lock chamber for performing carry-in and carry-out of the substrate between an ambient atmosphere and a vacuum atmosphere, in which the substrate support tray to be moved between said chambers and the destination chamber thereof are selected using said horizontal movement mechanism when said substrate support tray is to be moved between said substrate processing chamber and said load lock chamber,
said method being characterized in that when a defect occurs in a part of said substrate processing device, said substrate support tray continues to be moved between said chambers using the remaining part which operates normally.
6. A method of operating a substrate processing device comprising a substrate support tray, a substrate transfer chamber provided with a horizontal movement mechanism for moving said substrate support tray horizontally and a rotary mechanism for rotating said substrate support tray about a perpendicular axis to a horizontal movement surface of said horizontal movement mechanism, a substrate processing chamber for implementing predetermined processing on a substrate supported by said substrate support tray, and a load lock chamber for performing carry-in and carry-out of the substrate between an ambient atmosphere and a vacuum atmosphere, in which the substrate support tray to be moved between said chambers and the destination chamber thereof are selected using one or both of said horizontal movement mechanism and said rotary mechanism when said substrate support tray is to be moved between said substrate processing chamber and said load lock chamber,
said method being characterized in that when a defect occurs in a part of said substrate processing device, said substrate support tray continues to be moved between said chambers using the remaining part which operates normally.
7. The method of operating a substrate processing device according to claim 5 or 6, characterized in that a plurality of load lock chambers is provided such that when a defect occurs in a part of the load lock chambers, said substrate support tray continues to be moved using the remaining normal load lock chambers.
8. The method of operating a substrate processing device according to claim 5 or 6, characterized in that a plurality of substrate processing chambers is provided such that when a defect occurs in a part of the substrate processing chambers, said substrate support tray continues to be moved using the remaining normal substrate processing chambers.
9. The method of operating a substrate processing device according to claim 5 or 6, characterized in that a plurality of substrate processing means is provided in the substrate processing chamber such that when a defect occurs in a part of the substrate processing means, the remaining normal substrate processing means are used, and only substrates corresponding to said remaining normal substrate processing means are supported on said substrate support tray.
10. The method of operating a substrate processing device according to any one of claims 1, 5, and 6, characterized in that first and second substrate support tray storage means are arranged side by side in said substrate transfer chamber, and said plurality of load lock chambers is divided into first and second load lock chambers, such that if a defect occurs in said first load lock chamber when all of said substrate support trays stored in said first substrate support tray storage means are able to move to a position enabling movement to said first load lock chamber but are unable to move to a position enabling movement to said second load lock chamber, and all of said substrate support trays stored in said second substrate support tray storage means are able to move to a position enabling movement to said second load lock chamber but are unable to move to a position enabling movement to said first load lock chamber,
said second load lock chamber and said second substrate support tray storage means are used without using said first substrate support tray storage means.
11. The method of operating a substrate processing device according to any one of claims 1, 5, and 6, characterized in that first and second substrate support tray storage means are arranged side by side in said substrate transfer chamber, such that if a defect occurs in each of said first substrate support tray storage means in said substrate transfer chamber when all of said substrate support trays stored in said first substrate support tray storage means are able to move to a position enabling movement to said first load lock chamber but are unable to move to a position enabling movement to said second load lock chamber, and all of said substrate support trays stored in said second substrate support tray storage means are able to move to a position enabling movement to said second load lock chamber but are unable to move to a position enabling movement to said first load lock chamber,
said second load lock chamber and said second substrate support tray storage means are used without using said first load lock chamber.
12. The method of operating a substrate processing device according to any one of claims 1, 5, and 6, characterized in that two substrates are supported on said substrate support tray simultaneously.
13. The method of operating a substrate processing device according to any one of claims 1, 5, and 6, characterized in that said substrate transfer chamber comprises temperature adjusting means for adjusting the temperature of said carried-in substrates that are supported by said substrate support tray such that when a defect occurs in at least one of said temperature adjusting means, the remaining normal temperature adjusting means are used.
14. The method of operating a substrate processing device according to any one of claims 1, 5, and 6, characterized in that said substrate transfer chamber comprises heating means for heating said carried-in substrates that are supported by said substrate support tray such that when a defect occurs in at least one of said heating means, the remaining normal heating means are used.
15. The method of operating a substrate processing device according to any one of claims 1, 5, and 6, characterized in that said substrate transfer chamber comprises cooling means for cooling said carried-in substrates that are supported by said substrate support tray such that when a defect occurs in at least one of said cooling means, the remaining normal cooling means are used.