1. A plug of a grid-side power cable assembly connected to a cable installment type charging control device for charging an electric vehicle (EV) by using power of a grid-side, the plug comprising:
an exclusive socket detecting part for detecting whether a socket connected to the plug is an exclusive socket for the plug;
a normal operation signal generating part for generating a signal notifying whether the exclusive socket is detected; and
a voltage dividing part for outputting a voltage so that an output voltage in a case in which the grid-side power cable assembly is short-circuited is different from that of the grid-side power cable assembly in a case in which the signal is generated.
2. The plug according to claim 1, further comprising a plug temperature measuring part for measuring a temperature of the plug,
wherein, when the grid-side power cable assembly is short-circuited, the plug temperature measuring part and the grid-side power cable assembly are short-circuited.
3. The plug according to claim 2, wherein the plug temperature measuring part comprises a thermistor resistor.
4. The plug according to claim 1, wherein the normal operation signal generating part comprises a switch having one end that is grounded and turned-on on the basis of whether the exclusive socket is detected, and
the voltage dividing part comprises a resistor connected to the other end of the switch.
5. The plug according to claim 1, wherein the exclusive socket detecting part comprises a magnetic sensor for detecting magnetic fields to detect the exclusive socket on the basis of the detected magnetic fields.
6. The plug according to claim 5, wherein the exclusive socket detecting part detects the exclusive socket on the basis of polarity and intensity of the magnetic fields.
7. A method of operating a plug of a grid-side power cable assembly connected to a cable installment type charging control device for charging an electric vehicle (EV) by using power of a grid-side, the method comprising:
detecting whether a socket connected to the plug is an exclusive socket for the plug;
generating a normal operation signal notifying whether the exclusive socket is detected; and
outputting a voltage so that an output voltage in a case in which the grid-side power cable assembly is short-circuited is different from that of the grid-side power cable assembly in a case in which the signal is generated.
8. The method according to claim 7, further comprising measuring a temperature of the plug through a plug temperature measuring part,
wherein, when the grid-side power cable assembly is short-circuited, the plug temperature measuring part and the grid-side power cable assembly are short-circuited.
9. The method according to claim 8, wherein the plug temperature measuring part comprises a thermistor resistor.
10. The method according to claim 7, wherein the detecting of whether the socket connected to the plug is the exclusive socket for the plug comprises detecting the exclusive socket on the basis of magnetic fields detected by using a magnetic sensor for detecting the magnetic fields.
11. The method according to claim 10, wherein the detecting of the exclusive socket on the basis of the detected magnetic fields comprises detecting the exclusive socket on the basis of polarity and intensity of the magnetic fields.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A curing light comprising:
a wand adapted to be grasped by a human hand for use in positioning and manipulating the curing light,
an elongate heat sink with a proximal end and a distal end, said proximal end being proximate said wand, said elongate heat sink having a longitudinal axis,
a mounting platform located at said elongate heat sink distal end, said mounting platform being adapted to have a LED chip module,
an LED chip module mounted on said mounting platform, said LED chip module including
a primary heat sink, said primary heat sink having a smaller mass than said elongate heat sink,
a well on said primary heat sink for mounting an LED chip,
an LED chip mounted in said well,
a cover that provides protective covering for said LED chip and which permits light emitted by said LED chip to pass through it to provide usable light exiting from said light module, and
a thermoelectric cooler located on said elongate heat sink, said thermoelectric cooler serving to assist in heat dissipation.
2. A curing light as recited in claim 1 wherein light emitted by said LED chip module is emitted at an angle of from about 30 degrees to about 150 degrees to said elongate heat sink longitudinal axis.
3. A curing light as recited in claim 1 wherein light emitted by said LED chip module is emitted at an angle of about 90 degrees to said elongate heat sink longitudinal axis.
4. A curing light as recited in claim 1 further comprising at least one air vent on said wand.
5. A curing light as recited in claim 1 further comprising a plurality of insulators to insulate said elongate heat sink from said wand.
6. A curing light as recited in claim 1 wherein said wand has a housing and said elongate heat sink is located at least partially within said housing.
7. A curing light as recited in claim 6 further comprising an air space between said elongate heat sink and said wand.
8. A curing light comprising:
a wand adapted to be grasped by a human hand for use in positioning and manipulating the curing light,
an elongate heat sink with a proximal end and a distal end, said proximal end being proximate said wand, said elongate heat sink having a longitudinal axis,
a primary heat sink,
said primary heat sink having a smaller mass than said elongate heat sink,
said primary heat sink being attached to said elongate heat sink,
at least one semiconductor device capable of emitting light useful in curing composite materials directly mounted to said primary heat sink,
a cover that provides protective covering for said chip and which permits light emitted by said chip to pass through it to provide usable light exiting from the cover, and
a thermoelectric cooler located on said elongate heat sink, said thermoelectric cooler serving to assist in heat dissipation.
9. A curing light as recited in claim 8 wherein light emitted by said chip is emitted at an angle of from about 30 degrees to about 150 degrees to said elongate heat sink longitudinal axis.
10. A curing light as recited in claim 8 wherein light emitted by said LED chip module is emitted at an angle of about 90 degrees to said elongate heat sink longitudinal axis.
11. A curing light as recited in claim 8 further comprising a plurality of insulators to insulate said elongate heat sink from said wand.
11. A curing light as recited in claim 8 wherein said wand has a housing and said elongate heat sink is located at least partially within said housing.
12. A curing light as recited in claim 11 further comprising an air space between said elongate heat sink and said wand.
13. A curing light as recited in claim 12 further comprising at least one air vent on said wand.
14. A curing light as recited in claim 8 wherein said chip is selected from the group consisting of light emitting diode chips, laser chips, light emitting diode chip array, diode laser chips, diode laser chip array, surface emitting laser chips, edge emitting laser chips, and VCSEL chips.
15. A curing light as recited in claim 8 wherein said cover is selected from the group consisting of windows and focus lenses.
16. A curing light comprising:
a wand adapted to be grasped by a human hand for use in positioning and manipulating the curing light,
a wand housing that forms at least a portion of the outer surface of said wand,
controls located on said wand housing for controlling initiation and termination of light emission from the curing light,
a heat sink, said heat sink serving to assist in heat dissipation, and said heat sink located in said wand housing,
a plurality of insulators useful for insulating said heat sink from said housing,
air space between said heat sink and said housing,
at least one vent located on said housing,
at least one semiconductor device capable of emitting light useful in curing composite materials, and
a thermoelectric cooler in physical contact with said heat sink, said thermoelectric cooler serving to assist in heat dissipation;
wherein light emitted by said chip is emitted at an angle of from about 30 degrees to about 150 degrees to said elongate heat sink longitudinal axis; and
wherein said chip is selected from the group consisting of light emitting diode chips, laser chips, light emitting diode chip array, diode laser chips, diode laser chip array, surface emitting laser chips, edge emitting laser chips, and VCSEL chips.