1. A method comprising:
preparing a package substrate, the package substrate comprising:
a substrate with a slot that is selectively formed in the substrate to penetrate therethrough, the substrate thereby including a first edge defining a first side of the slot, the substrate further including a first bonding finger formation area in an end section of the first edge and a second bonding finger formation area in a central section of the first edge that is adjacent to the end section;
a first bonding finger array, wherein the first bonding finger formation area consists of the first bonding finger array that consists of a first line in which a plurality of first bonding fingers are arranged in line along the end section of the first edge at a first distance from the end section of the first edge; and
a second bonding finger array, wherein the second bonding finger formation area comprises the second bonding finger array, the second bonding finger array including a second line in which a plurality of second bonding fingers are arranged in line along the central section of the first edge at a second distance from the central section of the first edge, the second distance being greater than the first distance;
mounting a semiconductor chip, that comprises a plurality of die pads, on the package substrate such that the die pads are exposed by the slot of the substrate; and
connecting a plurality of bonding wires such that the die pads of the semiconductor chip are connected to the first and second bonding fingers, respectively, through the slot of the substrate.
2. The method as claimed in claim 1, wherein the second bonding finger array consists of the second line in which the second bonding fingers are arranged in line along the central section of the first edge at the second distance from the central section of the first edge.
3. The method as claimed in claim 1,
wherein the second bonding finger array further includes a third line in which a plurality of third bonding fingers are arranged in line along the central section of the first edge at the first distance from the central section of the first edge;
wherein the semiconductor chip further comprises a plurality of additional die pads that are exposed by the slot of the substrate; and
wherein the method further comprises connecting a plurality of additional bonding wires such that the additional die pads of the semiconductor chip are connected to the third bonding fingers, respectively, through the slot of the substrate.
4. The method as claimed in claim 3, wherein the second and third bonding fingers are arranged to stagger.
5. The method as claimed in claim 1, wherein the first boding fingers are arranged in line substantially at a first pitch and the second boding fingers are arranged in line substantially at a second pitch, the first pitch being substantially equal to the second pitch.
6. The method as claimed in claim 5, wherein an end one of the first boding fingers is disposed at a third pitch with respect an end one of the second bonding fingers, the third pitch is smaller than each of the first and second pitches.
7. The method as claimed in claim 1,
wherein the substrate further includes a third bonding finger formation area corresponding to a third portion of the first edge that is adjacent to the central section so that the second boding finger formation area is between the first and third bonding finger formation areas;
wherein the package substrate further comprises a third bonding finger array formed in the third bonding finger formation area, the third bonding finger array consisting of a third line in which a plurality of third bonding fingers are arranged in line along the third portion of the first edge at the first distance from the third portion of the first edge; and
wherein the semiconductor chip further comprises a plurality of first additional die pads that are exposed by the slot of the substrate; and
wherein the method further comprises connecting a plurality of additional bonding wires such that the first additional die pads of the semiconductor chip are connected to the third bonding fingers, respectively, through the slot of the substrate.
8. The method as claimed in claim 7, wherein the second bonding finger array consists of the second line in which the second bonding fingers are arranged in line along the central section of the first edge at the second distance from the central section of the first edge.
9. The method as claimed in claim 7,
wherein the second bonding finger array further includes a fourth line in which a plurality of fourth bonding fingers are arranged in line along the central section of the first edge at the first distance from the central section of the first edge;
wherein the semiconductor chip further comprises a plurality of second additional die pads that are exposed by the slot of the substrate; and
wherein the method further comprises connecting a plurality of second additional bonding wires such that the second additional die pads of the semiconductor chip are connected to the fourth bonding fingers, respectively, through the slot of the substrate.
10. The method as claimed in claim 9, wherein the second and fourth bonding fingers are arranged to stagger.
11. The method as claimed in claim 1,
wherein the substrate further includes a second edge defining a second side of the slot opposite to the first side, a third bonding finger formation area corresponding to a third portion of the second edge, and a fourth bonding finger formation area corresponding to a fourth portion of the second edge that is adjacent to the third portion;
wherein the package substrate further comprises:
a third bonding finger array formed in the third bonding finger formation area, the third bonding finger array consisting of a third line in which a plurality of third bonding fingers are arranged in line along the third portion of the second edge at the first distance from the third portion of the second edge, and
a fourth bonding finger array formed in the fourth bonding finger formation area, the fourth bonding finger array including a fourth line in which a plurality of fourth bonding fingers are arranged in line along the fourth portion of the second edge at the second distance from the fourth portion of the second edge;
wherein the semiconductor chip further comprises a plurality of first and second additional die pads that are exposed by the slot of the substrate; and
wherein the method further comprises connecting a plurality of first and second additional bonding wires, the first additional bonding wires connecting the first additional die pads to the third bonding fingers, respectively, through the slot of the substrate, and the second additional boding wires connecting the second additional die pads to the fourth bonding fingers, respectively, through the slot of the substrate.
12. The method as claimed in claim 11, wherein the second bonding finger array consists of the second line in which the second bonding fingers are arranged in line along the central section of the first edge at the second distance from the central section of the first edge, and the fourth bonding finger array consists of the fourth line in which the fourth bonding fingers are arranged in line along the fourth portion of the second edge at the second distance from the fourth portion of the second edge.
13. The method as claimed in claim 12,
wherein the substrate further includes:
a fifth bonding finger formation area corresponding to a fifth portion of the first edge that is adjacent to the central section so that the second boding finger formation area is between the first and fifth bonding finger formation areas; and
a sixth bonding finger formation area corresponding to a sixth portion of the second edge that is adjacent to the fourth portion so that the fourth boding finger formation area is between the third and sixth bonding finger formation areas
wherein the package substrate further comprises:
a fifth bonding finger array formed in the fifth bonding finger formation area, the fifth bonding finger array consisting of a fifth line in which a plurality of fifth bonding fingers are arranged in line along the fifth portion of the first edge at the first distance from the fifth portion of the first edge; and
a sixth bonding finger array formed in the sixth bonding finger formation area, the sixth bonding finger array consisting of a sixth line in which a plurality of sixth bonding fingers are arranged in line along the sixth portion of the second edge at the first distance from the sixth portion of the second edge;
wherein the semiconductor chip further comprises a plurality of third and fourth additional die pads that are exposed by the slot of the substrate; and
wherein the method further comprises connecting a plurality of third and fourth additional bonding wires, the third additional bonding wires connecting the third additional die pads to the fifth bonding fingers, respectively, through the slot of the substrate, and the fourth additional boding wires connecting the fourth additional die pads to the sixth bonding fingers, respectively, through the slot of the substrate.
14. The method as claimed in claim 11,
wherein the second bonding finger array further includes a fifth line in which a plurality of fifth bonding fingers are arranged in line along the central section of the first edge at the first distance from the central section of the first edge;
wherein the fourth bonding finger array further includes a sixth line in which a plurality of sixth bonding fingers are arranged in line along the fourth portion of the second edge at the second distance from the fourth portion of the second edge;
wherein the semiconductor chip further comprises a plurality of third and fourth additional die pads that are exposed by the slot of the substrate; and
wherein the method further comprises connecting a plurality of third and fourth additional bonding wires, the third additional bonding wires connecting the third additional die pads to the fifth bonding fingers, respectively, through the slot of the substrate, and the fourth additional boding wires connecting the fourth additional die pads to the sixth bonding fingers, respectively, through the slot of the substrate.
15. The method as claimed in claim 14, wherein the second and fifth bonding fingers are arranged to stagger, and the fourth and sixth bonding fingers are arranged to stagger.
16. The method as claimed in claim 14,
wherein the substrate further includes:
a fifth bonding finger formation area corresponding to a fifth portion of the first edge that is adjacent to the central section so that the second boding finger formation area is between the first and fifth bonding finger formation areas; and
a sixth bonding finger formation area corresponding to a sixth portion of the second edge that is adjacent to the fourth portion so that the fourth boding finger formation area is between the third and sixth bonding finger formation areas
wherein the package substrate further comprises:
a seventh bonding finger array formed in the fifth bonding finger formation area, the seventh bonding finger array consisting of a seventh line in which a plurality of seventh bonding fingers are arranged in line along the fifth portion of the first edge at the first distance from the fifth portion of the first edge; and
an eighth bonding finger array formed in the sixth bonding finger formation area, the eighth bonding finger array consisting of an eighth line in which a plurality of eighth bonding fingers are arranged in line along the sixth portion of the second edge at the first distance from the sixth portion of the second edge;
wherein the semiconductor chip further comprises a plurality of fifth and sixth additional die pads that are exposed by the slot of the substrate; and
wherein the method further comprises connecting a plurality of fifth and sixth additional bonding wires, the fifth additional bonding wires connecting the fifth additional die pads to the seventh bonding fingers, respectively, through the slot of the substrate, and the sixth additional boding wires connecting the sixth additional die pads to the eighth bonding fingers, respectively, through the slot of the substrate.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A vise for holding a work piece in position on the worktable of an EDM machine so that the discharge wire of the EDM machine can be located adjacent the work piece and moved to the work position for machining the work piece, the vise comprising:
a main plate for attachment to the worktable of the EDM machine;
an intermediate support member mounted on the main plate and parallel therewith, the intermediate support member having a lower surface and an opposite upper surface for supporting the work piece thereon;
a solid jaw mounted on the upper surface of the intermediate support member, and the solid jaw having opposed end portions that extend past the intermediate support member thus forming solid jaw undercuts that allow the solid jaw to be used as a reference point for the discharge wire in order to locate and move the discharge wire to the work position relative to the work piece;
a movable jaw mounted on the intermediate support member for reciprocable movement in the x direction toward the solid jaw for holding the work piece between the solid jaw and the movable jaw and away from the solid jaw to allow for the removal of the work piece, the movable jaw having opposed end portions that extend past the intermediate support member creating movable jaw undercuts that facilitate the locating of the discharge wire to the work position with respect to the work piece;
a clearance pocket formed between the movable jaw and the solid jaw into which the discharge wire can be moved for machining the work piece;
an alignment and stopping device attachable to the solid jaw for contacting the work piece and fixing the position of the work piece within the jaws in the y direction for obtaining repeatability of the positioning of the work piece in the y direction; and
the movable and solid jaw cooperating with the alignment and stopping device for obtaining repeatability of location for the work piece in the x and y directions and the undercuts of the movable jaw and the solid jaw allowing the discharge wire to use the solid jaw to establish a reference point by contacting the solid jaw and then moving the discharge wire to the work position adjacent the work piece.
2. The vise of claim 1 wherein the upper surface of the intermediate support member supports the work piece for machining by the discharge wire of the EDM machine.
3. The vise of claim 2 wherein the upper work surface of the intermediate support member is parallel with the main plate.
4. The vise of claim 3 further comprising a manually rotatable threaded screw attachable to the movable jaw and coaxial with the x direction of the main plate for slidably moving the movable jaw toward the solid jaw for gripping and holding the work piece and for slidably moving the movable jaw away from the solid jaw for releasing the work piece.
5. The vise of claim 4 wherein the threaded screw includes a hand graspable knob to facilitate the rotation of the screw and the slidable movement of the movable jaw.
6. The vise of claim 5 further comprising an intermediate support block mounted on the intermediate support member between the movable jaw and the knob and through which the threaded screw extends so that the threaded screw can be supported thereon.
7. The vise of claim 6 wherein the alignment and stopping device includes an adjustment rod extending through the alignment and stopping device linearly adjustable in the y direction between the movable and solid jaw and against which the work piece abuts for providing repeatability of locating of the work piece in the y direction and for preventing lateral movement of the work piece in the y direction.
8. The vise of claim 7 wherein the main plate is secured to the edge of the worktable of the EDM machine so that the jaws of the vise extend past the worktable to facilitate the positioning of the discharge wire between the jaws and adjacent the work piece.
9. The vise of claim 8 wherein the cooperation of the movable jaw, the solid jaw, the adjustment rod and the upper surface of the intermediate support member allows for the repeated removal and return of the work piece to the same exact position on the upper surface of the intermediate support member and between the solid and movable jaw.
10. A vise for holding a work piece on an EDM machine so that the discharge wire of the EDM machine can be repeatably positioned adjacent the work piece, the vise comprising:
a main plate for attachment to the worktable of the EDM machine;
an intermediate support member mounted on the main plate and parallel thereto, the intermediate support member having a lower surface and an opposite upper surface upon which the work piece is placed;
a solid jaw mounted on the upper surface of the intermediate support member and having opposed end portions that extend beyond the intermediate support member thus forming opposed solid jaw undercuts that allow the solid jaw to be used as a reference point for the discharge wire for moving of the discharge wire to the work position adjacent the work piece;
a movable jaw mounted on the upper surface of the intermediate support member for reciprocable movement in the x direction toward the solid jaw for holding the work piece between the solid jaw and the movable jaw and movable away from the solid jaw to allow for the removal of the work piece, the movable jaw having opposed end portions that extend past the intermediate support member forming undercuts that facilitate the locating of the discharge wire adjacent the work piece;
an alignment and stopping device attachable to the solid jaw for contacting the work piece and fixing the position of the work piece within the jaws in the y direction so that repeatability of positioning of the work piece in the y direction can be obtained; and
the movable and solid jaw cooperating with the alignment and stopping device so that repeatability of location for the work piece in the x and y directions can be attained and the undercuts of the movable jaw and the solid jaw allowing the discharge wire to use the solid jaw to establish a reference point by contacting the solid jaw and then moving the discharge wire to the work position adjacent the work piece.
11. The vise of claim 10 further comprising a clearance pocket formed between the movable jaw and the solid jaw and into which the discharge wire can be positioned for machining the work piece.
12. The vise of claim 11 wherein the upper surface of the intermediate support member supports the work piece for machining by the discharge wire of the EDM machine.
13. The vise of claim 12 wherein the upper surface of the intermediate support member is disposed parallel to the main plate.
14. The vise of claim 13 further comprising a manually rotatable threaded screw attachable to the movable jaw and coaxial with the x direction of the main plate for slidably moving the movable jaw toward the solid jaw so that the work piece can be gripped and held by the movable jaw and the slidable jaw and for moving the movable jaw away from the solid jaw to release the work piece.
15. The vise of claim 14 wherein the threaded screw includes a hand graspable knob to facilitate the rotation of the threaded screw and the slidable movement of the movable jaw upon the upper surface.
16. The vise of claim 15 further comprising an intermediate support block mounted on the upper surface of the intermediate support member and between the movable jaw and the knob and through which the threaded screw extends so that the screw thread can be supported thereon.
17. The vise of claim 16 wherein the alignment and stopping device includes an adjustment rod extending through the alignment and stopping device that is linearly adjustable in the y direction between the movable jaw and the solid jaw and against which the work piece abuts for providing repeatability of location for the work piece in the y direction and for preventing lateral movement of the work piece in the y direction.
18. The vise of claim 17 wherein the main plate is secured to the edge of the worktable of the EDM machine so that the jaws of the vise extend past the worktable to facilitate the positioning of the discharge wire between the jaws and adjacent the work piece.
19. The vise of claim 18 wherein the cooperation of the movable jaw, the solid jaw, the adjustment rod and the upper surface of the intermediate support member allows for the repeated removal and return of the work piece to the same exact position on the upper surface of the intermediate support member between the solid jaw and the movable jaw.
20. A vise for holding a work piece in position on an EDM machine, comprising:
a main plate for attachment to the worktable of the EDM machine;
an intermediate support member disposed on the main plate and parallel thereto, the intermediate support member having a lower surface and an opposite upper surface on which the work piece rests during machining;
a solid jaw mounted upon the upper surface of the intermediate support member and having opposed end portions that extend beyond the intermediate support member thereby forming opposed solid jaw undercuts that allow the discharge wire to use the solid jaw as a reference point for positioning the discharge wire adjacent to the work piece in the work position;
a movable jaw mounted upon the upper surface of the intermediate support member for reciprocable movement in the x direction toward the solid jaw for holding the work piece between the solid jaw and the movable jaw and movable away from the solid jaw to allow for the removal of the work piece, the movable jaw having opposed end portions that extend past the intermediate support member that forms undercuts to facilitate the positioning and movement of the discharge wire to the work position adjacent the work piece; and
the movable jaw and the solid jaw cooperating so that repeatability of location for the work piece can be attained and the undercuts of the movable jaw and the solid jaw permitting the discharge wire to use the solid jaw to establish a reference point by contacting the solid jaw and then moving the discharge wire to the work position adjacent the work piece.
21. The vise of claim 20 further comprising a clearance pocket formed between the movable jaw and the solid jaw and into which the discharge wire can be positioned for machining the work piece.
22. The vise of claim 21 further comprising an alignment and stopping device mountable to the solid jaw for abutting and fixing the position of the work piece within the jaws in the y direction for attaining the repeatability of positioning of the work piece in the y direction.
23. The vise of claim 22 wherein the upper surface of the intermediate support member is disposed parallel to the main plate.
24. The vise of claim 23 further comprising a manually rotatable threaded screw attachable to the movable jaw and coaxial with the x direction of the intermediate support member for slidably moving the movable jaw toward the solid jaw so that the work piece can be gripped and held by the movable jaw and the slidable jaw and for moving the slidable jaw away from the solid jaw for releasing the work piece from the jaws.
25. The vise of claim 24 wherein the threaded screw includes a hand graspable knob to facilitate the manual rotation of the threaded screw.
26. The vise of claim 25 further comprising an intermediate support block mounted on the upper surface of the intermediate support member and between the movable jaw and the knob and through which the threaded screw extends for supporting the longitudinal extension of the threaded screw.
27. The vise of claim 26 wherein the alignment and stopping device includes an adjustment rod extending through the alignment and stopping device and linearly adjustable in the y direction between the movable jaw and the solid jaw and against which the work piece abuts thereby providing for repeatability of location for the work piece in the y direction and for preventing lateral movement of the work piece on the upper surface of the intermediate support member.
28. The vise of claim 27 wherein the main plate is secured to the edge of the worktable of the EDM machine so that the jaws of the vise extend past the worktable to facilitate the positioning of the discharge wire between the jaws and adjacent the work piece.
29. The vise of claim 28 wherein the cooperation of the movable jaw, the solid jaw, the adjustment rod and the upper surface of the intermediate support member allows for the repeated removal and return of the work piece on the upper surface to the same exact location.