1. A method for forming a pattern in a first coating comprising the following steps:
forming, on a first and more particularly an anti-reflective coating, covered with at least a photoresist-based masking block resting on said first coating, a protective coating covering the first coating and said masking block,
plasma deposition of the zones of the first coating located on the periphery of said masking block, using at least one dopant species, with the dopant species being selected so that the doped zones are liable to be selectively etched relative to the rest of the first coating and relative to the masking block, with the deposition, more particularly the energy, the duration and the deposition dose thereof, as well as the protective coating, more particularly the thickness thereof, being provided so that said doped zones located on the periphery of said masking block and a region without deposition of the first coating located under the masking block have a boundary directly above or extending from the side face(s) of said masking block,
selective etching of the doped zones of the first coating relative to the not doped zones of the first coating and to the masking block.
2. A method for forming a pattern according to claim 1, wherein said first coating is a Si-based coating.
3. A method for forming a pattern according to claim 1, wherein said first coating is a SiARC anti-reflective coating.
4. A method for forming a pattern according to claim 1, wherein said dopant species is hydrogen-based.
5. A method for forming a pattern according to claim 1, wherein the deposition is performed with a deposition energy ranging from 100 eV to 600 eV.
6. A method for forming a pattern according to claim 1, wherein said protective coating has a thickness ranging from 1 nanometre to 3 nanometres.
7. A method for forming a pattern according to claim 1, wherein said masking block has a critical dimension (dc) ranging from 10 nm to 200 nm.
8. A method for forming a pattern according to claim 1, wherein said selective etching is performed using HF.
9. A method for forming a pattern according to claim 1, wherein said masking block is positioned in contact with the first coating.
10. A method for forming a pattern according to claim 1, wherein the deposition is performed so that the doped zones extend on a depth smaller than the thickness of the first coating.
11. A method for forming a pattern according to claim 1, comprising a plurality of cycles, each comprising said step of forming the protective coating, said step of deposition and said step of selectively etching the doped zones of the first coating relative to the not doped zones of the first coating and to the masking block.
12. A method for forming a pattern according to claim 1, wherein said deposition is performed so that the doped zones extend on a depth greater than or equal to the thickness of the first coating, and wherein said etching consumes the whole thickness of the first coating.
13. A method for forming a pattern according to claim 1, wherein the first coating rests on a second coating, with the method further comprising, after said selective etching of the doped zones of the first coating, etching of the second coating through the first coating.
14. A method for forming a pattern according to claim 1, wherein forming the protective coating, said deposition and said etching are performed in the same plasma reactor.
15. A method for forming a pattern in a first coating comprising the following steps:
forming, on a first anti-reflective coating, covered with at least a photoresist-based masking block resting on said first coating, with a protective coating covering the first coating and said masking block,
deposition of zones of the first coating located on the periphery of said masking block, using at least one dopant species, with the dopant species being selected so that the doped zones are liable to be selectively etched relative to the rest of the first coating and relative to the masking block, the deposition, more particularly the energy, the duration and the deposition dose thereof, as well as the protective coating, more particularly the thickness thereof, being provided so that said doped zones located on the periphery of said masking block and a region without deposition of the first coating located under the masking block have a boundary directly above or extending from the side face(s) of said masking block,
selective etching of the doped zones of the first coating relative to the not doped zones of the first coating and to the masking block.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1-40. (canceled)
41. An assembly comprising:
an endoscope; and
a device including:
a plurality of instruments configured to be moveably coupled to opposing outer sides of the endoscope, each of the instruments configured to be selectively moved longitudinally to extend beyond a distal tip of the endoscope, each of the instruments having a deflectable distal end configured to accommodate an end effector;
a feature on an external surface of the endoscope configured to stop movement of at least one of the plurality of instruments along a longitudinal axis of the endoscope; and
an actuation device attached to a proximal end of each of the instruments, each actuation device being configured to independently deflect a respective one of the instruments inward toward the endoscope.
42. The assembly of claim 41, wherein the plurality of instruments includes two instruments spaced 180\xb0 apart from one another about the longitudinal axis of the endoscope.
43. The assembly of claim 41, wherein the each of the plurality of instruments are configured for triangulation.
44. The assembly of claim 41, wherein the actuation device attached to each of the instruments includes a pull wire.
45. The assembly of claim 41, wherein each instrument includes a longitudinally extending flex section.
46. The assembly of claim 45, wherein each flex section includes one or more of a union joint, a gear, a linkage, a portion of lower stiffness, or a smart material.
47. The assembly of claim 41, further including a guiding member configured to couple each of the plurality of instruments to the endoscope.
48. The assembly of claim 47, wherein the guiding member includes a plurality of rings.
49. The assembly of claim 48, wherein the plurality of rings includes at least one ring configured to fit around one of the instruments and a second ring configured to fit around the endoscope.
50. The assembly of claim 48, wherein the guiding member includes a hinge configured to permit one or more rings to open.
51. The assembly of claim 50, wherein the hinge is a living hinge.
52. A device for use with an endoscope comprising:
a plurality of instruments configured to be moveably coupled to opposing outer sides of the endoscope, each of the instruments configured to be selectively moved longitudinally to extend beyond a distal tip of the endoscope, each of the instruments having a deflectable distal end configured to accommodate an end effector;
an actuation device attached to a proximal end of each of the instruments, each actuation device being configured to independently deflect at least one of the instruments inward toward the endoscope; and
a guiding member including a plurality of rings and configured to couple each of the plurality of instruments to the endoscope.
53. The device of claim 52, wherein the plurality of rings includes at least one ring configured to fit around one of the instruments and a second ring configured to fit around the endoscope.
54. The device of claim 52, wherein the guiding member includes a hinge configured permit one or more rings to open.
55. The device of claim 54, wherein the hinge is a living hinge.
56. The device of claim 52, wherein the plurality of instruments includes two instruments spaced 180\xb0 apart from one another about a central longitudinal axis of the endoscope.
57. The device of claim 52, wherein the instruments are configured for triangulation.
58. An assembly comprising:
an endoscope; and
a device including:
a plurality of instruments configured to be moveably coupled to opposing outer sides of the endoscope, each of the instruments configured to be selectively moved longitudinally to extend beyond a distal tip of the endoscope, each of the instruments having a deflectable distal end configured to accommodate an end effector;
a feature on an external surface of the endoscope configured to stop movement of at least one of the instruments along a longitudinal axis of the endoscope; and
an actuation device attached to a proximal end of each of the instruments, each actuation device being configured to independently deflect a respective one of the plurality of instruments inward toward the endoscope; and
a guiding member configured to interact with the feature, the guiding member including a plurality of rings and configured to couple each of the instruments to the endoscope.
59. The assembly of claim 58, wherein the guiding member includes a hinge configured to permit at least one of the rings to open.
60. The assembly of claim 59, wherein the hinge is a living hinge.