1. A structure of mounting an electronic part on a circuit board, wherein
bumps of said electronic part are respectively flip-chip-bonded to electrodes of said circuit board by applying ultrasonic vibrations to the electronic part,
said electronic part further includes positioning bumps, whose diameters are larger than those of the bumps and whose projecting lengths are longer than those of the bumps,
said circuit board further includes pads, on which the positioning bumps of said electronic part are respectively bonded, and
an array direction of the positioning bumps is perpendicular to a direction of the ultrasonic vibrations.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A laminate which comprises
a base layer and
a layer comprising: (A) 10-95% by weight of an ethylene-based terpolymer of ethylene, propylene, and either 1-hexene or 1-octene, which has the following properties (a-1) to (a-4); and (B) 5-90% by weight of a low-density polyethylene obtained by the high-pressure radical polymerization method, which has the following properties (b-1) to (b-3):
(a-1) a melt flow rate is 0.1-100 g10 min;
(a-2) a density is 0.87-0.92 gcm3;
(a-3) an ethylene content is 80-99% by mole;
(a-4) a ratio of the molar proportion of propylene (Mp) to the molar proportion of 1-hexene or 1-octene (Mh), MpMh, is 1.5or higher;
(b-1) a melt flow rate is 0.1-20 g10min;
(b-2) a density is 0.915-0.93 gcm3; and
(b-3) a memory effect is 1.6 or higher.
2. The laminate of claim 1, wherein the low-density polyethylene (B) is long-chain branched low-density polyethylene.
3. The laminate of claim 1 or 2, wherein the ethylene-based terpolymer (A) is produced with a metallocene catalyst.
4. The laminate of claim 1 or 2, wherein the ethylene-based terpolymer (A) further has the following property (a-5):
(a-5) a density (d) (gcm3) and a melting point (Tm) (\xb0 C.) satisfy expression (1):
1220\xd7d\u22121019\u2266Tm\u22661220\xd7d\u22121005\u2003\u2003(1)
wherein the melting point (Tm) is a melting point as measured during second scanning with a DSC, and the melting point corresponds to the maximum peak height.
5. The laminate of claim 1 or 2, wherein the layer comprising the ethylene-based terpolymer (A) and the low-density polyethylene (B) is a layer formed by the extrusion coating method.
6. The laminate of claim 1 or 2, which is an easy-to-tear laminate.
7. The laminate of claim 1, wherein the base layer is a single-layer film made of at least one material selected from the group consisting of a nylon, polyester, polypropylene, polyethylene, and a ethylenevinyl alcohol copolymer.
8. The laminate of claim 1, wherein the base layer is a multilayer film, each layer is made of at least one material selected from the group consisting of a nylon, polyester, polypropylene, polyethylene, and a ethylenevinyl alcohol copolymer, and the each layer can be made form the same or different material.
9. The laminate of claim 1, wherein the base layer further comprises single-layer bases or multilayer bases made of at least one material selected from the group consisting of a paper, a foil of a metal, and plastic films coated with a metal or an inorganic or organic substance by vapor deposition.
10. The laminate of claim 9, wherein the content of the low density polyethylene is from 10 to 80 wt. %.